Information
89 Asanvalley-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do, South Korea
+82 41-546-5331
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Overview
- Summary
- Point Engineering, established in 1998, is a specialized company in semiconductor and display manufacturing equipment components. It possesses capabilities in producing core components for display and semiconductor processes based on special surface treatment and ultra-precision machining technologies. The company holds unique technological prowess, being the world's only producer of large 12-inch AAO wafers. It expands its business by supplying various micro-electronic components utilizing AAO and MEMS technologies. Notably, the company achieved a turnaround to profit through its MEMS pin foundry business, which is essential for testing high-density semiconductors like High Bandwidth Memory (HBM).Point Engineering, established in 1998, is a specialized company in semiconductor and display manufacturing equipment components. It possesses capabilities in producing core components for display and semiconductor processes based on special surface treatment and ultra-precision machining technologies. The company holds unique technological prowess, being the world's only producer of large 12-inch AAO wafers. It expands its business by supplying various micro-electronic components utilizing AAO and MEMS technologies. Notably, the company achieved a turnaround to profit through its MEMS pin foundry business, which is essential for testing high-density semiconductors like High Bandwidth Memory (HBM).
- Key Products/Technologies
- AAO (Anodic Aluminum Oxide) Wafers and Molds: The world's only successful mass production of large 12-inch AAO wafers. AAO wafers are utilized as molds for probe pin manufacturing, enabling precise patterning and high-quality, deformation-free pin production compared to conventional photoresist methods.AAO (Anodic Aluminum Oxide) Wafers and Molds: The world's only successful mass production of large 12-inch AAO wafers. AAO wafers are utilized as molds for probe pin manufacturing, enabling precise patterning and high-quality, deformation-free pin production compared to conventional photoresist methods.
- MEMS (Micro-Electro-Mechanical Systems) Pins: Micro-pins for high-density semiconductor inspection, featuring a high aspect ratio of 20:1, 100㎛ height, and 5㎛ line width. It offers various lineups including buckling probe pins, spring probe pins, and micro cantilever pins, essential for testing high-speed and high-density semiconductors like HBM.MEMS (Micro-Electro-Mechanical Systems) Pins: Micro-pins for high-density semiconductor inspection, featuring a high aspect ratio of 20:1, 100㎛ height, and 5㎛ line width. It offers various lineups including buckling probe pins, spring probe pins, and micro cantilever pins, essential for testing high-speed and high-density semiconductors like HBM.
- Core Components for Display and Semiconductor Process Equipment: Manufacturing of key components for CVD (Chemical Vapor Deposition) and etching equipment, such as Susceptor, Diffuser, and Shadow Frame. Production of various components like Face Plate for uniform gas supply to wafers and SV Gate for wafer pathway and vacuum maintenance. Application of special surface treatment technology for longer lifespan and higher quality compared to competitors.Core Components for Display and Semiconductor Process Equipment: Manufacturing of key components for CVD (Chemical Vapor Deposition) and etching equipment, such as Susceptor, Diffuser, and Shadow Frame. Production of various components like Face Plate for uniform gas supply to wafers and SV Gate for wafer pathway and vacuum maintenance. Application of special surface treatment technology for longer lifespan and higher quality compared to competitors.
- Anodizing Technology: Ultra-precision machining and production of precision components utilizing special surface treatment technologies including MFC, HDSA, and BTA. Capability to manufacture and regenerate core parts for display CVD process equipment based on aluminum anodic oxidation technology. Differentiated technology contributing to improved heat dissipation for electronic components like LED metal substrates.Anodizing Technology: Ultra-precision machining and production of precision components utilizing special surface treatment technologies including MFC, HDSA, and BTA. Capability to manufacture and regenerate core parts for display CVD process equipment based on aluminum anodic oxidation technology. Differentiated technology contributing to improved heat dissipation for electronic components like LED metal substrates.
- Core Advantages
- Unique AAO and MEMS Technology: The world's only company successfully mass-producing large 12-inch AAO wafers. Innovative competitive edge in the high-density semiconductor inspection market through AAO-based MEMS pin manufacturing technology, overcoming limitations of conventional photoresist methods.Unique AAO and MEMS Technology: The world's only company successfully mass-producing large 12-inch AAO wafers. Innovative competitive edge in the high-density semiconductor inspection market through AAO-based MEMS pin manufacturing technology, overcoming limitations of conventional photoresist methods.
- Vertical Integration Production System: A system where all processes from precision machining to surface treatment, precision analysis, and cleaning are vertically integrated. Optimized process operation leading to reduced transportation time and costs, and improved quality.Vertical Integration Production System: A system where all processes from precision machining to surface treatment, precision analysis, and cleaning are vertically integrated. Optimized process operation leading to reduced transportation time and costs, and improved quality.
- Customer-Oriented Solutions and Quality Superiority: Capability to produce and supply products tailored to customer needs. Products with special surface treatment technology offer a lifespan twice as long and higher reliability, despite being over 50% more expensive than competitors' products. A top-tier quality assurance system through LPC and ICP-MS analysis.Customer-Oriented Solutions and Quality Superiority: Capability to produce and supply products tailored to customer needs. Products with special surface treatment technology offer a lifespan twice as long and higher reliability, despite being over 50% more expensive than competitors' products. A top-tier quality assurance system through LPC and ICP-MS analysis.
- Global Clientele and Export Competitiveness: A global supply chain, delivering display and semiconductor CVD process components to major semiconductor equipment manufacturers like Applied Materials (AMAT). High export ratio, with over 90% of diffuser sales revenue coming from exports.Global Clientele and Export Competitiveness: A global supply chain, delivering display and semiconductor CVD process components to major semiconductor equipment manufacturers like Applied Materials (AMAT). High export ratio, with over 90% of diffuser sales revenue coming from exports.
- Continuous R&D and Business Expansion: A company that creates new technological value through 20 years of accumulated experience and continuous technological development. Strategic expansion into various business areas, including membranes, gas sensors, and the bio-industry, utilizing AAO material technology.Continuous R&D and Business Expansion: A company that creates new technological value through 20 years of accumulated experience and continuous technological development. Strategic expansion into various business areas, including membranes, gas sensors, and the bio-industry, utilizing AAO material technology.
- Technology Leadership Based on Patents and Certifications: Acquisition of numerous certifications including ISO 9001, ISO 14001, INNOBIZ, and MAINBIZ. Recognition of technological prowess through awards such as the Patent Management Grand Prize, KONEX Grand Prize, and Industrial Technology Award. Enhanced technological competitiveness and protection through multiple patent registrations.Technology Leadership Based on Patents and Certifications: Acquisition of numerous certifications including ISO 9001, ISO 14001, INNOBIZ, and MAINBIZ. Recognition of technological prowess through awards such as the Patent Management Grand Prize, KONEX Grand Prize, and Industrial Technology Award. Enhanced technological competitiveness and protection through multiple patent registrations.
- Target Industrie
- Semiconductor Industry: Supply of MEMS pins for testing high-density semiconductors, including High Bandwidth Memory (HBM). Manufacturing of core components for semiconductor deposition and etching process equipment (Susceptor, Diffuser, Shadow Frame, Face Plate, SV Gate, etc.).Semiconductor Industry: Supply of MEMS pins for testing high-density semiconductors, including High Bandwidth Memory (HBM). Manufacturing of core components for semiconductor deposition and etching process equipment (Susceptor, Diffuser, Shadow Frame, Face Plate, SV Gate, etc.).
- Display Industry: Manufacturing and regeneration of core components for TFT-LCD and OLED display CVD process equipment. Capability to produce large-sized products to meet the growing demand in the large-scale display equipment market.Display Industry: Manufacturing and regeneration of core components for TFT-LCD and OLED display CVD process equipment. Capability to produce large-sized products to meet the growing demand in the large-scale display equipment market.
- LED Industry: Production of UV-LED products and components utilizing high reflectivity and heat dissipation properties of aluminum. Manufacturing of LED substrates and packages (finished products).LED Industry: Production of UV-LED products and components utilizing high reflectivity and heat dissipation properties of aluminum. Manufacturing of LED substrates and packages (finished products).
- Bio Industry: Business area expansion through the development of membranes and gas sensors utilizing AAO material technology.Bio Industry: Business area expansion through the development of membranes and gas sensors utilizing AAO material technology.
- Major Markets
- South Korea, China, JapanSouth Korea, China, Japan
- United StatesUnited States
- Certifications/Patents
- ISO 9001 Certification (2005)ISO 9001 Certification (2005)
- ISO 14001 Certification (2018)ISO 14001 Certification (2018)
- INNOBIZ Certification (2006)INNOBIZ Certification (2006)
- MAINBIZ Certification (2008)MAINBIZ Certification (2008)
- Patent Management Grand Prize (2016, 2017, 2018)Patent Management Grand Prize (2016, 2017, 2018)
- KONEX Grand Prize (2018)KONEX Grand Prize (2018)
- Industrial Technology Award (2018)Industrial Technology Award (2018)
- 10 Million Dollar Export Tower Award (2015)10 Million Dollar Export Tower Award (2015)
- 20 Million Dollar Export Tower Award (2016)20 Million Dollar Export Tower Award (2016)
- 30 Million Dollar Export Tower Award (2018)30 Million Dollar Export Tower Award (2018)
- Patent registration for optical device substrate, optical device, and its manufacturing method (over 10 cases, 2011)Patent registration for optical device substrate, optical device, and its manufacturing method (over 10 cases, 2011)
- Patent registration for LED package (over 15 cases, 2013)Patent registration for LED package (over 15 cases, 2013)
- Patent registration for LED metal substrate package and its manufacturing method (over 14 cases, 2013)Patent registration for LED metal substrate package and its manufacturing method (over 14 cases, 2013)
- Patent registration for manufacturing method of heat sink for chip mounting substrate with heat dissipation material (over 16 cases, 2014)Patent registration for manufacturing method of heat sink for chip mounting substrate with heat dissipation material (over 16 cases, 2014)
- Patent registration for chip package including shielding part (over 32 cases, 2016)Patent registration for chip package including shielding part (over 32 cases, 2016)
- National R&D project for developing MLA substrate for DRAM probe card and guide plate for AP probe card using AAO (2020.04~2024.12)National R&D project for developing MLA substrate for DRAM probe card and guide plate for AP probe card using AAO (2020.04~2024.12)
- National R&D project for developing high corrosion-resistant ceramic ALD precursor and core components for high-density semiconductor deposition/etching equipment (2020.04~2024.12)National R&D project for developing high corrosion-resistant ceramic ALD precursor and core components for high-density semiconductor deposition/etching equipment (2020.04~2024.12)
- National R&D project for developing room temperature operating multi-gas sensor technology based on photoenergy-activated ceramic materials (2018.07~2021.12)National R&D project for developing room temperature operating multi-gas sensor technology based on photoenergy-activated ceramic materials (2018.07~2021.12)
Introduction
Location
89 Asanvalley-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do, South Korea
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