Semi conductor equipment manufacturer, Automation equipment, Pneumatic, Tray feeder, Cylinder and more
ㆍHigh Speed and Accuracy Flip-Chip Bonding system ㆍLinear Bond head with touch down control ㆍFull bump Inspection and post Inspection capability ㆍMCM(multi-chip module) capability(Dual Wafer) ㆍWafer Mapping and SECS/GEM