Nexperia is a global semiconductor manufacturer headquartered in the Netherlands, specializing in essential discrete components, logic devices, and MOSFETs for automotive, industrial, mobile, and consumer applications. The company is known for its high-volume production capabilities and efficiency, serving as a key supplier of fundamental components that enable the basic functionality of various electronic designs. Spun off from NXP Semiconductors' Standard Products business unit, Nexperia is currently a subsidiary of Wingtech Technology. It employs over 12,500 people worldwide and ships more than 100 billion products annually.NexperiaisaglobalsemiconductormanufacturerheadquarteredintheNetherlands,specializinginessentialdiscretecomponents,logicdevices,andMOSFETsforautomotive,industrial,mobile,andconsumerapplications.Thecompanyisknownforitshigh-volumeproductioncapabilitiesandefficiency,servingasakeysupplieroffundamentalcomponentsthatenablethebasicfunctionalityofvariouselectronicdesigns.SpunofffromNXPSemiconductors'StandardProductsbusinessunit,NexperiaiscurrentlyasubsidiaryofWingtechTechnology.Itemploysover12,500peopleworldwideandshipsmorethan100billionproductsannually.
Key Products/TechnologiesKeyProducts/Technologies
Diodes: A comprehensive portfolio including rectifier diodes, Schottky diodes, fast recovery diodes, TVS diodes, Zener diodes, and automotive diodes. Widely utilized in power supplies, battery management, and electrical protection circuits.Diodes:Acomprehensiveportfolioincludingrectifierdiodes,Schottkydiodes,fastrecoverydiodes,TVSdiodes,Zenerdiodes,andautomotivediodes.Widelyutilizedinpowersupplies,batterymanagement,andelectricalprotectioncircuits.
Bipolar Transistors: A diverse range including general purpose and low VCEsat bipolar transistors, resistor-equipped transistors, special feature transistors, and automotive bipolar transistors. Essential components for amplification and switching circuits.BipolarTransistors:AdiverserangeincludinggeneralpurposeandlowVCEsatbipolartransistors,resistor-equippedtransistors,specialfeaturetransistors,andautomotivebipolartransistors.Essentialcomponentsforamplificationandswitchingcircuits.
MOSFETs: Low- to mid-voltage (12-200V) P- and N-channel silicon MOSFETs, NextPower series, PMCB60XN (30V), 40-100V automotive MLPAK MOSFETs, 1200V SiC MOSFETs (D2PAK-7, X.PAK packages), and 650V GaN FETs (bi-directional) for high-efficiency power management solutions.MOSFETs:Low-tomid-voltage(12-200V)P-andN-channelsiliconMOSFETs,NextPowerseries,PMCB60XN(30V),40-100VautomotiveMLPAKMOSFETs,1200VSiCMOSFETs(D2PAK-7,X.PAKpackages),and650VGaNFETs(bi-directional)forhigh-efficiencypowermanagementsolutions.
ESD Protection and TVS Devices: Solutions for electrostatic discharge (ESD) protection, transient voltage suppressor (TVS) diodes, EMI filtering, and common-mode chokes for signal conditioning. Offering the highest level of protection in the industry's smallest packages.ESDProtectionandTVSDevices:Solutionsforelectrostaticdischarge(ESD)protection,transientvoltagesuppressor(TVS)diodes,EMIfiltering,andcommon-modechokesforsignalconditioning.Offeringthehighestlevelofprotectionintheindustry'ssmallestpackages.
Analog & Logic ICs: CMOS logic gates (AND, OR, NOT, XOR), combinational and sequential logic devices (registers, counters, decoders), interface devices (bus drivers, transceivers), analog switches, multiplexers/demultiplexers, power management ICs, voltage translators, and energy harvesting PMICs (NEH2000BY) to meet various digital circuit and power management needs.Analog&LogicICs:CMOSlogicgates(AND,OR,NOT,XOR),combinationalandsequentiallogicdevices(registers,counters,decoders),interfacedevices(busdrivers,transceivers),analogswitches,multiplexers/demultiplexers,powermanagementICs,voltagetranslators,andenergyharvestingPMICs(NEH2000BY)tomeetvariousdigitalcircuitandpowermanagementneeds.
SiC Power Devices and IGBTs: SiC MOSFETs, SiC Schottky barrier diodes, and 600V IGBTs, representing wide-bandgap technology-based power semiconductors. Suitable for high-power applications and power conversion systems.SiCPowerDevicesandIGBTs:SiCMOSFETs,SiCSchottkybarrierdiodes,and600VIGBTs,representingwide-bandgaptechnology-basedpowersemiconductors.Suitableforhigh-powerapplicationsandpowerconversionsystems.
Advanced Packaging Technologies: Industry-leading small packages, side-wettable flanks for LED drivers, MLPAK, LFPAK, D2PAK-7, X.PAK with innovative top-side cooling technology, and CCPAK1212 package for power MOSFETs, enhancing space-saving and thermal performance.AdvancedPackagingTechnologies:Industry-leadingsmallpackages,side-wettableflanksforLEDdrivers,MLPAK,LFPAK,D2PAK-7,X.PAKwithinnovativetop-sidecoolingtechnology,andCCPAK1212packageforpowerMOSFETs,enhancingspace-savingandthermalperformance.
Core AdvantagesCoreAdvantages
High-Volume Production and Efficiency: Capability to ship over 100 billion products annually to a global customer base. Product efficiency recognized as an industry benchmark in process, size, power, and performance.High-VolumeProductionandEfficiency:Capabilitytoshipover100billionproductsannuallytoaglobalcustomerbase.Productefficiencyrecognizedasanindustrybenchmarkinprocess,size,power,andperformance.
Extensive Portfolio of Essential Semiconductors: Offering a wide range of critical components including diodes, bipolar transistors, MOSFETs, ESD protection devices, GaN FETs, and analog & logic ICs required for diverse electronic designs.ExtensivePortfolioofEssentialSemiconductors:Offeringawiderangeofcriticalcomponentsincludingdiodes,bipolartransistors,MOSFETs,ESDprotectiondevices,GaNFETs,andanalog&logicICsrequiredfordiverseelectronicdesigns.
Automotive-Grade Quality and Reliability: Attainment of stringent industry certifications such as IATF 16949, ISO 9001, ISO 14001, and ISO 45001. A broad product portfolio qualified to AEC-Q100/Q101 standards, offering extended temperature ranges and low defects per million (ppm) for high reliability.Automotive-GradeQualityandReliability:AttainmentofstringentindustrycertificationssuchasIATF16949,ISO9001,ISO14001,andISO45001.AbroadproductportfolioqualifiedtoAEC-Q100/Q101standards,offeringextendedtemperaturerangesandlowdefectspermillion(ppm)forhighreliability.
Technological Innovation and R&D Investment: Leading the development of advanced power technologies like GaN FETs and SiC MOSFETs. Introduction of energy harvesting PMICs and innovative packaging technologies such as CCPAK1212, MLPAK, LFPAK, and X.PAK to enhance performance and power density.TechnologicalInnovationandR&DInvestment:LeadingthedevelopmentofadvancedpowertechnologieslikeGaNFETsandSiCMOSFETs.IntroductionofenergyharvestingPMICsandinnovativepackagingtechnologiessuchasCCPAK1212,MLPAK,LFPAK,andX.PAKtoenhanceperformanceandpowerdensity.
Vertically Integrated Manufacturing and Stable Supply Chain Management: Operating vertically integrated manufacturing facilities across Europe and Asia. Ensuring optimized high-volume production and long-term product availability.VerticallyIntegratedManufacturingandStableSupplyChainManagement:OperatingverticallyintegratedmanufacturingfacilitiesacrossEuropeandAsia.Ensuringoptimizedhigh-volumeproductionandlong-termproductavailability.
Global Market Leadership: Holding the number one market share in small-signal diodes and transistors, and ESD protection devices. Achieving the second market share position in small-signal MOSFETs and automotive PowerMOS.GlobalMarketLeadership:Holdingthenumberonemarketshareinsmall-signaldiodesandtransistors,andESDprotectiondevices.Achievingthesecondmarketsharepositioninsmall-signalMOSFETsandautomotivePowerMOS.
Target IndustriesTargetIndustries
Automotive Industry: Extensive use in adaptive LED headlight controllers, electric vehicle battery management systems, ABS systems, body control, infotainment systems, and LED lighting in various vehicle electronic systems.AutomotiveIndustry:ExtensiveuseinadaptiveLEDheadlightcontrollers,electricvehiclebatterymanagementsystems,ABSsystems,bodycontrol,infotainmentsystems,andLEDlightinginvariousvehicleelectronicsystems.
Industrial Products: Applications in power management, power conversion, industrial control, robotics, and factory automation.IndustrialProducts:Applicationsinpowermanagement,powerconversion,industrialcontrol,robotics,andfactoryautomation.
Mobile and Consumer Electronics: Integration into smartphones, wearables, tablets, laptops, TVs, digital cameras, home theaters, Blu-ray players, and other mobile and consumer devices.MobileandConsumerElectronics:Integrationintosmartphones,wearables,tablets,laptops,TVs,digitalcameras,hometheaters,Blu-rayplayers,andothermobileandconsumerdevices.
Computing and Data Centers: Powering AI server power supplies and data center infrastructure.ComputingandDataCenters:PoweringAIserverpowersuppliesanddatacenterinfrastructure.
Telecommunications: Essential components for 5G communication equipment.Telecommunications:Essentialcomponentsfor5Gcommunicationequipment.
Power Infrastructure: Utilized in charging infrastructure, solar PV, and uninterruptible power supplies (UPS).PowerInfrastructure:Utilizedincharginginfrastructure,solarPV,anduninterruptiblepowersupplies(UPS).
Medical Technology: Components for medical devices and systems.MedicalTechnology:Componentsformedicaldevicesandsystems.
Aerospace and Defense: Electronic components for aerospace and defense industries.AerospaceandDefense:Electroniccomponentsforaerospaceanddefenseindustries.
Major MarketsMajorMarkets
China, Malaysia, Philippines, Japan, Hong Kong, Shanghai, Shenzhen, PenangChina,Malaysia,Philippines,Japan,HongKong,Shanghai,Shenzhen,Penang
Netherlands, Germany, United Kingdom, Across EuropeNetherlands,Germany,UnitedKingdom,AcrossEurope
United States, MexicoUnitedStates,Mexico
Certifications/PatentsCertifications/Patents
IATF 16949: Certification for Automotive Quality Management System Standard.IATF16949:CertificationforAutomotiveQualityManagementSystemStandard.
ISO 9001: Certification for Quality Management System Standard.ISO9001:CertificationforQualityManagementSystemStandard.
ISO 14001: Certification for Environmental Management System Standard.ISO14001:CertificationforEnvironmentalManagementSystemStandard.
ISO 45001: Certification for Occupational Health and Safety Management System Standard.ISO45001:CertificationforOccupationalHealthandSafetyManagementSystemStandard.
AEC-Q100/Q101: Compliance with Automotive Grade Qualification Standards for logic and discrete semiconductors.AEC-Q100/Q101:CompliancewithAutomotiveGradeQualificationStandardsforlogicanddiscretesemiconductors.
Patent Portfolio: Possession of over 200 patent families.PatentPortfolio:Possessionofover200patentfamilies.
GaN Power Device Patent License: Acquisition of a license to Cree (Wolfspeed)'s extensive gallium nitride (GaN) power device patent portfolio, including over 300 issued U.S. and foreign patents.GaNPowerDevicePatentLicense:AcquisitionofalicensetoCree(Wolfspeed)'sextensivegalliumnitride(GaN)powerdevicepatentportfolio,includingover300issuedU.S.andforeignpatents.
ESD Protection Semiconductor Device: Technology for an ESD protection semiconductor device under patent number 12610623.ESDProtectionSemiconductorDevice:TechnologyforanESDprotectionsemiconductordeviceunderpatentnumber12610623.
Semiconductor Package and Manufacturing Method: Technology for a semiconductor package and its manufacturing method under application number 20260136982.SemiconductorPackageandManufacturingMethod:Technologyforasemiconductorpackageanditsmanufacturingmethodunderapplicationnumber20260136982.
Switched Mode Power Supply: Technology for a switched mode power supply arranged for efficiently powering a range of loads under application number 20260121506.SwitchedModePowerSupply:Technologyforaswitchedmodepowersupplyarrangedforefficientlypoweringarangeofloadsunderapplicationnumber20260121506.
Method of Manufacturing a Semiconductor Device: Technology for a method of manufacturing a semiconductor device under application numbers 20260123503 and US20220246505A1.MethodofManufacturingaSemiconductorDevice:Technologyforamethodofmanufacturingasemiconductordeviceunderapplicationnumbers20260123503andUS20220246505A1.