Information
13 Ojeongongeop-gil, Uiwang-si, Gyeonggi-do, South Korea
+82 31-460-3588
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Overview
- Summary
- OKINS Electronics is a leading supplier of device interface systems, specializing in semiconductor inspection sockets and related test solutions. The company successfully localized burn-in sockets for the first time in Korea, contributing to the technological independence of the semiconductor industry. It possesses specialized capabilities in developing and manufacturing high-performance test sockets and interface solutions. Recently, with the growth of the AI-related high-spec memory test market, the company is expanding its business into high-value products such as HBM magnetic collets and sockets for CLT (Chambered Low Frequency Memory Tester). The company's main businesses include the manufacturing of semiconductor inspection sockets and semiconductor test services.OKINS Electronics is a leading supplier of device interface systems, specializing in semiconductor inspection sockets and related test solutions. The company successfully localized burn-in sockets for the first time in Korea, contributing to the technological independence of the semiconductor industry. It possesses specialized capabilities in developing and manufacturing high-performance test sockets and interface solutions. Recently, with the growth of the AI-related high-spec memory test market, the company is expanding its business into high-value products such as HBM magnetic collets and sockets for CLT (Chambered Low Frequency Memory Tester). The company's main businesses include the manufacturing of semiconductor inspection sockets and semiconductor test services.
- Key Products/Technologies
- Semiconductor Inspection Sockets: Burn-in sockets and test socket product lines. Burn-in sockets for testing semiconductor operation in high-temperature environments, successfully localized for the first time in Korea. A diverse lineup of test sockets for various semiconductor packages, including BGA, CSP, QFN, MLF, TQFP, TSOP, and WLCSP.Semiconductor Inspection Sockets: Burn-in sockets and test socket product lines. Burn-in sockets for testing semiconductor operation in high-temperature environments, successfully localized for the first time in Korea. A diverse lineup of test sockets for various semiconductor packages, including BGA, CSP, QFN, MLF, TQFP, TSOP, and WLCSP.
- Sockets and Connectors for High-Efficiency CLT (Chambered Low Frequency Memory Tester): Capability to exclusively supply sockets and connectors in response to domestic memory manufacturers' transition to high-efficiency CLT equipment.Sockets and Connectors for High-Efficiency CLT (Chambered Low Frequency Memory Tester): Capability to exclusively supply sockets and connectors in response to domestic memory manufacturers' transition to high-efficiency CLT equipment.
- Spring Pins and Probe Pins: Development and mass production of spring pins, consumable components acting as interposers within DRAM probe cards. Supply of high-difficulty technology products such as interposer pogo pins for wafer testing.Spring Pins and Probe Pins: Development and mass production of spring pins, consumable components acting as interposers within DRAM probe cards. Supply of high-difficulty technology products such as interposer pogo pins for wafer testing.
- Magnetic Collets: Development of HBM magnetic collets to address the growing AI-related high-spec memory test market. Ongoing technological development to respond to next-generation bonding methods.Magnetic Collets: Development of HBM magnetic collets to address the growing AI-related high-spec memory test market. Ongoing technological development to respond to next-generation bonding methods.
- Connectors and Other Components: Manufacturing of battery connectors for electric vehicles, 5G communication connectors, and test board connectors applied to high-density fine-pitch semiconductor wafer equipment. Capability to develop slimmed-down battery connectors.Connectors and Other Components: Manufacturing of battery connectors for electric vehicles, 5G communication connectors, and test board connectors applied to high-density fine-pitch semiconductor wafer equipment. Capability to develop slimmed-down battery connectors.
- Semiconductor Test Services: Provision of semiconductor test services, including package testing and wafer testing.Semiconductor Test Services: Provision of semiconductor test services, including package testing and wafer testing.
- Core Advantages
- Successful Localization of Burn-in Sockets and Technological Self-Reliance: A company that contributed to the technological independence of the semiconductor industry by successfully localizing burn-in sockets in 1998. Achieving technological self-reliance in a highly foreign-dependent field and receiving high evaluations from global semiconductor companies based on quality reliability.Successful Localization of Burn-in Sockets and Technological Self-Reliance: A company that contributed to the technological independence of the semiconductor industry by successfully localizing burn-in sockets in 1998. Achieving technological self-reliance in a highly foreign-dependent field and receiving high evaluations from global semiconductor companies based on quality reliability.
- Diversification of High-Performance and High-Value Product Portfolio: Securing stable growth engines by expanding business areas beyond traditional burn-in sockets to HBM magnetic collets, CLT sockets, EV battery connectors, and 5G communication connectors. A strategy of expanding into high-value products with the growth of the AI-related high-spec memory test market.Diversification of High-Performance and High-Value Product Portfolio: Securing stable growth engines by expanding business areas beyond traditional burn-in sockets to HBM magnetic collets, CLT sockets, EV battery connectors, and 5G communication connectors. A strategy of expanding into high-value products with the growth of the AI-related high-spec memory test market.
- Proactive R&D and Technological Competitiveness: Showcasing high-value products with significantly improved precision and durability through continuous R&D. Efforts to enhance technological competitiveness by strengthening product lineups based on high precision and high durability. Development of strategic products to meet demand in the AI and high-performance computing markets.Proactive R&D and Technological Competitiveness: Showcasing high-value products with significantly improved precision and durability through continuous R&D. Efforts to enhance technological competitiveness by strengthening product lineups based on high precision and high durability. Development of strategic products to meet demand in the AI and high-performance computing markets.
- In-house Plating Process and Automated Facility Investment: A company that completed global supply chain vertical integration through in-house plating processes. Securing production efficiency and quality competitiveness by completing automated facility investments for connector quality and yield improvement.In-house Plating Process and Automated Facility Investment: A company that completed global supply chain vertical integration through in-house plating processes. Securing production efficiency and quality competitiveness by completing automated facility investments for connector quality and yield improvement.
- Close Collaboration and Trust with Major Clients: A company that supplies test sockets to major domestic and international semiconductor manufacturers and equipment companies, including Samsung Electronics and SK Hynix. Capability to provide sockets for checking semiconductor operation for a certain period in customer test environments and for performance testing of semiconductor chips.Close Collaboration and Trust with Major Clients: A company that supplies test sockets to major domestic and international semiconductor manufacturers and equipment companies, including Samsung Electronics and SK Hynix. Capability to provide sockets for checking semiconductor operation for a certain period in customer test environments and for performance testing of semiconductor chips.
- Stable Business Structure and Market Responsiveness: The business structure involves consumable components like test sockets and burn-in sockets used in semiconductor post-processing, generating continuous replacement demand regardless of equipment order cycles. Providing supply capabilities and customized technical solutions that quickly respond to increasing market demand.Stable Business Structure and Market Responsiveness: The business structure involves consumable components like test sockets and burn-in sockets used in semiconductor post-processing, generating continuous replacement demand regardless of equipment order cycles. Providing supply capabilities and customized technical solutions that quickly respond to increasing market demand.
- Target Industries
- Semiconductor Industry (Memory Semiconductors, Non-Memory Semiconductors, High Bandwidth Memory (HBM), LPDDR, etc.)Semiconductor Industry (Memory Semiconductors, Non-Memory Semiconductors, High Bandwidth Memory (HBM), LPDDR, etc.)
- Electric Vehicle Industry (Battery Connectors)Electric Vehicle Industry (Battery Connectors)
- 5G Communication Industry (Communication Connectors, Small Cell Base Stations)5G Communication Industry (Communication Connectors, Small Cell Base Stations)
- Mobile and Server Memory MarketMobile and Server Memory Market
- AI and High-Performance Computing (HPC) MarketAI and High-Performance Computing (HPC) Market
- Major Markets
- China, Taiwan, Singapore, Philippines, Japan, South KoreaChina, Taiwan, Singapore, Philippines, Japan, South Korea
- UK, EuropeUK, Europe
- USAUSA
- Certifications/Patents
- Possession of quality and environmental management system certifications such as ISO 9001 (2004, 2018), ISO 14001 (2004, 2018), and ISO 45001 (2021).Possession of quality and environmental management system certifications such as ISO 9001 (2004, 2018), ISO 14001 (2004, 2018), and ISO 45001 (2021).
- Certifications for technological excellence, including Excellent Technology Evaluation Company Certification (T-3 Top-tier, 2017), designation as an Excellent Technology Research Center (ATC, 2016), selection as a KIBO A+ Members company, and selection as an Innovative Small and Medium-sized Enterprise (2005).Certifications for technological excellence, including Excellent Technology Evaluation Company Certification (T-3 Top-tier, 2017), designation as an Excellent Technology Research Center (ATC, 2016), selection as a KIBO A+ Members company, and selection as an Innovative Small and Medium-sized Enterprise (2005).
- Acquisition of major client quality certifications such as HKMC SQ certification (2022) and SK Collet approval (2022).Acquisition of major client quality certifications such as HKMC SQ certification (2022) and SK Collet approval (2022).
- Numerous awards, including the Venture Company Grand Prize (Prime Minister, 2006), Export Tower Award on Trade Day (2008), Gyeonggi Province SME Technology Innovation Grand Prize (2008), and Minister of Trade, Industry and Energy Commendation (2013, 2016).Numerous awards, including the Venture Company Grand Prize (Prime Minister, 2006), Export Tower Award on Trade Day (2008), Gyeonggi Province SME Technology Innovation Grand Prize (2008), and Minister of Trade, Industry and Energy Commendation (2013, 2016).
- Patents: Multiple patents related to semiconductor test sockets, including "Assembly Method of Test Socket and DUT Board Using Bonding" (Registration No. 10-2051354-0000, 2019-11-27). Technical patents cover rubber contact test boards, MEMS films for test sockets with improved contact, non-aligned elastic contactors, pressurized contact pins for semiconductor package test sockets, test sockets with flexible contact composites, fastening devices for socket attachment/detachment, board-integrated RF interposer units, and pogo pins for semiconductor testing.Patents: Multiple patents related to semiconductor test sockets, including "Assembly Method of Test Socket and DUT Board Using Bonding" (Registration No. 10-2051354-0000, 2019-11-27). Technical patents cover rubber contact test boards, MEMS films for test sockets with improved contact, non-aligned elastic contactors, pressurized contact pins for semiconductor package test sockets, test sockets with flexible contact composites, fastening devices for socket attachment/detachment, board-integrated RF interposer units, and pogo pins for semiconductor testing.
- Recognition for excellence in patent management with the Grand Prize in the Corporate Sector at the 2017 Patent Management Awards.Recognition for excellence in patent management with the Grand Prize in the Corporate Sector at the 2017 Patent Management Awards.
Introduction
Location
13 Ojeongongeop-gil, Uiwang-si, Gyeonggi-do, South Korea
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