Information
South Korea, Busan, Nam-gu, Yongso-ro, 45
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Overview
- Summary
- OHLABS Co., Ltd. is a venture company established by Professor Oh Jung-hwan of Pukyong National University's Department of Biomedical Engineering, specializing in non-destructive ultrasonic inspection equipment based on high-speed scanning and high-frequency ultrasonic sensor technology. The company provides high-performance inspection solutions for various industrial sectors including semiconductors, power semiconductors, electronic components, secondary batteries, and composite materials. It possesses capabilities in developing and manufacturing advanced Scanning Acoustic Microscopy (SAM) series, automated inspection systems, ultrasonic pulser/receivers, and transducers. OHLABS aims to enhance customer research and production efficiency through its technology-driven approach.OHLABS Co., Ltd. is a venture company established by Professor Oh Jung-hwan of Pukyong National University's Department of Biomedical Engineering, specializing in non-destructive ultrasonic inspection equipment based on high-speed scanning and high-frequency ultrasonic sensor technology. The company provides high-performance inspection solutions for various industrial sectors including semiconductors, power semiconductors, electronic components, secondary batteries, and composite materials. It possesses capabilities in developing and manufacturing advanced Scanning Acoustic Microscopy (SAM) series, automated inspection systems, ultrasonic pulser/receivers, and transducers. OHLABS aims to enhance customer research and production efficiency through its technology-driven approach.
- Key Products/Technologies
- The SAM (Scanning Acoustic Microscopy) series is advanced non-destructive ultrasonic inspection equipment for high-resolution internal material inspection, including TSAM (Traditional SAM), FSAM (Fast SAM), and RSAM (Rotary SAM) models. FSAM features a high-speed scanning module, significantly reducing inspection time. RSAM-12” is ultrasonic inspection equipment specifically for semiconductor wafers, equipped with automatic wafer rotary scanning capabilities.The SAM (Scanning Acoustic Microscopy) series is advanced non-destructive ultrasonic inspection equipment for high-resolution internal material inspection, including TSAM (Traditional SAM), FSAM (Fast SAM), and RSAM (Rotary SAM) models. FSAM features a high-speed scanning module, significantly reducing inspection time. RSAM-12” is ultrasonic inspection equipment specifically for semiconductor wafers, equipped with automatic wafer rotary scanning capabilities.
- The Automation SAM series is a fully automated inspection system covering pick & place, ultrasonic scanning, drying, and data analysis. It includes the USI TSAM 350, an automated inspection system for power semiconductors, and the USI RSAM 300, an automated inspection system for semiconductor wafers. The USI RSAM 300 is the first in Korea to adopt a non-destructive ultrasonic rotary inspection method for wafers, reducing inspection time by up to 20 times compared to conventional methods.The Automation SAM series is a fully automated inspection system covering pick & place, ultrasonic scanning, drying, and data analysis. It includes the USI TSAM 350, an automated inspection system for power semiconductors, and the USI RSAM 300, an automated inspection system for semiconductor wafers. The USI RSAM 300 is the first in Korea to adopt a non-destructive ultrasonic rotary inspection method for wafers, reducing inspection time by up to 20 times compared to conventional methods.
- Ultrasonic Pulser / Receiver are core components for ultrasonic inspection, offering PR300 and HVPR300 models. The PR300 features technical specifications such as a fixed voltage of 90V, pulse width of 5-50ns, bandwidth of 30MHz, 14-bit resolution, and a sampling rate of 100MHz. Ultrasonic Transducers provide excellent resolution through high signal-to-noise ratio (SNR) and wideband design with short wavelengths.Ultrasonic Pulser / Receiver are core components for ultrasonic inspection, offering PR300 and HVPR300 models. The PR300 features technical specifications such as a fixed voltage of 90V, pulse width of 5-50ns, bandwidth of 30MHz, 14-bit resolution, and a sampling rate of 100MHz. Ultrasonic Transducers provide excellent resolution through high signal-to-noise ratio (SNR) and wideband design with short wavelengths.
- Intelligent PIG is intelligent inspection equipment that precisely detects internal pipeline defects, based on four core technologies: real-time sensor measurement, ultrasonic diagnosis, life prediction, and location mapping. Key features include real-time inspection during operation, precise diagnosis, data-driven analysis, and cost-effectiveness through regular diagnostics. The Wireless Ultrasonic Module utilizes wireless ultrasonic technology.Intelligent PIG is intelligent inspection equipment that precisely detects internal pipeline defects, based on four core technologies: real-time sensor measurement, ultrasonic diagnosis, life prediction, and location mapping. Key features include real-time inspection during operation, precise diagnosis, data-driven analysis, and cost-effectiveness through regular diagnostics. The Wireless Ultrasonic Module utilizes wireless ultrasonic technology.
- Core Advantages
- Proprietary core technology localization capability is a key competitive advantage for OHLABS Co., Ltd., demonstrating the ability to independently develop and localize critical components such as ultrasonic sensors, pulser/receivers, and inspection software. This localization reduces technological dependence and ensures stable product supply.Proprietary core technology localization capability is a key competitive advantage for OHLABS Co., Ltd., demonstrating the ability to independently develop and localize critical components such as ultrasonic sensors, pulser/receivers, and inspection software. This localization reduces technological dependence and ensures stable product supply.
- High-speed and high-resolution non-destructive inspection technology is a differentiating factor that maximizes inspection efficiency. FSAM offers significantly faster inspection speeds than conventional ultrasonic inspection devices, reducing inspection time by approximately 10 times for various applications including semiconductors, display panels, and weld defects. The Automation SAM series utilizes high-speed scanning modules to reduce tact time by up to 30 times compared to existing methods.High-speed and high-resolution non-destructive inspection technology is a differentiating factor that maximizes inspection efficiency. FSAM offers significantly faster inspection speeds than conventional ultrasonic inspection devices, reducing inspection time by approximately 10 times for various applications including semiconductors, display panels, and weld defects. The Automation SAM series utilizes high-speed scanning modules to reduce tact time by up to 30 times compared to existing methods.
- AI-based inspection solutions provide a technological edge by enabling precise defect detection and analysis. Through collaboration with AI software specialist PIE, OHLABS develops systems integrated with AI algorithms, applying them to internal defect inspection of semiconductor wafers and power chips.AI-based inspection solutions provide a technological edge by enabling precise defect detection and analysis. Through collaboration with AI software specialist PIE, OHLABS develops systems integrated with AI algorithms, applying them to internal defect inspection of semiconductor wafers and power chips.
- The establishment of fully automated systems is a significant competitive advantage, leading to enhanced productivity, improved quality, and reduced costs. These solutions automate every step of the inspection process, from pick & place and ultrasonic scanning to drying and data analysis, overcoming the limitations of traditional equipment.The establishment of fully automated systems is a significant competitive advantage, leading to enhanced productivity, improved quality, and reduced costs. These solutions automate every step of the inspection process, from pick & place and ultrasonic scanning to drying and data analysis, overcoming the limitations of traditional equipment.
- Providing a wide range of solutions applicable to diverse industrial sectors enhances market expandability. OHLABS offers non-destructive ultrasonic inspection solutions across advanced industries such as semiconductor wafers, power semiconductors, electrical/electronic components, secondary batteries, and composite materials.Providing a wide range of solutions applicable to diverse industrial sectors enhances market expandability. OHLABS offers non-destructive ultrasonic inspection solutions across advanced industries such as semiconductor wafers, power semiconductors, electrical/electronic components, secondary batteries, and composite materials.
- Continuous investment in research and development (R&D) and technological innovation forms the basis for securing future growth engines. Through its corporate research institute, OHLABS strives to present new paradigms in next-generation non-destructive ultrasonic inspection technology and participates in the development of technologies such as High-Intensity Focused Ultrasound (HIFU) and Photoacoustic Microscopy (PAM).Continuous investment in research and development (R&D) and technological innovation forms the basis for securing future growth engines. Through its corporate research institute, OHLABS strives to present new paradigms in next-generation non-destructive ultrasonic inspection technology and participates in the development of technologies such as High-Intensity Focused Ultrasound (HIFU) and Photoacoustic Microscopy (PAM).
- Target Industrie
- Semiconductor Wafer InspectionSemiconductor Wafer Inspection
- Power Semiconductor InspectionPower Semiconductor Inspection
- Electrical & Electronic Components Inspection (e.g., MLCC)Electrical & Electronic Components Inspection (e.g., MLCC)
- Rechargeable Batteries (Secondary Batteries) InspectionRechargeable Batteries (Secondary Batteries) Inspection
- Composite Material InspectionComposite Material Inspection
- Display Panel InspectionDisplay Panel Inspection
- Pipeline Internal Defect InspectionPipeline Internal Defect Inspection
- Research and Educational InstitutionsResearch and Educational Institutions
- Skin Beauty and Animal Experimentation Equipment (utilizing HIFU)Skin Beauty and Animal Experimentation Equipment (utilizing HIFU)
- Major Markets
- South KoreaSouth Korea
- Certifications/Patents
- Venture Company Certification acquired in 2018Venture Company Certification acquired in 2018
- Corporate Research Institute recognized in 2020-2021Corporate Research Institute recognized in 2020-2021
- Contract signed for SME Technology Innovation Development Project in 2019Contract signed for SME Technology Innovation Development Project in 2019
- Awarded Grand Prize in the National Regional Preliminaries of the Innovation Startup League in 2019Awarded Grand Prize in the National Regional Preliminaries of the Innovation Startup League in 2019
- Investment attracted through Korea Technology Finance Corporation's U-TECH Valley in 2018Investment attracted through Korea Technology Finance Corporation's U-TECH Valley in 2018
- Development of ultrasonic transducers, pulser/receivers, and AI-based defect detection software in 2020-2021Development of ultrasonic transducers, pulser/receivers, and AI-based defect detection software in 2020-2021
- Development of ultrasonic-based non-destructive internal defect high-speed inspection equipment (FSAM) in 2022Development of ultrasonic-based non-destructive internal defect high-speed inspection equipment (FSAM) in 2022
- Development of Auto Wafer Rotary Scanning Acoustic Microscopy in 2023Development of Auto Wafer Rotary Scanning Acoustic Microscopy in 2023
- Development of Ultrasonic Pipeline Inspection Gauges (PIGs) module in 2024Development of Ultrasonic Pipeline Inspection Gauges (PIGs) module in 2024
- Development of non-destructive ultrasonic internal defect automated inspection equipment in 2025Development of non-destructive ultrasonic internal defect automated inspection equipment in 2025
Introduction
Location
South Korea, Busan, Nam-gu, Yongso-ro, 45
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