Information
70 Yuseong-daero 1689beon-gil, Yuseong District, Daejeon, South Korea
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Overview
- Summary
- Nexensor is a company providing measurement sensors and solutions essential for product manufacturing and quality control processes in smart factories [database]. It specializes in metrology solutions for semiconductor and advanced packaging processes, leveraging high-precision 3D optical measurement technology. The company utilizes accurate and precise measurement results as big data, aiming to evolve into world-class measurement solutions based on AI.Nexensor is a company providing measurement sensors and solutions essential for product manufacturing and quality control processes in smart factories [database]. It specializes in metrology solutions for semiconductor and advanced packaging processes, leveraging high-precision 3D optical measurement technology. The company utilizes accurate and precise measurement results as big data, aiming to evolve into world-class measurement solutions based on AI.
- Key Products/Technologies
- Advanced Packaging Measurement Equipment: Offering product lines such as nxFemto™ (Die Warpage Measuring Equipment), nxNano™ (RDL/CD Metrology Equipment), nxChip™ (HCB Dishing Metrology Equipment), and nxMacro™ (Wafer Warpage Measurement Equipment).Advanced Packaging Measurement Equipment: Offering product lines such as nxFemto™ (Die Warpage Measuring Equipment), nxNano™ (RDL/CD Metrology Equipment), nxChip™ (HCB Dishing Metrology Equipment), and nxMacro™ (Wafer Warpage Measurement Equipment).
- White Light Interferometer Series (WLI Series): High-speed and ultra-precision 3D measurement sensors, providing high reliability through advanced measurement technology. The nXI-2 model, in particular, offers precise measurement over large areas with fast scanning speeds, suitable for mass production lines, and applied to step, thickness, and multi-layer structure measurements in semiconductors, PCBs, and displays.White Light Interferometer Series (WLI Series): High-speed and ultra-precision 3D measurement sensors, providing high reliability through advanced measurement technology. The nXI-2 model, in particular, offers precise measurement over large areas with fast scanning speeds, suitable for mass production lines, and applied to step, thickness, and multi-layer structure measurements in semiconductors, PCBs, and displays.
- Free-form Surface Measurement System (nXF-3): Employing Deflectometry technology, this unique system measures warp and bow, and 3D shapes of highly reflective or transparent and flexible free-form objects like wafers, films, lenses, and glass.Free-form Surface Measurement System (nXF-3): Employing Deflectometry technology, this unique system measures warp and bow, and 3D shapes of highly reflective or transparent and flexible free-form objects like wafers, films, lenses, and glass.
- Microscope Interferometer Sensor (nXI-5): An ultra-precision, high-speed 3D multi-layer structure measurement sensor, utilized for micron-level measurements in semiconductor structures, bump measurements, display surface structures and shapes, and foreign object protrusions.Microscope Interferometer Sensor (nXI-5): An ultra-precision, high-speed 3D multi-layer structure measurement sensor, utilized for micron-level measurements in semiconductor structures, bump measurements, display surface structures and shapes, and foreign object protrusions.
- Optical Triangulation 3D Module (NL-1) and Spectral Interference Displacement Laser Sensor (nXV-1): Possessing optical sensor module technologies applicable to various measurement environments.Optical Triangulation 3D Module (NL-1) and Spectral Interference Displacement Laser Sensor (nXV-1): Possessing optical sensor module technologies applicable to various measurement environments.
- HBM 3D Metrology Equipment (nX-H1): Jointly developed and supplied with SK Hynix, securing advanced packaging metrology technology for High Bandwidth Memory (HBM).HBM 3D Metrology Equipment (nX-H1): Jointly developed and supplied with SK Hynix, securing advanced packaging metrology technology for High Bandwidth Memory (HBM).
- Core Advantages
- Expertise in 3D Optical Metrology Total Solutions: Providing differentiated 3D optical metrology total solutions specialized for semiconductor advanced packaging processes.Expertise in 3D Optical Metrology Total Solutions: Providing differentiated 3D optical metrology total solutions specialized for semiconductor advanced packaging processes.
- Proprietary Technology and Patents: Holding multiple original technology patents, ensuring product technology and price competitiveness.Proprietary Technology and Patents: Holding multiple original technology patents, ensuring product technology and price competitiveness.
- Customer-Tailored Solutions: Ability to develop and provide customized products and solutions according to specific customer requirements, unlike competitors who often offer standard models.Customer-Tailored Solutions: Ability to develop and provide customized products and solutions according to specific customer requirements, unlike competitors who often offer standard models.
- High-Speed and Ultra-Precision Measurement Technology: Contributing to process optimization and quality stability through high-precision 3D optical measurement technology, enabling full inspection hundreds of times faster than conventional methods.High-Speed and Ultra-Precision Measurement Technology: Contributing to process optimization and quality stability through high-precision 3D optical measurement technology, enabling full inspection hundreds of times faster than conventional methods.
- Capability for Challenging Material Measurement: Expertise in external inspection and 3D shape measurement of difficult-to-measure materials such as transparent or highly reflective lenses, glass, films, and wafers.Capability for Challenging Material Measurement: Expertise in external inspection and 3D shape measurement of difficult-to-measure materials such as transparent or highly reflective lenses, glass, films, and wafers.
- Big Data and AI-Driven Technological Advancement: Leveraging accurate and precise measurement results as big data to develop next-generation AI-based measurement solutions.Big Data and AI-Driven Technological Advancement: Leveraging accurate and precise measurement results as big data to develop next-generation AI-based measurement solutions.
- Collaboration with Industry Leaders: Establishing close cooperative relationships with major clients, exemplified by being selected as an SK Hynix technology innovation company and co-developing HBM 3D metrology equipment.Collaboration with Industry Leaders: Establishing close cooperative relationships with major clients, exemplified by being selected as an SK Hynix technology innovation company and co-developing HBM 3D metrology equipment.
- Target Industrie
- Smart Factory: Providing measurement sensors and solutions for enhancing efficiency in product manufacturing and quality processes [database, cite: 13, 17, 18, 19, 32].Smart Factory: Providing measurement sensors and solutions for enhancing efficiency in product manufacturing and quality processes [database, cite: 13, 17, 18, 19, 32].
- Semiconductor Industry: Offering precision metrology equipment for various structures in advanced packaging processes, wafer warpage, RDL/CD, TSV depth, and pre-hybrid bonding flatness.Semiconductor Industry: Offering precision metrology equipment for various structures in advanced packaging processes, wafer warpage, RDL/CD, TSV depth, and pre-hybrid bonding flatness.
- Display Industry: 3D height and shape measurement for precision components and parts, including OLED display inspection/measurement, PCB bumps, display column space, and transparent coating thickness measurement.Display Industry: 3D height and shape measurement for precision components and parts, including OLED display inspection/measurement, PCB bumps, display column space, and transparent coating thickness measurement.
- Secondary Battery Industry: Quality control and inspection in advanced manufacturing processes, such as surface uniformity inspection/measurement of secondary batteries.Secondary Battery Industry: Quality control and inspection in advanced manufacturing processes, such as surface uniformity inspection/measurement of secondary batteries.
- Automotive Industry: Quality control through 3D shape measurement and inspection.Automotive Industry: Quality control through 3D shape measurement and inspection.
- Major Markets
- South Korea, China, Taiwan (potential)South Korea, China, Taiwan (potential)
- United States (SEMICON West participation)United States (SEMICON West participation)
- Certifications/Patents
- Patent Holdings: Possessing multiple patents for original technologies, with 9 patents as of October 2025.Patent Holdings: Possessing multiple patents for original technologies, with 9 patents as of October 2025.
- Key Patent: A phase-shift based shape measurement device and method capable of simultaneously acquiring 2D and 3D shape information using laser and white light sources.Key Patent: A phase-shift based shape measurement device and method capable of simultaneously acquiring 2D and 3D shape information using laser and white light sources.
- Venture Confirmation Company: Certified as a venture company, recognized for its technological capabilities and growth potential.Venture Confirmation Company: Certified as a venture company, recognized for its technological capabilities and growth potential.
- SK Hynix Technology Innovation Company Selection: Selected as a Phase 8 SK Hynix Technology Innovation Company in 2025, acknowledging its technological prowess and reliability.SK Hynix Technology Innovation Company Selection: Selected as a Phase 8 SK Hynix Technology Innovation Company in 2025, acknowledging its technological prowess and reliability.
Introduction
Location
70 Yuseong-daero 1689beon-gil, Yuseong District, Daejeon, South Korea
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