Information
3993 Nigorikawa, Kita Ward, Niigata, 950-3131, Japan
+81 25-258-5511
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Overview
- Summary
- NAMICS is a global technology leader in advanced functional chemical materials for semiconductor and electronics packaging, specializing in the development, manufacturing, and sales of insulating and conductive products since its founding in 1946NAMICS is a global technology leader in advanced functional chemical materials for semiconductor and electronics packaging, specializing in the development, manufacturing, and sales of insulating and conductive products since its founding in 1946
- Key Products/Technologies
- ADFLEMA (Advanced Flexible Materials) as a comprehensive suite of solutions tailored for diverse modern electronic applicationsADFLEMA (Advanced Flexible Materials) as a comprehensive suite of solutions tailored for diverse modern electronic applications
- Board Level Underfill (BLUF) designed to meet stringent requirements with re-workability for excellent reliabilityBoard Level Underfill (BLUF) designed to meet stringent requirements with re-workability for excellent reliability
- Camera Module Adhesives ensuring optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic componentsCamera Module Adhesives ensuring optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components
- Capillary Underfills for Wafer Level Package (WLP) featuring narrow gap flow, low warpage, and bump protection, compatible with copper pillar technologyCapillary Underfills for Wafer Level Package (WLP) featuring narrow gap flow, low warpage, and bump protection, compatible with copper pillar technology
- Glob Top Material & Encapsulants offering outstanding adhesion to various substrates, low CTE, and high modulus for unmatched strength and robustnessGlob Top Material & Encapsulants offering outstanding adhesion to various substrates, low CTE, and high modulus for unmatched strength and robustness
- Liquid Compression Molded Underfills (LCMUF) capable of wafer and panel level packaging with high productivity due to fast cure cycles and minimal warpageLiquid Compression Molded Underfills (LCMUF) capable of wafer and panel level packaging with high productivity due to fast cure cycles and minimal warpage
- Low Temperature Pressure-less Sintering technology for semiconductor packaging, protecting dies, connecting chips to boards, and dissipating heatLow Temperature Pressure-less Sintering technology for semiconductor packaging, protecting dies, connecting chips to boards, and dissipating heat
- Low Temperature Solder Glass Preforms for semiconductor packaging, providing die protection, chip-to-board connections, and heat dissipationLow Temperature Solder Glass Preforms for semiconductor packaging, providing die protection, chip-to-board connections, and heat dissipation
- KINOMEC Stretchable Pastes as functional inks for smart technology, including silver and carbon-based conductive inks and dielectric inksKINOMEC Stretchable Pastes as functional inks for smart technology, including silver and carbon-based conductive inks and dielectric inks
- UNIMEC Heat-curing-type Conductive Paste product line, encompassing low resistance wiring pastes, air-curable copper pastes, surface mounting adhesives, and die attach adhesivesUNIMEC Heat-curing-type Conductive Paste product line, encompassing low resistance wiring pastes, air-curable copper pastes, surface mounting adhesives, and die attach adhesives
- HIMEC Sintering-type Conductive Paste product line, including application-specific Ag pastes and Cu pastes for printed circuits and ceramic substratesHIMEC Sintering-type Conductive Paste product line, including application-specific Ag pastes and Cu pastes for printed circuits and ceramic substrates
- OVERCOAT for chip resistor protective coatingsOVERCOAT for chip resistor protective coatings
- Low-temperature Sealing Glass for various electronic component sealing applicationsLow-temperature Sealing Glass for various electronic component sealing applications
- Development capabilities in Low-temperature Sintered Conductive Pastes utilizing Metal Organic (MO) TechnologyDevelopment capabilities in Low-temperature Sintered Conductive Pastes utilizing Metal Organic (MO) Technology
- Highly Thermally Conductive TIM as a new product offeringHighly Thermally Conductive TIM as a new product offering
- Epoxy resin compositions, semiconductor sealing agents, and semiconductor devices as key technologies for high-purity and high-performance semiconductor peripheral materialsEpoxy resin compositions, semiconductor sealing agents, and semiconductor devices as key technologies for high-purity and high-performance semiconductor peripheral materials
- Adhesives with thermal conductivity enhanced by mixed silver fillers as an advanced adhesive technologyAdhesives with thermal conductivity enhanced by mixed silver fillers as an advanced adhesive technology
- Core Advantages
- Over 70 years of history and deep expertise in the field of electronic materials since its establishment in 1946Over 70 years of history and deep expertise in the field of electronic materials since its establishment in 1946
- Strong commitment to innovative product development, investing 10% of annual sales in research and development for the semiconductor and electronics marketStrong commitment to innovative product development, investing 10% of annual sales in research and development for the semiconductor and electronics market
- A business model focused on developing and improving custom-made products through close partnerships with customersA business model focused on developing and improving custom-made products through close partnerships with customers
- Establishment of a global production and sales network, including Japan, Germany, North America, Singapore, South Korea, China, and Taiwan, achieving over 80% overseas salesEstablishment of a global production and sales network, including Japan, Germany, North America, Singapore, South Korea, China, and Taiwan, achieving over 80% overseas sales
- Operation of a world-class quality management system with ISO9001, IATF16949, and ISO14001 certificationsOperation of a world-class quality management system with ISO9001, IATF16949, and ISO14001 certifications
- Continuous efforts in environmentally friendly practices, such as reducing hazardous substance use, developing long-life products, and producing RoHS compliant materials, supported by an environmental management systemContinuous efforts in environmentally friendly practices, such as reducing hazardous substance use, developing long-life products, and producing RoHS compliant materials, supported by an environmental management system
- Specialization in niche electrochemical material fields, securing over 40% global market share in insulating materials and over 30% in conductive materialsSpecialization in niche electrochemical material fields, securing over 40% global market share in insulating materials and over 30% in conductive materials
- Target Industries
- Semiconductor packaging industrySemiconductor packaging industry
- Automotive industry (supplying materials to enhance performance and ensure driver safety)Automotive industry (supplying materials to enhance performance and ensure driver safety)
- Consumer products industry (providing advanced adhesive solutions for electronic components in smartphones, tablets, wearables, and home appliances)Consumer products industry (providing advanced adhesive solutions for electronic components in smartphones, tablets, wearables, and home appliances)
- Medical industry (offering board level underfills, encapsulants, conductive adhesives, and stretchable materials)Medical industry (offering board level underfills, encapsulants, conductive adhesives, and stretchable materials)
- Aerospace industryAerospace industry
- 5G communication technology related fields5G communication technology related fields
- Printed electronics and smart surface technology sectorsPrinted electronics and smart surface technology sectors
- Social infrastructure (control systems for electricity, gas, and water supply)Social infrastructure (control systems for electricity, gas, and water supply)
- Major Markets
- Japan, China, Taiwan, Singapore, South KoreaJapan, China, Taiwan, Singapore, South Korea
- GermanyGermany
- United StatesUnited States
- Certifications/Patents
- ISO9001 Quality Management System certification (obtained March 1998)ISO9001 Quality Management System certification (obtained March 1998)
- IATF16949 Automotive Quality Management System certification (obtained April 2018, updated from ISO/TS16949 in 2009)IATF16949 Automotive Quality Management System certification (obtained April 2018, updated from ISO/TS16949 in 2009)
- ISO14001 Environmental Management System certification (obtained November 2003)ISO14001 Environmental Management System certification (obtained November 2003)
- Compliance with REACH and RoHS regulations for product supplyCompliance with REACH and RoHS regulations for product supply
- Patent for Resin composition (Patent number: 12577331)Patent for Resin composition (Patent number: 12577331)
- Patent for Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body (Patent number: 12518889)Patent for Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body (Patent number: 12518889)
- Patent for Low-voltage varistor, circuit board, semiconductor component package, and interposer (Patent number: 12534591)Patent for Low-voltage varistor, circuit board, semiconductor component package, and interposer (Patent number: 12534591)
- Patent application for Liquid epoxy resin composition for use as mold underfill material for TSV (US20250026920A1)Patent application for Liquid epoxy resin composition for use as mold underfill material for TSV (US20250026920A1)
- Patent for Adhesives with thermal conductivity enhanced by mixed silver fillers (US8795837B2)Patent for Adhesives with thermal conductivity enhanced by mixed silver fillers (US8795837B2)
- Strong technical capabilities in developing high-purity and high-performance semiconductor peripheral materialsStrong technical capabilities in developing high-purity and high-performance semiconductor peripheral materials
- Numerous awards and recognitions from major Japanese industrial organizationsNumerous awards and recognitions from major Japanese industrial organizations
Introduction
Location
3993 Nigorikawa, Kita Ward, Niigata, 950-3131, Japan
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