Protec MEMS Technology (PMT) is a MEMS specialist company established in 2004, dedicated to the development and mass production of next-generation semiconductor probe cards based on MEMS technology. The company provides memory and non-memory semiconductor test solutions, demonstrating technological capabilities to address advanced semiconductor markets such as RF, high-speed interfaces, HBM, and AI. It operates as a small and medium-sized enterprise primarily focused on the manufacturing and sale of semiconductor inspection equipment.ProtecMEMSTechnology(PMT)isaMEMSspecialistcompanyestablishedin2004,dedicatedtothedevelopmentandmassproductionofnext-generationsemiconductorprobecardsbasedonMEMStechnology.Thecompanyprovidesmemoryandnon-memorysemiconductortestsolutions,demonstratingtechnologicalcapabilitiestoaddressadvancedsemiconductormarketssuchasRF,high-speedinterfaces,HBM,andAI.Itoperatesasasmallandmedium-sizedenterpriseprimarilyfocusedonthemanufacturingandsaleofsemiconductorinspectionequipment.
Key Products/TechnologiesKeyProducts/Technologies
Key product categories include Memory Probe Card and Non-Memory Probe Card.KeyproductcategoriesincludeMemoryProbeCardandNon-MemoryProbeCard.
In the MEMS Application sector, the company offers technologies related to FGBA Chipset, Application Processor, and 3D Modeling.IntheMEMSApplicationsector,thecompanyofferstechnologiesrelatedtoFGBAChipset,ApplicationProcessor,and3DModeling.
Development and supply of MEMS Socket solutions for IoT (M2M) application models.DevelopmentandsupplyofMEMSSocketsolutionsforIoT(M2M)applicationmodels.
Core capability in manufacturing 2D and 3D MEMS probe cards based on proprietary MEMS process technology.Corecapabilityinmanufacturing2Dand3DMEMSprobecardsbasedonproprietaryMEMSprocesstechnology.
Securing RF high-speed signal response circuit design and ultra-precision micro-fabrication technology.SecuringRFhigh-speedsignalresponsecircuitdesignandultra-precisionmicro-fabricationtechnology.
Advanced technological capability to miniaturize Fan-out test substrate CMP technology to below 50μm.AdvancedtechnologicalcapabilitytominiaturizeFan-outtestsubstrateCMPtechnologytobelow50μm.
Establishment of core process technology for forming distortion-free Fine Pitch structures through the introduction of EVG's Mask-less lithography equipment.Establishmentofcoreprocesstechnologyforformingdistortion-freeFinePitchstructuresthroughtheintroductionofEVG'sMask-lesslithographyequipment.
Core AdvantagesCoreAdvantages
Unique technological prowess in the development and mass production of next-generation probe cards based on MEMS technology.Uniquetechnologicalprowessinthedevelopmentandmassproductionofnext-generationprobecardsbasedonMEMStechnology.
Continuous investment and business portfolio shift towards advanced semiconductor response technologies, including RF and high-speed interface test solutions, HBM, and AI.Continuousinvestmentandbusinessportfolioshifttowardsadvancedsemiconductorresponsetechnologies,includingRFandhigh-speedinterfacetestsolutions,HBM,andAI.
High R&D focus with approximately 15% of its workforce dedicated to research and development, and an average R&D investment ratio of up to 20% over the last three years.HighR&Dfocuswithapproximately15%ofitsworkforcededicatedtoresearchanddevelopment,andanaverageR&Dinvestmentratioofupto20%overthelastthreeyears.
Internal design and test analysis organization coupled with proprietary MEMS process lines for technology internalization and quality control.InternaldesignandtestanalysisorganizationcoupledwithproprietaryMEMSprocesslinesfortechnologyinternalizationandqualitycontrol.
Numerous awards from major clients, including Samsung Electronics' Best Contribution Award (2017, 2018, 2021) and Innovation Excellence Partner (2014, 2022).Numerousawardsfrommajorclients,includingSamsungElectronics'BestContributionAward(2017,2018,2021)andInnovationExcellencePartner(2014,2022).
Contribution to overseas market expansion and export growth, evidenced by the 'Ten Million Dollar Export Tower' award (2021).Contributiontooverseasmarketexpansionandexportgrowth,evidencedbythe'TenMillionDollarExportTower'award(2021).
Official recognition of technological excellence through the acquisition of New Excellent Technology (NET) certification (2023) for "RF Probe Card 3D MEMS Build-up Manufacturing Technology".OfficialrecognitionoftechnologicalexcellencethroughtheacquisitionofNewExcellentTechnology(NET)certification(2023)for"RFProbeCard3DMEMSBuild-upManufacturingTechnology".
Capability to respond to extreme miniaturization technologies through proprietary MEMS process technology.CapabilitytorespondtoextrememiniaturizationtechnologiesthroughproprietaryMEMSprocesstechnology.
Target IndustrieTargetIndustrie
Wafer test processes in the semiconductor manufacturing industry.Wafertestprocessesinthesemiconductormanufacturingindustry.
Packaging test sector within semiconductor post-processes.Packagingtestsectorwithinsemiconductorpost-processes.
Manufacturing of test substrates for high-performance chips (HBM, PMIC, AI).Manufacturingoftestsubstratesforhigh-performancechips(HBM,PMIC,AI).
Areas improving productivity, efficiency, and security of industrial infrastructure, including practical IoT (M2M) application models.Areasimprovingproductivity,efficiency,andsecurityofindustrialinfrastructure,includingpracticalIoT(M2M)applicationmodels.
Company activities within the electrical/electronic/control industry sector.Companyactivitieswithintheelectrical/electronic/controlindustrysector.
Major MarketsMajorMarkets
South Korea, TaiwanSouthKorea,Taiwan
Certifications/PatentsCertifications/Patents
ISO 14001 environmental management system certification.ISO14001environmentalmanagementsystemcertification.
Acquisition of Material, Parts, and Equipment Specialist Company certification in 2020.AcquisitionofMaterial,Parts,andEquipmentSpecialistCompanycertificationin2020.
New Excellent Technology (NET) certification for "RF Probe Card 3D MEMS Build-up Manufacturing Technology" from the Ministry of Trade, Industry and Energy in 2023.NewExcellentTechnology(NET)certificationfor"RFProbeCard3DMEMSBuild-upManufacturingTechnology"fromtheMinistryofTrade,IndustryandEnergyin2023.
Selection for the Excellent Corporate Research Institute Fostering (ATC+) project by the Ministry of Trade, Industry and Energy in 2022.SelectionfortheExcellentCorporateResearchInstituteFostering(ATC+)projectbytheMinistryofTrade,IndustryandEnergyin2022.
Possession of numerous domestic and international patents related to probe cards and test sockets.Possessionofnumerousdomesticandinternationalpatentsrelatedtoprobecardsandtestsockets.
Key patents include probe card support assemblies, probe sheets with multi-stage contact tips and their manufacturing methods, contactor blocks for self-aligning vertical probe cards and their manufacturing methods, and semiconductor device test sockets.Keypatentsincludeprobecardsupportassemblies,probesheetswithmulti-stagecontacttipsandtheirmanufacturingmethods,contactorblocksforself-aligningverticalprobecardsandtheirmanufacturingmethods,andsemiconductordevicetestsockets.
Introduction
Location
77-20 Yeonamyulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea
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Information
77-20 Yeonamyulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea