OE Solutions is a global company specializing in the development and production of high-performance, high-quality optical transceiver solutions for wired and wireless communication markets. The company supplies essential optoelectronic transceiver solutions for various wired and wireless communication applications, including wireless backhaul, MANs, LANs, SANs, PONs, and HD video transmission. A key focus is on developing next-generation optical communication components crucial for the expansion of AI data centers and 5G/6G communication infrastructure.OESolutionsisaglobalcompanyspecializinginthedevelopmentandproductionofhigh-performance,high-qualityopticaltransceiversolutionsforwiredandwirelesscommunicationmarkets.Thecompanysuppliesessentialoptoelectronictransceiversolutionsforvariouswiredandwirelesscommunicationapplications,includingwirelessbackhaul,MANs,LANs,SANs,PONs,andHDvideotransmission.Akeyfocusisondevelopingnext-generationopticalcommunicationcomponentscrucialfortheexpansionofAIdatacentersand5G/6Gcommunicationinfrastructure.
Key Products/TechnologiesKeyProducts/Technologies
Optical Transceivers: Continuous-mode transceivers for a wide range of point-to-point connections, including metro and access connectivity, OSC, and front-haul, mid-haul, and back-haul for wireless and fixed broadband applications.OpticalTransceivers:Continuous-modetransceiversforawiderangeofpoint-to-pointconnections,includingmetroandaccessconnectivity,OSC,andfront-haul,mid-haul,andback-haulforwirelessandfixedbroadbandapplications.
Smart SFPs: Optical transceivers with integrated data processing capabilities for various functions such as protocol conversion, OAM, and sync bridging. Specifically, the TWAMP Smart SFP™ monitors and troubleshoots IP networks, providing OAM features for Layer 3 Service Level Assurance (SLA) at Gigabit Ethernet wire speed.SmartSFPs:Opticaltransceiverswithintegrateddataprocessingcapabilitiesforvariousfunctionssuchasprotocolconversion,OAM,andsyncbridging.Specifically,theTWAMPSmartSFP™monitorsandtroubleshootsIPnetworks,providingOAMfeaturesforLayer3ServiceLevelAssurance(SLA)atGigabitEthernetwirespeed.
Wavelength Tunable Optical Transceivers: Products supporting 96 wavelengths with a single unit, reducing inventory burden for telecommunication companies and enabling flexible network expansion. This technology is backed by over 30 domestic and international patents, including proprietary laser chip design and manufacturing process core technologies.WavelengthTunableOpticalTransceivers:Productssupporting96wavelengthswithasingleunit,reducinginventoryburdenfortelecommunicationcompaniesandenablingflexiblenetworkexpansion.Thistechnologyisbackedbyover30domesticandinternationalpatents,includingproprietarylaserchipdesignandmanufacturingprocesscoretechnologies.
AI Data Center Optimized Transceivers: The 1.6Tbps OSFP optical transceiver offers double the optical bandwidth of existing 800Gbps products, demonstrating compatibility with major AI data center InfiniBand switches and Smart NICs. It supports 1X1600G single connections as well as 2X800G, 4X400G, and 8X200G breakout modes.AIDataCenterOptimizedTransceivers:The1.6TbpsOSFPopticaltransceiveroffersdoubletheopticalbandwidthofexisting800Gbpsproducts,demonstratingcompatibilitywithmajorAIdatacenterInfiniBandswitchesandSmartNICs.Itsupports1X1600Gsingleconnectionsaswellas2X800G,4X400G,and8X200Gbreakoutmodes.
ELSFP (External Laser Source Form-factor Pluggable) Optical Module for CPO (Co-Packaged Optics): An external light source solution supplying light to CPO systems, providing O-band high-power light sources at 20dBm and 23dBm per channel. Its plug-in structure separates the laser source from the high-temperature switch ASIC environment, enhancing thermal efficiency and reliability.ELSFP(ExternalLaserSourceForm-factorPluggable)OpticalModuleforCPO(Co-PackagedOptics):AnexternallightsourcesolutionsupplyinglighttoCPOsystems,providingO-bandhigh-powerlightsourcesat20dBmand23dBmperchannel.Itsplug-instructureseparatesthelasersourcefromthehigh-temperatureswitchASICenvironment,enhancingthermalefficiencyandreliability.
In-house Core Optical Device Technology: Initiation of in-house mass production of laser diodes (LD) for optical transceivers, strengthening the localization of core components and enhancing cost competitiveness.In-houseCoreOpticalDeviceTechnology:Initiationofin-housemassproductionoflaserdiodes(LD)foropticaltransceivers,strengtheningthelocalizationofcorecomponentsandenhancingcostcompetitiveness.
Core AdvantagesCoreAdvantages
Technical Excellence and Customer-Centric Approach: Founded in 2003 by experts from Bell Lab and Samsung Electronics, the company offers differentiated solutions based on superior technical capabilities and a deep understanding of customer needs.TechnicalExcellenceandCustomer-CentricApproach:Foundedin2003byexpertsfromBellLabandSamsungElectronics,thecompanyoffersdifferentiatedsolutionsbasedonsuperiortechnicalcapabilitiesandadeepunderstandingofcustomerneeds.
Customized Solution Provision: Capability to consult, customize, and modify products to precisely meet specific customer requirements.CustomizedSolutionProvision:Capabilitytoconsult,customize,andmodifyproductstopreciselymeetspecificcustomerrequirements.
Vertical Integration of Core Technologies: In-house development and manufacturing of key components for optical transceiver design and production, including semiconductor devices, optical packaging, circuits, and mechanical structures, leading to enhanced product competitiveness and supply chain stability.VerticalIntegrationofCoreTechnologies:In-housedevelopmentandmanufacturingofkeycomponentsforopticaltransceiverdesignandproduction,includingsemiconductordevices,opticalpackaging,circuits,andmechanicalstructures,leadingtoenhancedproductcompetitivenessandsupplychainstability.
Leadership in Next-Generation Technologies: Successful independent development of wavelength tunable optical transceivers (world's third company to do so) and the launch of 1.6Tbps optical transceivers and ELSFP modules for CPO, positioning the company as a leader in future communication markets.LeadershipinNext-GenerationTechnologies:Successfulindependentdevelopmentofwavelengthtunableopticaltransceivers(world'sthirdcompanytodoso)andthelaunchof1.6TbpsopticaltransceiversandELSFPmodulesforCPO,positioningthecompanyasaleaderinfuturecommunicationmarkets.
Global Market Presence and R&D Capability: Established as a critical supplier to major telecommunication equipment manufacturers worldwide, securing a significant position in the global market. Approximately 40% of employees are dedicated to R&D, enabling rapid response to market changes and continuous technological advancement.GlobalMarketPresenceandR&DCapability:Establishedasacriticalsuppliertomajortelecommunicationequipmentmanufacturersworldwide,securingasignificantpositionintheglobalmarket.Approximately40%ofemployeesarededicatedtoR&D,enablingrapidresponsetomarketchangesandcontinuoustechnologicaladvancement.
Intellectual Property Protection: Securing over 30 domestic and international patents related to wavelength tunable laser chip design and manufacturing process core technologies, maintaining technological protection and market leadership.IntellectualPropertyProtection:Securingover30domesticandinternationalpatentsrelatedtowavelengthtunablelaserchipdesignandmanufacturingprocesscoretechnologies,maintainingtechnologicalprotectionandmarketleadership.
Fixed Broadband and Cable Access MarketsFixedBroadbandandCableAccessMarkets
AI Data Centers and High-Performance Computing (HPC) EnvironmentsAIDataCentersandHigh-PerformanceComputing(HPC)Environments
5G and 6G Communication Services5Gand6GCommunicationServices
Quantum Cryptography Communication InfrastructureQuantumCryptographyCommunicationInfrastructure
Long-distance Backbone Networks and DCI (Data Center Interconnect)Long-distanceBackboneNetworksandDCI(DataCenterInterconnect)
Major MarketsMajorMarkets
South Korea, Japan, China, TaiwanSouthKorea,Japan,China,Taiwan
Europe (major customers and design center)Europe(majorcustomersanddesigncenter)
USA (New Jersey and California offices, major export market, participation in large-scale optical communication network construction program BEAD)USA(NewJerseyandCaliforniaoffices,majorexportmarket,participationinlarge-scaleopticalcommunicationnetworkconstructionprogramBEAD)
South America (planned new product presentations)SouthAmerica(plannednewproductpresentations)
Certifications/PatentsCertifications/Patents
Secured over 30 domestic and international patents, including core technologies for wavelength tunable laser chip design and manufacturing processes.Securedover30domesticandinternationalpatents,includingcoretechnologiesforwavelengthtunablelaserchipdesignandmanufacturingprocesses.
Holds a total of 35 patent rights and 2 trademark rights.Holdsatotalof35patentrightsand2trademarkrights.
Selected as a World-Class 300 Company in 2012.SelectedasaWorld-Class300Companyin2012.
Recognized as a 'Good Company to Work For' and a 'Global Specialized Candidate Company' in 2013.Recognizedasa'GoodCompanytoWorkFor'anda'GlobalSpecializedCandidateCompany'in2013.
Awarded 4 Diamonds for the TWAMP Smart SFP™ at the Lightwave Innovation Awards in 2014.Awarded4DiamondsfortheTWAMPSmartSFP™attheLightwaveInnovationAwardsin2014.
Named one of Forbes Asia's '200 Best Under A Billion' in 2015.NamedoneofForbesAsia's'200BestUnderABillion'in2015.
Received the Lightwave Innovation Award for the CSC Lambdarich Transceiver in 2015.ReceivedtheLightwaveInnovationAwardfortheCSCLambdarichTransceiverin2015.
Awarded the 'Minister of Future Creation Science Award for Device Sector Excellence' at the Korea ICT Awards in 2015.Awardedthe'MinisterofFutureCreationScienceAwardforDeviceSectorExcellence'attheKoreaICTAwardsin2015.
Introduction
Location
53 Cheomdanyeonsin-ro 30beon-gil, Buk-gu, Kwangju, South Korea
클릭하여 위치 살펴보기
Information
53 Cheomdanyeonsin-ro 30beon-gil, Buk-gu, Kwangju, South Korea