Information
70 Yuseong-daero 1689beon-gil, Yuseong District, Daejeon, South Korea
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Overview
- Summary
- Nexensor is a company providing measurement sensors and solutions essential for product manufacturing and quality control processes in smart factories. It specializes in high-precision 3D optical metrology total solutions for semiconductor and advanced packaging processes. The company contributes to improving product quality and process efficiency through the development of reliable sensors. Accumulated precise measurement results are utilized as big data, evolving into AI-based world-class measurement solutions. A research, development, and production company offering next-generation 2D and 3D metrology equipment.Nexensor is a company providing measurement sensors and solutions essential for product manufacturing and quality control processes in smart factories. It specializes in high-precision 3D optical metrology total solutions for semiconductor and advanced packaging processes. The company contributes to improving product quality and process efficiency through the development of reliable sensors. Accumulated precise measurement results are utilized as big data, evolving into AI-based world-class measurement solutions. A research, development, and production company offering next-generation 2D and 3D metrology equipment.
- Key Products/Technologies
- Advanced Packaging Measurement Equipment: Offers product lines such as nxFemto™ (Die Warpage Measuring Equipment), nxNano™ (RDL/CD Metrology Equipment), nxChip™ (HCB Dishing Metrology Equipment), and nxMacro™ (Wafer Warpage Measurement Equipment).Advanced Packaging Measurement Equipment: Offers product lines such as nxFemto™ (Die Warpage Measuring Equipment), nxNano™ (RDL/CD Metrology Equipment), nxChip™ (HCB Dishing Metrology Equipment), and nxMacro™ (Wafer Warpage Measurement Equipment).
- White Light Interferometer Series: Provides ultra-high-speed and ultra-precision 3D measurement sensor product lines including WLI Series, nXI-2, and nXI-5.White Light Interferometer Series: Provides ultra-high-speed and ultra-precision 3D measurement sensor product lines including WLI Series, nXI-2, and nXI-5.
- Thickness Measurement Modules: Includes solutions like nXV-1 (Spectral Interference Displacement Laser Sensor) for various thickness measurements.Thickness Measurement Modules: Includes solutions like nXV-1 (Spectral Interference Displacement Laser Sensor) for various thickness measurements.
- Optical Triangulation 3D Modules: Offers 3D shape measurement modules such as NL-1 (Optical Triangulation Measurement Module).Optical Triangulation 3D Modules: Offers 3D shape measurement modules such as NL-1 (Optical Triangulation Measurement Module).
- FM1 Wafer Warpage Metrology Equipment: A system for high-speed scanning of the entire 300mm wafer in under 5 seconds, precisely measuring warpage, bow, and stress, featuring a patented vertical measurement method.FM1 Wafer Warpage Metrology Equipment: A system for high-speed scanning of the entire 300mm wafer in under 5 seconds, precisely measuring warpage, bow, and stress, featuring a patented vertical measurement method.
- CWS1 Chip Warpage Metrology Equipment: Capable of high-speed measurement over a large area (310mm x 310mm), supporting chip warpage measurement for 2.5D and 3D packaging processes.CWS1 Chip Warpage Metrology Equipment: Capable of high-speed measurement over a large area (310mm x 310mm), supporting chip warpage measurement for 2.5D and 3D packaging processes.
- CFM1 CMP Flatness Metrology Equipment: Precisely measures surface flatness, warpage, roughness, and voids after the CMP process.CFM1 CMP Flatness Metrology Equipment: Precisely measures surface flatness, warpage, roughness, and voids after the CMP process.
- HDM1 HCB Dishing Metrology Equipment: Provides ultra-precision optical metrology with 0.1nm repeatability for dishing in Hybrid Copper Bonding (HCB) processes.HDM1 HCB Dishing Metrology Equipment: Provides ultra-precision optical metrology with 0.1nm repeatability for dishing in Hybrid Copper Bonding (HCB) processes.
- ACM1 RDL/u-bump Metrology Equipment: Measures RDL patterns, micro-bumps, post-sawing groove depths, thin-film structures, and TSV depths in advanced packaging.ACM1 RDL/u-bump Metrology Equipment: Measures RDL patterns, micro-bumps, post-sawing groove depths, thin-film structures, and TSV depths in advanced packaging.
- nXF-3 Free-form Surface Measurement System: Applies Deflectometry technology to quantitatively measure warp and bow of highly reflective or transparent products like wafers and films.nXF-3 Free-form Surface Measurement System: Applies Deflectometry technology to quantitatively measure warp and bow of highly reflective or transparent products like wafers and films.
- nXI-2 Large-area White Light Interferometer Displacement Sensor: Features large-area (36mm x 27mm) high-speed measurement, thin-film separation, and applications in OLED display and semiconductor PCB packaging inspection/measurement.nXI-2 Large-area White Light Interferometer Displacement Sensor: Features large-area (36mm x 27mm) high-speed measurement, thin-film separation, and applications in OLED display and semiconductor PCB packaging inspection/measurement.
- nXI-5 Microscope Interferometer Sensor: A technology capable of ultra-precision, ultra-high-speed 3D multi-layer structure measurement.nXI-5 Microscope Interferometer Sensor: A technology capable of ultra-precision, ultra-high-speed 3D multi-layer structure measurement.
- Proprietary core technologies including optical metrology, circuit and opto-mechanics measurement, and algorithm software development capabilities.Proprietary core technologies including optical metrology, circuit and opto-mechanics measurement, and algorithm software development capabilities.
- Possession of various optical interferometry technologies such as white light, phase-shifting, shearing, and spectral interferometry, with the ability to apply them in combination based on process requirements.Possession of various optical interferometry technologies such as white light, phase-shifting, shearing, and spectral interferometry, with the ability to apply them in combination based on process requirements.
- Integration of image spectrometers and polarization cameras for simultaneous determination of multi-layer film thickness and refractive index.Integration of image spectrometers and polarization cameras for simultaneous determination of multi-layer film thickness and refractive index.
- Core Advantages
- Provision of differentiated solutions through proprietary 3D optical metrology core technologies and unique algorithm development capabilities.Provision of differentiated solutions through proprietary 3D optical metrology core technologies and unique algorithm development capabilities.
- Possession of proprietary metrology technology based on diffraction matrix (deflectometry) for precise measurement of wafer warpage up to 10mm, which is challenging for conventional interferometers.Possession of proprietary metrology technology based on diffraction matrix (deflectometry) for precise measurement of wafer warpage up to 10mm, which is challenging for conventional interferometers.
- Ownership of a unique patent for vertical wafer measurement, minimizing gravity effects and maximizing measurement precision.Ownership of a unique patent for vertical wafer measurement, minimizing gravity effects and maximizing measurement precision.
- Application of non-destructive inspection methods, enabling accurate real-time quality inspection without damaging products.Application of non-destructive inspection methods, enabling accurate real-time quality inspection without damaging products.
- Offering over 10 times higher spatial resolution and faster real-time inspection speeds compared to conventional non-destructive inspection methods, contributing to improved production line efficiency.Offering over 10 times higher spatial resolution and faster real-time inspection speeds compared to conventional non-destructive inspection methods, contributing to improved production line efficiency.
- Specialization and advanced technological capabilities in the semiconductor advanced packaging sector, accounting for 90% of total revenue.Specialization and advanced technological capabilities in the semiconductor advanced packaging sector, accounting for 90% of total revenue.
- Technological innovation in developing a metrology system combined with AFM (Atomic Force Microscope) for rapid full inspection in hybrid bonding processes.Technological innovation in developing a metrology system combined with AFM (Atomic Force Microscope) for rapid full inspection in hybrid bonding processes.
- Potential for evolution into world-class measurement solutions through AI-based vision inspection systems and big data utilization.Potential for evolution into world-class measurement solutions through AI-based vision inspection systems and big data utilization.
- Target Industries
- Semiconductor Industry: Advanced packaging, HBM (High Bandwidth Memory), wafer manufacturing and inspection, TSV processes, etc..Semiconductor Industry: Advanced packaging, HBM (High Bandwidth Memory), wafer manufacturing and inspection, TSV processes, etc..
- Display Industry: OLED display inspection and measurement, surface structure and shape inspection.Display Industry: OLED display inspection and measurement, surface structure and shape inspection.
- Secondary Battery Industry: Surface uniformity inspection and measurement.Secondary Battery Industry: Surface uniformity inspection and measurement.
- Automotive Industry: 3D shape measurement and inspection of advanced components.Automotive Industry: 3D shape measurement and inspection of advanced components.
- PCB Packaging Industry: Semiconductor PCB packaging inspection and measurement.PCB Packaging Industry: Semiconductor PCB packaging inspection and measurement.
- Smart Factory: Application of measurement sensors and solutions across product manufacturing and quality control processes.Smart Factory: Application of measurement sensors and solutions across product manufacturing and quality control processes.
- Major Markets
- South Korea, Taiwan, SingaporeSouth Korea, Taiwan, Singapore
- United StatesUnited States
- Certifications/Patents
- Scale-up TIPS Selection: Strengthening technology development capabilities through up to 1.2 billion KRW in R&D funding support.Scale-up TIPS Selection: Strengthening technology development capabilities through up to 1.2 billion KRW in R&D funding support.
- National R&D Projects: Participation in various national R&D projects including optical metrology/control equipment, optical application measurement standards, nano measurement technology, and general metrology.National R&D Projects: Participation in various national R&D projects including optical metrology/control equipment, optical application measurement standards, nano measurement technology, and general metrology.
- Proprietary Patent for Vertical Wafer Measurement: A patent for technology that minimizes gravity effects during wafer warpage measurement to enhance precision.Proprietary Patent for Vertical Wafer Measurement: A patent for technology that minimizes gravity effects during wafer warpage measurement to enhance precision.
- Patent related to 3D Free-form Surface Measurement Technology: Technology for fast and accurate measurement of warpage and defects on complex free-form surfaces.Patent related to 3D Free-form Surface Measurement Technology: Technology for fast and accurate measurement of warpage and defects on complex free-form surfaces.
- SK Hynix 8th Technology Innovation Partner Selection: Recognized as a partner with high potential for localization in the domestic semiconductor materials, parts, and equipment sector.SK Hynix 8th Technology Innovation Partner Selection: Recognized as a partner with high potential for localization in the domestic semiconductor materials, parts, and equipment sector.
Introduction
Location
70 Yuseong-daero 1689beon-gil, Yuseong District, Daejeon, South Korea
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