Information
219 Gasan digital 1-ro, Geumcheon District, Seoul, South Korea
+82 2-2627-3770
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Overview
- Summary
- Pemtron Co., Ltd. is a specialized company that develops and supplies precision process inspection equipment for various advanced industrial fields such as SMT, semiconductors, secondary batteries, and automotive electronics, based on 3D precision measurement and vision original technologies. A global leader in minimizing defect rates and innovating quality in manufacturing processes through AI deep learning-based inspection technology and hardware-software convergence solutions. Key products include solder paste inspection equipment, 3D automated optical inspection equipment, wafer bump 3D inspection equipment, wire bonding 3D inspection equipment, and secondary battery lead tab process and inspection equipment.Pemtron Co., Ltd. is a specialized company that develops and supplies precision process inspection equipment for various advanced industrial fields such as SMT, semiconductors, secondary batteries, and automotive electronics, based on 3D precision measurement and vision original technologies. A global leader in minimizing defect rates and innovating quality in manufacturing processes through AI deep learning-based inspection technology and hardware-software convergence solutions. Key products include solder paste inspection equipment, 3D automated optical inspection equipment, wafer bump 3D inspection equipment, wire bonding 3D inspection equipment, and secondary battery lead tab process and inspection equipment.
- Key Products/Technologies
- 3D SPI (Solder Paste Inspection) Equipment: SATURN, TROI SPI series. Features include shadow effect elimination through dual projection technology, combined 2D and 3D inspection, high-speed and high-precision inspection, real-color 3D image implementation, PCB warpage compensation technology, and SPI-AOI linkage for process optimization and improved production efficiency.3D SPI (Solder Paste Inspection) Equipment: SATURN, TROI SPI series. Features include shadow effect elimination through dual projection technology, combined 2D and 3D inspection, high-speed and high-precision inspection, real-color 3D image implementation, PCB warpage compensation technology, and SPI-AOI linkage for process optimization and improved production efficiency.
- 3D AOI (Automated Optical Inspection) and MOI (Machining Optical Inspection) Equipment: ATHENA Series, EAGLE 3D 8800TH, EAGLE 3D 8800TWIN, EAGLE 3D-8800. Utilizes 8-way Projection technology to minimize shadow and reflection effects, performs 100% 2D and 3D simultaneous inspection, supports high-density PCBs, offers 4-Way Side Camera option, capable of inspecting components up to 27mm-30mm in height, boasts fast inspection speeds and low false call rates.3D AOI (Automated Optical Inspection) and MOI (Machining Optical Inspection) Equipment: ATHENA Series, EAGLE 3D 8800TH, EAGLE 3D 8800TWIN, EAGLE 3D-8800. Utilizes 8-way Projection technology to minimize shadow and reflection effects, performs 100% 2D and 3D simultaneous inspection, supports high-density PCBs, offers 4-Way Side Camera option, capable of inspecting components up to 27mm-30mm in height, boasts fast inspection speeds and low false call rates.
- Semiconductor Inspection Equipment: Wafer Bump 3D inspection equipment (Poseidon S), Wire Bonding 3D inspection equipment (ZEUS), Wafer inspection equipment (8800WI, 8800WIR HBM for HBM processes), Memory Module inspection equipment (MARS, for SOCAMM), Package inspection equipment (APOLLON), FC-BGA high-density PCB inspection equipment, X-ray inspection equipment (AXI). Features include wafer Top & Bottom inspection, precise micro-crack inspection, measurement range of 5-400㎛, 3D image formation using special optical systems, wafer warpage inspection, and successful localization.Semiconductor Inspection Equipment: Wafer Bump 3D inspection equipment (Poseidon S), Wire Bonding 3D inspection equipment (ZEUS), Wafer inspection equipment (8800WI, 8800WIR HBM for HBM processes), Memory Module inspection equipment (MARS, for SOCAMM), Package inspection equipment (APOLLON), FC-BGA high-density PCB inspection equipment, X-ray inspection equipment (AXI). Features include wafer Top & Bottom inspection, precise micro-crack inspection, measurement range of 5-400㎛, 3D image formation using special optical systems, wafer warpage inspection, and successful localization.
- Secondary Battery Inspection Equipment: Lead tab process and inspection equipment (HAWK7300), battery cell, module, and pack inspection solutions.Secondary Battery Inspection Equipment: Lead tab process and inspection equipment (HAWK7300), battery cell, module, and pack inspection solutions.
- Core Technologies: 3D precision measurement and vision original technology, AI deep learning-based inspection technology, high-resolution 3D rendering and analysis, Moiré inspection method, machine vision and image processing software technology, hybrid 3D optical design technology, smart factory solutions (SMARTRON, TROI-iNet).Core Technologies: 3D precision measurement and vision original technology, AI deep learning-based inspection technology, high-resolution 3D rendering and analysis, Moiré inspection method, machine vision and image processing software technology, hybrid 3D optical design technology, smart factory solutions (SMARTRON, TROI-iNet).
- Core Advantages
- Proprietary 3D Precision Measurement and AI Deep Learning-based Inspection Technology: Over 20 years of accumulated 3D precision measurement and inspection technology, world-class 3D handling technology, and proprietary 3D measurement, representation, and inspection technologies. AI deep learning for enhanced inspection efficiency and automatic defect detection, minimizing defect rates in advanced processes.Proprietary 3D Precision Measurement and AI Deep Learning-based Inspection Technology: Over 20 years of accumulated 3D precision measurement and inspection technology, world-class 3D handling technology, and proprietary 3D measurement, representation, and inspection technologies. AI deep learning for enhanced inspection efficiency and automatic defect detection, minimizing defect rates in advanced processes.
- Extensive Product Portfolio and Convergence Solutions: A comprehensive lineup of 3D SPI, 3D AOI, Wafer Bump, Wire Bonding, HBM, memory module, and lead tab inspection equipment applicable across diverse industries including SMT, semiconductors, secondary batteries, and automotive electronics. Provision of cutting-edge solutions integrating hardware and software technologies to meet various customer demands.Extensive Product Portfolio and Convergence Solutions: A comprehensive lineup of 3D SPI, 3D AOI, Wafer Bump, Wire Bonding, HBM, memory module, and lead tab inspection equipment applicable across diverse industries including SMT, semiconductors, secondary batteries, and automotive electronics. Provision of cutting-edge solutions integrating hardware and software technologies to meet various customer demands.
- World-Class High-Speed and High-Precision Inspection Performance: Fast detection speeds achieved through 12M Pixel application and parallel processing technology, and Full Frame Rate implementation at CXP Camera speeds using Hardware Trigger. Dual projection and 8-way Projection technologies minimize shadow effects, ensuring high precision and repeatability for enhanced inspection reliability.World-Class High-Speed and High-Precision Inspection Performance: Fast detection speeds achieved through 12M Pixel application and parallel processing technology, and Full Frame Rate implementation at CXP Camera speeds using Hardware Trigger. Dual projection and 8-way Projection technologies minimize shadow effects, ensuring high precision and repeatability for enhanced inspection reliability.
- Global Customer References and Market Expansion: Securing major clients including leading domestic and international corporations such as LG Innotek, Amkor Technology, Hana Micron, SK Hynix, Micron, and global foundry customers. Diversified sales channels with over 300 companies in more than 20 countries worldwide, demonstrating global technological competitiveness.Global Customer References and Market Expansion: Securing major clients including leading domestic and international corporations such as LG Innotek, Amkor Technology, Hana Micron, SK Hynix, Micron, and global foundry customers. Diversified sales channels with over 300 companies in more than 20 countries worldwide, demonstrating global technological competitiveness.
- Continuous R&D Investment and Intellectual Property Acquisition: Consistent investment in research and development since its establishment, with a dedicated team of over 100 professional researchers (55% of total employees, 65% of whom are software developers). Securing over 60 domestic and international patents, strengthening capabilities for technological innovation and market leadership.Continuous R&D Investment and Intellectual Property Acquisition: Consistent investment in research and development since its establishment, with a dedicated team of over 100 professional researchers (55% of total employees, 65% of whom are software developers). Securing over 60 domestic and international patents, strengthening capabilities for technological innovation and market leadership.
- Smart Factory and Process Optimization Solutions: Establishment of big data by accumulating inspection data over long periods and statistical analysis for tracing root causes of defects. Provision of 'SMARTRON' system for remote web control and 'TROI-iNet' system for managing pre-process defects by linking SPI and AOI, thereby improving process efficiency.Smart Factory and Process Optimization Solutions: Establishment of big data by accumulating inspection data over long periods and statistical analysis for tracing root causes of defects. Provision of 'SMARTRON' system for remote web control and 'TROI-iNet' system for managing pre-process defects by linking SPI and AOI, thereby improving process efficiency.
- Target Industrie
- SMT (Surface Mount Technology)SMT (Surface Mount Technology)
- Semiconductors (Wafer, Packaging, HBM, Memory Module)Semiconductors (Wafer, Packaging, HBM, Memory Module)
- Secondary Batteries (Lead Tab, Battery Cell/Module/Pack)Secondary Batteries (Lead Tab, Battery Cell/Module/Pack)
- Automotive ElectronicsAutomotive Electronics
- Nano and Bio (planned expansion using Scanning Electron Microscope SEM technology)Nano and Bio (planned expansion using Scanning Electron Microscope SEM technology)
- Major Markets
- China, Southeast Asia, Japan, MalaysiaChina, Southeast Asia, Japan, Malaysia
- EuropeEurope
- USA, MexicoUSA, Mexico
- Certifications/Patents
- Over 53 patents registered and pending in Korea and abroadOver 53 patents registered and pending in Korea and abroad
- ISO 9001:2015 certificationISO 9001:2015 certification
- ISO 14001:2015 certificationISO 14001:2015 certification
- CE (Electrical Safety Test) certificationCE (Electrical Safety Test) certification
- ESD (Electromagnetic Compatibility Test) certificationESD (Electromagnetic Compatibility Test) certification
- KCS (Self-Regulatory Safety Confirmation) certificationKCS (Self-Regulatory Safety Confirmation) certification
- Million Dollar Export Tower Award (2011)Million Dollar Export Tower Award (2011)
- 5 Million Dollar Export Tower Award (2012)5 Million Dollar Export Tower Award (2012)
- 10 Million Dollar Export Tower Award (2017)10 Million Dollar Export Tower Award (2017)
- 30 Million Dollar Export Tower Award (2020)30 Million Dollar Export Tower Award (2020)
- TROI SPI equipment Siemens certification (2010)TROI SPI equipment Siemens certification (2010)
Introduction
Location
219 Gasan digital 1-ro, Geumcheon District, Seoul, South Korea
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