Neontech is a technology-specialized company developing and manufacturing semiconductor post-processing equipment and industrial drones based on ultra-precision mechanical processing and automation control technology. The company holds a strong market position in the semiconductor and MLCC dicing equipment sector with its unique technological capabilities. Leveraging its precision control technology, it has successfully entered high-value-added industrial drone markets such as defense, logistics, and surveillance. Recently, Neontech expanded its business into the food tech sector by launching 'Boglebot,' an AI frying robot for kitchen automation in the F&B industry. Established in 2000, the company has grown in Mechanical Dicing and automation equipment, expanding its business to include PCB/semiconductor singulators, sapphire & ceramic breakers, and MLCC cutter equipment. Customer satisfaction is the top management goal, achieved through providing Fast Speed, System Approach, and Total Solution.Neontechisatechnology-specializedcompanydevelopingandmanufacturingsemiconductorpost-processingequipmentandindustrialdronesbasedonultra-precisionmechanicalprocessingandautomationcontroltechnology.ThecompanyholdsastrongmarketpositioninthesemiconductorandMLCCdicingequipmentsectorwithitsuniquetechnologicalcapabilities.Leveragingitsprecisioncontroltechnology,ithassuccessfullyenteredhigh-value-addedindustrialdronemarketssuchasdefense,logistics,andsurveillance.Recently,Neontechexpandeditsbusinessintothefoodtechsectorbylaunching'Boglebot,'anAIfryingrobotforkitchenautomationintheF&Bindustry.Establishedin2000,thecompanyhasgrowninMechanicalDicingandautomationequipment,expandingitsbusinesstoincludePCB/semiconductorsingulators,sapphire&ceramicbreakers,andMLCCcutterequipment.Customersatisfactionisthetopmanagementgoal,achievedthroughprovidingFastSpeed,SystemApproach,andTotalSolution.
Key Products/TechnologiesKeyProducts/Technologies
Semiconductor and Electronic Component Precision Processing Equipment: Automated equipment for precise dicing and separation of individual chips from semiconductor wafers, displays, and MLCCs. Key products include Dicing Saw, Saw & Sorter, MLCC Cutter equipment, and MicroLED Cutter equipment. The Dicing Saw features high-speed, high-precision spindles and a sophisticated vision system for micrometer-level precise cutting, being the first to be localized in Korea. The Saw & Sorter (NSS-5000/6000) is a mechanical dicing and sorting system for large PCB panels (up to 500x300mm), capable of processing ultra-thin packages (0.1t), featuring dual 2.4KW spindles and built-in PCB shrink compensation. The MLCC Cutter (NMC-1500), developed in 2015, is a fully automatic ceramic cutter series maximizing productivity with unique cutting time, ensuring high rigidity and stability with a unique stone-bridge half-bridge structure, and supporting a maximum machining area of 220x220mm. Sapphire and Ceramic Breakers (NBK-106H, NBK-107H) are fully automated wafer breaking systems for LED chip separation, utilizing Neontech's unique breaking blade synchronized with an electrical small hammer, with optimized breaking speed and hammer hit force for various laser scribing conditions.SemiconductorandElectronicComponentPrecisionProcessingEquipment:Automatedequipmentforprecisedicingandseparationofindividualchipsfromsemiconductorwafers,displays,andMLCCs.KeyproductsincludeDicingSaw,Saw&Sorter,MLCCCutterequipment,andMicroLEDCutterequipment.TheDicingSawfeatureshigh-speed,high-precisionspindlesandasophisticatedvisionsystemformicrometer-levelprecisecutting,beingthefirsttobelocalizedinKorea.TheSaw&Sorter(NSS-5000/6000)isamechanicaldicingandsortingsystemforlargePCBpanels(upto500x300mm),capableofprocessingultra-thinpackages(0.1t),featuringdual2.4KWspindlesandbuilt-inPCBshrinkcompensation.TheMLCCCutter(NMC-1500),developedin2015,isafullyautomaticceramiccutterseriesmaximizingproductivitywithuniquecuttingtime,ensuringhighrigidityandstabilitywithauniquestone-bridgehalf-bridgestructure,andsupportingamaximummachiningareaof220x220mm.SapphireandCeramicBreakers(NBK-106H,NBK-107H)arefullyautomatedwaferbreakingsystemsforLEDchipseparation,utilizingNeontech'suniquebreakingbladesynchronizedwithanelectricalsmallhammer,withoptimizedbreakingspeedandhammerhitforceforvariouslaserscribingconditions.
Industrial Drones and Robot Automation Systems: Entry into high-value-added industrial drone markets for defense, logistics delivery, surveillance, and firefighting. Securing differentiated technological competitiveness with multi-drone navigation software and hardware design technology, proprietary ground control programs, and communication systems. Models ND-840Z and ND-840P feature full-segment automatic flight, multi-purpose utilization, stable flight based on Octocopter, LTE communication-based flight, and an automatically unloading cargo box. Achieved the first public certification in Korea for high-payload drones (carrying over 10kg of cargo) with a flight range of approximately 20km. Developing and commercializing high-payload drones for cargo transport of over 40kg. Launched 'Boglebot,' an AI frying robot for kitchen automation in the F&B industry. Pursuing the development of a recoverable attack drone with AI autonomous flight technology.IndustrialDronesandRobotAutomationSystems:Entryintohigh-value-addedindustrialdronemarketsfordefense,logisticsdelivery,surveillance,andfirefighting.Securingdifferentiatedtechnologicalcompetitivenesswithmulti-dronenavigationsoftwareandhardwaredesigntechnology,proprietarygroundcontrolprograms,andcommunicationsystems.ModelsND-840ZandND-840Pfeaturefull-segmentautomaticflight,multi-purposeutilization,stableflightbasedonOctocopter,LTEcommunication-basedflight,andanautomaticallyunloadingcargobox.AchievedthefirstpubliccertificationinKoreaforhigh-payloaddrones(carryingover10kgofcargo)withaflightrangeofapproximately20km.Developingandcommercializinghigh-payloaddronesforcargotransportofover40kg.Launched'Boglebot,'anAIfryingrobotforkitchenautomationintheF&Bindustry.PursuingthedevelopmentofarecoverableattackdronewithAIautonomousflighttechnology.
Core AdvantagesCoreAdvantages
Ultra-precision Mechanical Processing and Automation Control Technology: High technological completeness and commercialization capability in precision cutting processes for micro-unit materials like semiconductor wafers, displays, and MLCCs. This directly contributes to improving customer productivity and yield.Ultra-precisionMechanicalProcessingandAutomationControlTechnology:Hightechnologicalcompletenessandcommercializationcapabilityinprecisioncuttingprocessesformicro-unitmaterialslikesemiconductorwafers,displays,andMLCCs.Thisdirectlycontributestoimprovingcustomerproductivityandyield.
Successful Localization and Market Leadership: Successfully localized MLCC cutter equipment, supplying it to major domestic corporations in a market previously dominated by Japanese products. The first to localize Dicing Saw and Saw & Sorter equipment in Korea, reducing import dependency and strengthening the domestic semiconductor ecosystem.SuccessfulLocalizationandMarketLeadership:SuccessfullylocalizedMLCCcutterequipment,supplyingittomajordomesticcorporationsinamarketpreviouslydominatedbyJapaneseproducts.ThefirsttolocalizeDicingSawandSaw&SorterequipmentinKorea,reducingimportdependencyandstrengtheningthedomesticsemiconductorecosystem.
Business Diversification and New Growth Engines: Expansion of business areas beyond semiconductor equipment to industrial drones, food tech (AI frying robots), and robot automation systems, diversifying sustainable growth engines. The drone business, in particular, is growing based on proprietary technology in defense, logistics, and surveillance.BusinessDiversificationandNewGrowthEngines:Expansionofbusinessareasbeyondsemiconductorequipmenttoindustrialdrones,foodtech(AIfryingrobots),androbotautomationsystems,diversifyingsustainablegrowthengines.Thedronebusiness,inparticular,isgrowingbasedonproprietarytechnologyindefense,logistics,andsurveillance.
Customized Solutions and High Reliability: Strong capabilities in high-precision, high-speed cutting technology, enabling customized specifications for clients. Long-standing expertise provides stable reliability to customers in the semiconductor and electronics front-end industries, positioning the company favorably for customer expansion.CustomizedSolutionsandHighReliability:Strongcapabilitiesinhigh-precision,high-speedcuttingtechnology,enablingcustomizedspecificationsforclients.Long-standingexpertiseprovidesstablereliabilitytocustomersinthesemiconductorandelectronicsfront-endindustries,positioningthecompanyfavorablyforcustomerexpansion.
Continuous R&D Investment and Patent Acquisition: Ongoing technological development efforts through the establishment of an affiliated research institute. Secured multiple new patents in cutting equipment technology, including a 'hybrid dicing device' patent capable of both linear and curved processing. Holds 4 core technology patents for drones.ContinuousR&DInvestmentandPatentAcquisition:Ongoingtechnologicaldevelopmenteffortsthroughtheestablishmentofanaffiliatedresearchinstitute.Securedmultiplenewpatentsincuttingequipmenttechnology,includinga'hybriddicingdevice'patentcapableofbothlinearandcurvedprocessing.Holds4coretechnologypatentsfordrones.
Global Market Expansion and Partnerships: Expansion of overseas sales networks through the establishment of branches in Hong Kong and Shenzhen. Signed a supply contract for MicroLED and wafer dicing saws with Zaka Semiconductor Technology in China. Collaboration with global drone defense companies and Australia's Currawong Engineering for drone technology development and international market entry.GlobalMarketExpansionandPartnerships:ExpansionofoverseassalesnetworksthroughtheestablishmentofbranchesinHongKongandShenzhen.SignedasupplycontractforMicroLEDandwaferdicingsawswithZakaSemiconductorTechnologyinChina.CollaborationwithglobaldronedefensecompaniesandAustralia'sCurrawongEngineeringfordronetechnologydevelopmentandinternationalmarketentry.
Target IndustriesTargetIndustries
Semiconductor Industry: Supply of post-processing equipment for wafer dicing, chip separation, package cutting, and sorting.SemiconductorIndustry:Supplyofpost-processingequipmentforwaferdicing,chipseparation,packagecutting,andsorting.
Display Industry: Supply of display panel cutting and related equipment.DisplayIndustry:Supplyofdisplaypanelcuttingandrelatedequipment.
MLCC (Multi-Layer Ceramic Capacitor) Industry: Supply of MLCC cutting equipment and related automation facilities.MLCC(Multi-LayerCeramicCapacitor)Industry:SupplyofMLCCcuttingequipmentandrelatedautomationfacilities.
LED Industry: LED chip separation through sapphire wafer breaking systems.LEDIndustry:LEDchipseparationthroughsapphirewaferbreakingsystems.
PCB (Printed Circuit Board) Industry: Supply of PCB/semiconductor singulators, Saw & Sorters, vertical thin PCB developing machines, and other PCB process equipment.PCB(PrintedCircuitBoard)Industry:SupplyofPCB/semiconductorsingulators,Saw&Sorters,verticalthinPCBdevelopingmachines,andotherPCBprocessequipment.
Defense and Public Sector: Provision of industrial drone solutions for surveillance, logistics delivery, firefighting, and coastal patrol.DefenseandPublicSector:Provisionofindustrialdronesolutionsforsurveillance,logisticsdelivery,firefighting,andcoastalpatrol.
Logistics and Transportation Industry: Development of high-payload drones for cargo transport and logistics delivery drone solutions.LogisticsandTransportationIndustry:Developmentofhigh-payloaddronesforcargotransportandlogisticsdeliverydronesolutions.
F&B (Food & Beverage) Industry: Kitchen automation solutions through the AI frying robot 'Boglebot.'F&B(Food&Beverage)Industry:KitchenautomationsolutionsthroughtheAIfryingrobot'Boglebot.'
Major MarketsMajorMarkets
China, Hong Kong, Philippines, Thailand, Singapore, Taiwan, JapanChina,HongKong,Philippines,Thailand,Singapore,Taiwan,Japan
United StatesUnitedStates
AustraliaAustralia
Certifications/PatentsCertifications/Patents
Continuous technology development and provision of Dicing/Automation Total Solutions through an affiliated research institute.ContinuoustechnologydevelopmentandprovisionofDicing/AutomationTotalSolutionsthroughanaffiliatedresearchinstitute.
Holds a total of 49 patents. (as of August 24, 2018)Holdsatotalof49patents.(asofAugust24,2018)
Secured 6 new patents in cutting equipment technology (totaling 13 patents). Notably, the 'Hybrid Dicing Device and Cutting Method Using the Same' patent is a fusion technology capable of both linear and curved processing.Secured6newpatentsincuttingequipmenttechnology(totaling13patents).Notably,the'HybridDicingDeviceandCuttingMethodUsingtheSame'patentisafusiontechnologycapableofbothlinearandcurvedprocessing.
Holds 4 core technology patents for drones.Holds4coretechnologypatentsfordrones.
Safety certification for drones with a maximum takeoff weight of over 25kg, essential for drone operation under the Aviation Safety Act (Korea Institute of Aviation Safety Technology, January 2022).Safetycertificationfordroneswithamaximumtakeoffweightofover25kg,essentialfordroneoperationundertheAviationSafetyAct(KoreaInstituteofAviationSafetyTechnology,January2022).
First Korean drone company to achieve KTL (Korea Testing Laboratory) public certification for high-payload drones (carrying over 10kg of cargo, flying approximately 20km) (February 2022).FirstKoreandronecompanytoachieveKTL(KoreaTestingLaboratory)publiccertificationforhigh-payloaddrones(carryingover10kgofcargo,flyingapproximately20km)(February2022).
Awarded the '10 Million Dollar Export Tower' in 2017.Awardedthe'10MillionDollarExportTower'in2017.
Awarded the '5 Million Dollar Export Tower' in 2013.Awardedthe'5MillionDollarExportTower'in2013.
Received the Grand Prize for Attack Drones at the Dronebot Challenge hosted by the Army Chief of Staff in 2018.ReceivedtheGrandPrizeforAttackDronesattheDronebotChallengehostedbytheArmyChiefofStaffin2018.
Received the Grand Prize in the Drone category at the 2nd Dronebot Challenge hosted by the Army Chief of Staff in 2019.ReceivedtheGrandPrizeintheDronecategoryatthe2ndDronebotChallengehostedbytheArmyChiefofStaffin2019.
Designated as a Promising Small and Medium-sized Enterprise by Gyeonggi-do in 2008.DesignatedasaPromisingSmallandMedium-sizedEnterprisebyGyeonggi-doin2008.
Designated as an Innovative Company by the Small and Medium Business Administration in 2007.DesignatedasanInnovativeCompanybytheSmallandMediumBusinessAdministrationin2007.
Introduction
Location
146 Burim-ro, Dongan-gu, Anyang, Gyeonggi-do, South Korea
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Information
146 Burim-ro, Dongan-gu, Anyang, Gyeonggi-do, South Korea