Information
105 Geumil-ro 965beon-gil, Samseong-myeon, Eumseong, Chungcheongbuk-do, South Korea
+82 43-879-3043
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Overview
- Summary
- Nepes is a specialized system semiconductor back-end company established in 1990, offering advanced wafer-level packaging (WLP) turnkey services, including 8-inch and 12-inch flip-chip bumping and testing. It is a leading company that first commercialized high-value-added advanced packaging technologies such as Fan-out Wafer Level Package (FO-WLP) and Fan-out Panel Level Packaging (FO-PLP in Korea. The company is expanding its business into electronic materials for semiconductor and display manufacturing, and 2nd battery components.Nepes is a specialized system semiconductor back-end company established in 1990, offering advanced wafer-level packaging (WLP) turnkey services, including 8-inch and 12-inch flip-chip bumping and testing. It is a leading company that first commercialized high-value-added advanced packaging technologies such as Fan-out Wafer Level Package (FO-WLP) and Fan-out Panel Level Packaging (FO-PLP in Korea. The company is expanding its business into electronic materials for semiconductor and display manufacturing, and 2nd battery components.
- Key Products/Technologies
- Semiconductor Packaging and Test Services: Provision of advanced Wafer Level Packaging (WLP) turnkey services, including 8-inch and 12-inch flip-chip bumping and testing. This technology enables miniaturization, minimizes energy consumption, and reduces costs by performing packaging at the wafer level.Semiconductor Packaging and Test Services: Provision of advanced Wafer Level Packaging (WLP) turnkey services, including 8-inch and 12-inch flip-chip bumping and testing. This technology enables miniaturization, minimizes energy consumption, and reduces costs by performing packaging at the wafer level.
- Fan-out Wafer Level Package (FO-WLP): A technology that extends the redistribution layer (RDL) beyond the semiconductor die to increase signal input/output (I/O). This advanced packaging technology contributes to improved power efficiency and chip signal processing capabilities. It is a key technology for targeting wearable devices and automotive markets.Fan-out Wafer Level Package (FO-WLP): A technology that extends the redistribution layer (RDL) beyond the semiconductor die to increase signal input/output (I/O). This advanced packaging technology contributes to improved power efficiency and chip signal processing capabilities. It is a key technology for targeting wearable devices and automotive markets.
- Fan-out Panel Level Packaging (FO-PLP): The world's first successfully commercialized and mass-produced technology. Applying FO-PLP mass production technology to 600mm large square panels achieves approximately 5 times the processing capability compared to 300mm round panels. This technology significantly improves productivity by over 120% and innovatively reduces costs. It is a core technology applied in various fields such as mobile, communication, automotive, and data centers.Fan-out Panel Level Packaging (FO-PLP): The world's first successfully commercialized and mass-produced technology. Applying FO-PLP mass production technology to 600mm large square panels achieves approximately 5 times the processing capability compared to 300mm round panels. This technology significantly improves productivity by over 120% and innovatively reduces costs. It is a core technology applied in various fields such as mobile, communication, automotive, and data centers.
- 2.5D and 3D Packaging Technologies: Next-generation packaging technologies targeting the High-Performance Computing (HPC) and AI semiconductor markets. It utilizes RDL interposers and silicon bridges to target the chiplet market. This technology integrates multiple semiconductor chip dies horizontally or vertically to enhance data processing speed and power efficiency.2.5D and 3D Packaging Technologies: Next-generation packaging technologies targeting the High-Performance Computing (HPC) and AI semiconductor markets. It utilizes RDL interposers and silicon bridges to target the chiplet market. This technology integrates multiple semiconductor chip dies horizontally or vertically to enhance data processing speed and power efficiency.
- System in Package (SiP) / nSiP Technology: A technology for high-density packaging of active and passive components on the same plane. Essential for achieving thin, light, short, and small form factors in wearable devices, IoT, and AI semiconductors. Development of nSiP technology, which does not require a package printed circuit board (PCB), is underway.System in Package (SiP) / nSiP Technology: A technology for high-density packaging of active and passive components on the same plane. Essential for achieving thin, light, short, and small form factors in wearable devices, IoT, and AI semiconductors. Development of nSiP technology, which does not require a package printed circuit board (PCB), is underway.
- Electronic Materials Business: Production capability for high-purity functional wet chemical products such as developers, etchants, photoresists, cleaners, and polishing agents used in semiconductor and display manufacturing processes. Core material localization technology that formed the company's initial business foundation.Electronic Materials Business: Production capability for high-purity functional wet chemical products such as developers, etchants, photoresists, cleaners, and polishing agents used in semiconductor and display manufacturing processes. Core material localization technology that formed the company's initial business foundation.
- AI Semiconductors and Neuromorphic Semiconductors: Expansion into the neuromorphic artificial intelligence semiconductor (NM500) production business. Development capabilities for 'Metis,' an intelligent semiconductor for edge computing, and 'Janus,' an AI semiconductor equipped with self-learning NPU IP.AI Semiconductors and Neuromorphic Semiconductors: Expansion into the neuromorphic artificial intelligence semiconductor (NM500) production business. Development capabilities for 'Metis,' an intelligent semiconductor for edge computing, and 'Janus,' an AI semiconductor equipped with self-learning NPU IP.
- Core Advantages
- Leadership in Advanced Fan-out Packaging Technology: A leading advanced package foundry in Korea, uniquely supplying FO technology to global chipmakers. Securing a dominant technological edge with the world's first successful mass production of 600mm FO-PLP. Competitive advantage in a market with high technical difficulty and limited suppliers.Leadership in Advanced Fan-out Packaging Technology: A leading advanced package foundry in Korea, uniquely supplying FO technology to global chipmakers. Securing a dominant technological edge with the world's first successful mass production of 600mm FO-PLP. Competitive advantage in a market with high technical difficulty and limited suppliers.
- Turnkey Solution Provision Capability: Offering almost all back-end processes, from wafer-level packaging and fan-out packages to testing, as a full-turnkey service. Completion of vertical integration through subsidiaries Nepes Laweh (packaging) and Nepes Ark (testing). Enhancing convenience and efficiency for fabless customers.Turnkey Solution Provision Capability: Offering almost all back-end processes, from wafer-level packaging and fan-out packages to testing, as a full-turnkey service. Completion of vertical integration through subsidiaries Nepes Laweh (packaging) and Nepes Ark (testing). Enhancing convenience and efficiency for fabless customers.
- Dominant Position in High-Entry Barrier Markets: The WLP-based advanced packaging market has high entry barriers, requiring large-scale investment, high-level technology comparable to semiconductor fabs, and stringent quality demands from global chipmakers for automotive and smartphone applications. The company holds a unique position in Korea and possesses technology capable by only a limited number of companies worldwide.Dominant Position in High-Entry Barrier Markets: The WLP-based advanced packaging market has high entry barriers, requiring large-scale investment, high-level technology comparable to semiconductor fabs, and stringent quality demands from global chipmakers for automotive and smartphone applications. The company holds a unique position in Korea and possesses technology capable by only a limited number of companies worldwide.
- Innovative Productivity and Cost Competitiveness: PLP process technology improves mass production efficiency by over 120% by transitioning from circular-based FO package processes to square panel-based processes. The establishment of 600mm large square panels provides approximately 5 times the processing capacity compared to 300mm circular panels. The ability to simultaneously achieve high performance, miniaturization, and cost competitiveness.Innovative Productivity and Cost Competitiveness: PLP process technology improves mass production efficiency by over 120% by transitioning from circular-based FO package processes to square panel-based processes. The establishment of 600mm large square panels provides approximately 5 times the processing capacity compared to 300mm circular panels. The ability to simultaneously achieve high performance, miniaturization, and cost competitiveness.
- Future-Oriented Technology Portfolio Expansion: Securing technological capabilities for the next-generation semiconductor market, including 2.5D and 3D packaging, nSiP, neuromorphic AI semiconductors, and AI semiconductors for edge computing. Securing sustained growth drivers with specialized technology in high-value-added areas such as AI and automotive semiconductors.Future-Oriented Technology Portfolio Expansion: Securing technological capabilities for the next-generation semiconductor market, including 2.5D and 3D packaging, nSiP, neuromorphic AI semiconductors, and AI semiconductors for edge computing. Securing sustained growth drivers with specialized technology in high-value-added areas such as AI and automotive semiconductors.
- Global Customer Base and Quality Reliability: Applying advanced package solutions such as power management ICs, audio chips, antenna chips, and automotive radar sensors to products of global top-tier companies. A stable revenue base secured through major customers like North American fabless M company. A qualitative competitive advantage based on high yield and reliability.Global Customer Base and Quality Reliability: Applying advanced package solutions such as power management ICs, audio chips, antenna chips, and automotive radar sensors to products of global top-tier companies. A stable revenue base secured through major customers like North American fabless M company. A qualitative competitive advantage based on high yield and reliability.
- Target Industries
- Mobile devices (smartphones, wearable devices)Mobile devices (smartphones, wearable devices)
- Automotive (vehicle radar sensors, electric vehicles, autonomous driving)Automotive (vehicle radar sensors, electric vehicles, autonomous driving)
- High-Performance Computing (HPC) and AI semiconductors (AI servers, data centers)High-Performance Computing (HPC) and AI semiconductors (AI servers, data centers)
- Communication (5G)Communication (5G)
- Internet of Things (IoT) devicesInternet of Things (IoT) devices
- Display (IC chips for LCDs)Display (IC chips for LCDs)
- Energy Storage Systems (ESS) and electric vehicle batteriesEnergy Storage Systems (ESS) and electric vehicle batteries
- Major Markets
- South Korea, China, JapanSouth Korea, China, Japan
- Germany (R&D Center)Germany (R&D Center)
- United States (sales corporation, marketing and sales center)United States (sales corporation, marketing and sales center)
- Certifications/Patents
- Acquisition of US patent for semiconductor solder bumping technology in 2004Acquisition of US patent for semiconductor solder bumping technology in 2004
- Minister of Trade, Industry and Energy Commendation in 2016 (for contributions to material and component technology development)Minister of Trade, Industry and Energy Commendation in 2016 (for contributions to material and component technology development)
- Selected as one of the 'TOP 10 Packaging Companies with Core Technologies in the World' in a US White House report in 2021Selected as one of the 'TOP 10 Packaging Companies with Core Technologies in the World' in a US White House report in 2021
- Selected as a Next-Generation World-Class Product by the Ministry of Trade, Industry and Energy in 2022 (for 600mm FO-PLP)Selected as a Next-Generation World-Class Product by the Ministry of Trade, Industry and Energy in 2022 (for 600mm FO-PLP)
- Selected for a national project for original semiconductor technology development in 2023Selected for a national project for original semiconductor technology development in 2023
- Selected for the 'Innovation Premier 1000' by the Ministry of Trade, Industry and Energy in 2025 (semiconductor and display sector)Selected for the 'Innovation Premier 1000' by the Ministry of Trade, Industry and Energy in 2025 (semiconductor and display sector)
Introduction
Location
105 Geumil-ro 965beon-gil, Samseong-myeon, Eumseong, Chungcheongbuk-do, South Korea
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