Onto Innovation is a global leader in process control solutions across the entire semiconductor value chain. The company focuses on helping customers resolve their most challenging issues related to yield, device performance, quality, and reliability. It provides a comprehensive suite of advanced inspection, metrology, lithography systems, and smart manufacturing software. Onto Innovation's solutions are crucial for the advancement of cutting-edge technologies such as AI, high-performance computing (HPC), and 5G.OntoInnovationisagloballeaderinprocesscontrolsolutionsacrosstheentiresemiconductorvaluechain.Thecompanyfocusesonhelpingcustomersresolvetheirmostchallengingissuesrelatedtoyield,deviceperformance,quality,andreliability.Itprovidesacomprehensivesuiteofadvancedinspection,metrology,lithographysystems,andsmartmanufacturingsoftware.OntoInnovation'ssolutionsarecrucialfortheadvancementofcutting-edgetechnologiessuchasAI,high-performancecomputing(HPC),and5G.
Key Products/TechnologiesKeyProducts/Technologies
The primary product categories include Metrology, Defect Inspection, and Lithography systems. These systems utilize high-resolution imaging and sub-micron metrology to detect defects in semiconductor wafers and packages with precision.TheprimaryproductcategoriesincludeMetrology,DefectInspection,andLithographysystems.Thesesystemsutilizehigh-resolutionimagingandsub-micronmetrologytodetectdefectsinsemiconductorwafersandpackageswithprecision.
Metrology tools like the Aspect and Iris™ series provide precise measurements for critical dimensions and thin film layers, supporting the development of advanced semiconductor technologies such as 3D NAND and Gate-All-Around (GAA) devices.MetrologytoolsliketheAspectandIris™seriesprovideprecisemeasurementsforcriticaldimensionsandthinfilmlayers,supportingthedevelopmentofadvancedsemiconductortechnologiessuchas3DNANDandGate-All-Around(GAA)devices.
The 3Di™ technology on the Dragonfly® G3 system is essential for bump process control in high-bandwidth memory (HBM) and advanced logic applications. The EchoScan™ system offers immersion-free, non-contact technology for detecting voids as small as 1µm in wafer bonding applications.The3Di™technologyontheDragonfly®G3systemisessentialforbumpprocesscontrolinhigh-bandwidthmemory(HBM)andadvancedlogicapplications.TheEchoScan™systemoffersimmersion-free,non-contacttechnologyfordetectingvoidsassmallas1µminwaferbondingapplications.
The Atlas® G6 optical critical dimension (OCD) metrology system contributes to process control for next-generation GAA logic and HBM device production.TheAtlas®G6opticalcriticaldimension(OCD)metrologysystemcontributestoprocesscontrolfornext-generationGAAlogicandHBMdeviceproduction.
Enterprise software solutions for factory analytics and process control are provided, integrating data from various stages to offer comprehensive yield management. The integration of AI and machine learning technologies enhances productivity and provides predictive analytics capabilities.Enterprisesoftwaresolutionsforfactoryanalyticsandprocesscontrolareprovided,integratingdatafromvariousstagestooffercomprehensiveyieldmanagement.TheintegrationofAIandmachinelearningtechnologiesenhancesproductivityandprovidespredictiveanalyticscapabilities.
Core AdvantagesCoreAdvantages
A unique perspective across the semiconductor value chain and a comprehensive portfolio of process control solutions enable the company to address complex manufacturing challenges.Auniqueperspectiveacrossthesemiconductorvaluechainandacomprehensiveportfolioofprocesscontrolsolutionsenablethecompanytoaddresscomplexmanufacturingchallenges.
Deep expertise in advanced metrology and inspection solutions, coupled with continuous technological innovation, maintains a strong competitive edge in the market.Deepexpertiseinadvancedmetrologyandinspectionsolutions,coupledwithcontinuoustechnologicalinnovation,maintainsastrongcompetitiveedgeinthemarket.
An extensive patent portfolio, including 398 U.S. and foreign patents and 175 pending applications as of December 30, 2023, protects its innovative solutions.Anextensivepatentportfolio,including398U.S.andforeignpatentsand175pendingapplicationsasofDecember30,2023,protectsitsinnovativesolutions.
Solutions are deeply embedded in customer manufacturing processes, creating significant switching costs and reinforcing market position.Solutionsaredeeplyembeddedincustomermanufacturingprocesses,creatingsignificantswitchingcostsandreinforcingmarketposition.
Consistent introduction of new technologies and ongoing research and development investments ensure responsiveness to evolving market demands.Consistentintroductionofnewtechnologiesandongoingresearchanddevelopmentinvestmentsensureresponsivenesstoevolvingmarketdemands.
A worldwide sales and service organization provides extensive customer support across different geographical regions, ensuring optimal performance for installed systems.Aworldwidesalesandserviceorganizationprovidesextensivecustomersupportacrossdifferentgeographicalregions,ensuringoptimalperformanceforinstalledsystems.
Target IndustrieTargetIndustrie
Application across the entire semiconductor manufacturing industry.Applicationacrosstheentiresemiconductormanufacturingindustry.
Advanced front-end and back-end semiconductor manufacturing processes, optimizing yield and quality.Advancedfront-endandback-endsemiconductormanufacturingprocesses,optimizingyieldandquality.
Advanced packaging technologies, crucial for improving device performance and miniaturization.Advancedpackagingtechnologies,crucialforimprovingdeviceperformanceandminiaturization.
Compound semiconductor manufacturing, flat panel display, and Micro-Electro-Mechanical Systems (MEMS) manufacturing.Compoundsemiconductormanufacturing,flatpaneldisplay,andMicro-Electro-MechanicalSystems(MEMS)manufacturing.
Semiconductor production for AI, high-performance computing (HPC), 5G, and automotive applications.SemiconductorproductionforAI,high-performancecomputing(HPC),5G,andautomotiveapplications.
Data storage devices and medical device manufacturing, ensuring high precision and quality.Datastoragedevicesandmedicaldevicemanufacturing,ensuringhighprecisionandquality.
Major MarketsMajorMarkets
South Korea, China, Japan, Taiwan, Southeast Asia (including Singapore)SouthKorea,China,Japan,Taiwan,SoutheastAsia(includingSingapore)
Germany, United Kingdom, NetherlandsGermany,UnitedKingdom,Netherlands
United States, CanadaUnitedStates,Canada
Certifications/PatentsCertifications/Patents
Possession of 398 U.S. and foreign patents and 175 pending patent applications as of December 30, 2023.Possessionof398U.S.andforeignpatentsand175pendingpatentapplicationsasofDecember30,2023.
Extensive patent protection in critical areas such as metrology, macro-defect detection, lithography, automation, and the application of AI and machine learning.Extensivepatentprotectionincriticalareassuchasmetrology,macro-defectdetection,lithography,automation,andtheapplicationofAIandmachinelearning.
Granted patents related to optical metrology devices, multi-layer calibration for empirical overlay measurement, low contrast non-referential defect detection, and deep learning models in high-mix semiconductor manufacturing.Grantedpatentsrelatedtoopticalmetrologydevices,multi-layercalibrationforempiricaloverlaymeasurement,lowcontrastnon-referentialdefectdetection,anddeeplearningmodelsinhigh-mixsemiconductormanufacturing.
Recipient of the 'Excellent Production Support' award from Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC), acknowledging its customer support and technological prowess.Recipientofthe'ExcellentProductionSupport'awardfromTaiwanSemiconductorManufacturingCo.,Ltd.(TSMC),acknowledgingitscustomersupportandtechnologicalprowess.
Numerous recognitions for innovative technologies and products, including the Semes Technology Award and the Open Innovation Award.Numerousrecognitionsforinnovativetechnologiesandproducts,includingtheSemesTechnologyAwardandtheOpenInnovationAward.
Introduction
Location
614 Dongtangiheung-ro, Hwaseong-si, Gyeonggi-do, South Korea
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Information
614 Dongtangiheung-ro, Hwaseong-si, Gyeonggi-do, South Korea