Information
13 Ojeongongeop-gil, Uiwang-si, Gyeonggi-do, South Korea
+82 31-460-3588
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Overview
- Summary
- OKINS ELECTRONICS, established in 1998, is a specialized semiconductor test solution company and a leading supplier of device interface systems. The company pioneered the localization of burn-in sockets in Korea, contributing to the technological independence of the semiconductor industry. It possesses specialized capabilities in developing and manufacturing high-performance test sockets and interface solutions. Recently, the company has been expanding its business into high-value-added products such as HBM magnetic collets and sockets for CLT (Chambered Low Frequency Memory Tester), aligning with the growth of the AI-related high-end memory test market. Its core businesses include semiconductor inspection socket manufacturing and semiconductor test service provision.OKINS ELECTRONICS, established in 1998, is a specialized semiconductor test solution company and a leading supplier of device interface systems. The company pioneered the localization of burn-in sockets in Korea, contributing to the technological independence of the semiconductor industry. It possesses specialized capabilities in developing and manufacturing high-performance test sockets and interface solutions. Recently, the company has been expanding its business into high-value-added products such as HBM magnetic collets and sockets for CLT (Chambered Low Frequency Memory Tester), aligning with the growth of the AI-related high-end memory test market. Its core businesses include semiconductor inspection socket manufacturing and semiconductor test service provision.
- Key Products/Technologies
- **BiTS (Burn-in & Test Socket) Division**: Product lines focused on semiconductor reliability testing, including burn-in sockets and test sockets. Capabilities in the domestic localization and mass production of burn-in sockets, used for verifying semiconductor operation under harsh conditions (over 125°C for 4-48 hours). World's first development of 0.3-pitch and 0.25-pitch burn-in sockets.**BiTS (Burn-in & Test Socket) Division**: Product lines focused on semiconductor reliability testing, including burn-in sockets and test sockets. Capabilities in the domestic localization and mass production of burn-in sockets, used for verifying semiconductor operation under harsh conditions (over 125°C for 4-48 hours). World's first development of 0.3-pitch and 0.25-pitch burn-in sockets.
- **MEMS (Micro-Electro-Mechanical Systems) Technology**: Provides miniaturized and high-performance solutions designed for high durability, flexibility, and electrical contact characteristics. Development and supply capabilities for probe pins (pogo pins) used in semiconductor testing.**MEMS (Micro-Electro-Mechanical Systems) Technology**: Provides miniaturized and high-performance solutions designed for high durability, flexibility, and electrical contact characteristics. Development and supply capabilities for probe pins (pogo pins) used in semiconductor testing.
- **Magnetic Collets**: Consumable, high-value components for picking and placing semiconductor chips. Magnetic collets applied in HBM (High Bandwidth Memory) manufacturing processes are high-profit products with a higher Average Selling Price (ASP).**Magnetic Collets**: Consumable, high-value components for picking and placing semiconductor chips. Magnetic collets applied in HBM (High Bandwidth Memory) manufacturing processes are high-profit products with a higher Average Selling Price (ASP).
- **Connectors and Other Components**: Diversification of portfolio through the manufacturing of battery connectors for electric vehicles. Possession of technology for the localization of 5G communication connectors and related equipment. Capabilities in producing precision semiconductor components and automotive connectors using mold and press facilities.**Connectors and Other Components**: Diversification of portfolio through the manufacturing of battery connectors for electric vehicles. Possession of technology for the localization of 5G communication connectors and related equipment. Capabilities in producing precision semiconductor components and automotive connectors using mold and press facilities.
- **Semiconductor Test Service Business**: Provides CIS (CMOS Image Sensor) package test services through its Vision Tech subsidiary located in Suzhou, China. Offers wafer and package test services.**Semiconductor Test Service Business**: Provides CIS (CMOS Image Sensor) package test services through its Vision Tech subsidiary located in Suzhou, China. Offers wafer and package test services.
- Core Advantages
- **Pioneering Localization of Burn-in Sockets and Technological Independence**: Successfully localized burn-in sockets in 1998, reducing reliance on foreign products and playing a pioneering role in enhancing the competitiveness of the domestic semiconductor industry.**Pioneering Localization of Burn-in Sockets and Technological Independence**: Successfully localized burn-in sockets in 1998, reducing reliance on foreign products and playing a pioneering role in enhancing the competitiveness of the domestic semiconductor industry.
- **Unique Technology based on High Precision and Durability**: Possesses the ability to introduce high-value-added products with significantly improved precision and durability through continuous R&D. Achieved a technological edge by developing the world's first 0.3-pitch and 0.25-pitch burn-in sockets.**Unique Technology based on High Precision and Durability**: Possesses the ability to introduce high-value-added products with significantly improved precision and durability through continuous R&D. Achieved a technological edge by developing the world's first 0.3-pitch and 0.25-pitch burn-in sockets.
- **Leadership in the High-Value AI Memory Test Market**: Leads the market by exclusively or primarily supplying sockets and pogo pins for high-efficiency CLT (Chambered Low Frequency Memory Tester) and magnetic collets for next-generation memory like HBM and LPDDR6, which are adopted in AI acceleration platforms.**Leadership in the High-Value AI Memory Test Market**: Leads the market by exclusively or primarily supplying sockets and pogo pins for high-efficiency CLT (Chambered Low Frequency Memory Tester) and magnetic collets for next-generation memory like HBM and LPDDR6, which are adopted in AI acceleration platforms.
- **Established Vertical Value Chain and Process Internalization**: Built a comprehensive semiconductor test portfolio covering sockets, probes, collets, and test services. Internalized plating processes and invested in automation facilities to enhance quality, yield, and cost competitiveness.**Established Vertical Value Chain and Process Internalization**: Built a comprehensive semiconductor test portfolio covering sockets, probes, collets, and test services. Internalized plating processes and invested in automation facilities to enhance quality, yield, and cost competitiveness.
- **Global Customer Network and Quality Reliability**: Secured major domestic semiconductor manufacturers like Samsung Electronics and SK Hynix, as well as international clients such as China's CXMT and Micron, earning recognition for quality reliability in the global market.**Global Customer Network and Quality Reliability**: Secured major domestic semiconductor manufacturers like Samsung Electronics and SK Hynix, as well as international clients such as China's CXMT and Micron, earning recognition for quality reliability in the global market.
- **Diversified Business Portfolio**: Possesses the capability to secure stable growth drivers by expanding into new businesses beyond semiconductor inspection sockets, including magnetic collets, battery connectors for electric vehicles, and 5G communication connectors.**Diversified Business Portfolio**: Possesses the capability to secure stable growth drivers by expanding into new businesses beyond semiconductor inspection sockets, including magnetic collets, battery connectors for electric vehicles, and 5G communication connectors.
- Target Industrie
- Semiconductor Industry (Memory semiconductors, Non-memory semiconductors, High Bandwidth Memory (HBM), LPDDR, etc.)Semiconductor Industry (Memory semiconductors, Non-memory semiconductors, High Bandwidth Memory (HBM), LPDDR, etc.)
- Electric Vehicle Industry (Battery connectors)Electric Vehicle Industry (Battery connectors)
- 5G Communication Industry (Communication connectors, small cell base stations)5G Communication Industry (Communication connectors, small cell base stations)
- Major Markets
- South Korea, China (Suzhou factory, Vision Tech subsidiary operations), TaiwanSouth Korea, China (Suzhou factory, Vision Tech subsidiary operations), Taiwan
- United States (Technology development cooperation with Wells CTI, OKINS USA affiliate)United States (Technology development cooperation with Wells CTI, OKINS USA affiliate)
- Certifications/Patents
- **Certifications**: ISO 9001 (2004, 2018), ISO 14001 (2004, 2018), Excellent Technology Evaluation Company Certification (T-3 Top-tier, 2017), ISO 45001 (2021), HKMC SQ Certification (2022), SK Collet Approval (2022), Excellent Workplace Innovation Company (2021), Designated as Excellent Technology Research Center (ATC, 2016), KIBO A+ Members Company Selection, Selected as Innovation-driven SME (2005).**Certifications**: ISO 9001 (2004, 2018), ISO 14001 (2004, 2018), Excellent Technology Evaluation Company Certification (T-3 Top-tier, 2017), ISO 45001 (2021), HKMC SQ Certification (2022), SK Collet Approval (2022), Excellent Workplace Innovation Company (2021), Designated as Excellent Technology Research Center (ATC, 2016), KIBO A+ Members Company Selection, Selected as Innovation-driven SME (2005).
- **Awards**: Grand Prize for Venture Companies (Prime Minister, 2006), Export Tower Award on Trade Day (2008), Gyeonggi Province SME Technology Innovation Grand Prize (2008), Minister of Economy and Finance Award for Exemplary Taxpayers (2008), Uiwang Chamber of Commerce Grand Prize (2012), Korea Patent Grand Prize (Ministry of Trade, Industry and Energy, 2016), Korea Creative Applied Science Society Grand Prize (2017), ATC Technology Innovation Award, Minister of Trade, Industry and Energy Award (2025, Vice President Cha Sang-hoon), Minister of Industry Award on Commerce Day (2023), Minister of Trade, Industry and Energy Commendation (2010, 2016).**Awards**: Grand Prize for Venture Companies (Prime Minister, 2006), Export Tower Award on Trade Day (2008), Gyeonggi Province SME Technology Innovation Grand Prize (2008), Minister of Economy and Finance Award for Exemplary Taxpayers (2008), Uiwang Chamber of Commerce Grand Prize (2012), Korea Patent Grand Prize (Ministry of Trade, Industry and Energy, 2016), Korea Creative Applied Science Society Grand Prize (2017), ATC Technology Innovation Award, Minister of Trade, Industry and Energy Award (2025, Vice President Cha Sang-hoon), Minister of Industry Award on Commerce Day (2023), Minister of Trade, Industry and Energy Commendation (2010, 2016).
- **Patents**: "Method for Assembling Test Socket and DUT Board Using Bonding" (Registration No. 10-2051354-0000, registered on 2019-11-27), "Test Socket" (2021). Holds numerous patents and utility model rights, advocating for patent management strategies including IP talent development and licensing strategy formulation.**Patents**: "Method for Assembling Test Socket and DUT Board Using Bonding" (Registration No. 10-2051354-0000, registered on 2019-11-27), "Test Socket" (2021). Holds numerous patents and utility model rights, advocating for patent management strategies including IP talent development and licensing strategy formulation.
Introduction
Location
13 Ojeongongeop-gil, Uiwang-si, Gyeonggi-do, South Korea
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