MTI Co., Ltd. is a specialized manufacturer of chemical and Film&Tape materials applied in semiconductor processes. The company contributes to the advancement of the semiconductor industry through innovative technology development and customized solution provision. It secures product lines that contribute to the highest quality and optimized environmental safety.MTICo.,Ltd.isaspecializedmanufacturerofchemicalandFilm&Tapematerialsappliedinsemiconductorprocesses.Thecompanycontributestotheadvancementofthesemiconductorindustrythroughinnovativetechnologydevelopmentandcustomizedsolutionprovision.Itsecuresproductlinesthatcontributetothehighestqualityandoptimizedenvironmentalsafety.
Key Products/TechnologiesKeyProducts/Technologies
Possession of the MAC-Series, a globally exclusive patented, produced, and supplied chemical product essential for semiconductor image sensor manufacturing.PossessionoftheMAC-Series,agloballyexclusivepatented,produced,andsuppliedchemicalproductessentialforsemiconductorimagesensormanufacturing.
Provision of a diverse chemical product lineup including Blade Sawing Surfactant, Laser Grooving/Scribing Coating Solution, Flux Cleaning Solution (Hyper-Max), PR Stripper, and Coating Solution.ProvisionofadiversechemicalproductlineupincludingBladeSawingSurfactant,LaserGrooving/ScribingCoatingSolution,FluxCleaningSolution(Hyper-Max),PRStripper,andCoatingSolution.
Film & Tape product categories encompass heat-resistant ETFE/PFA mold release films, specialty films for QFN backside, MLCC, EWLB processes, Die Attach Adhesive Solution, Thermal Tape Adhesives & Epoxies, Lid & Optical Seal Solution, and Chip & Component Protection films.Film&Tapeproductcategoriesencompassheat-resistantETFE/PFAmoldreleasefilms,specialtyfilmsforQFNbackside,MLCC,EWLBprocesses,DieAttachAdhesiveSolution,ThermalTapeAdhesives&Epoxies,Lid&OpticalSealSolution,andChip&ComponentProtectionfilms.
Development and market supply of localized material products such as EMI UV Pre-Tape, BG Tape, and BSC (Backside Coating).DevelopmentandmarketsupplyoflocalizedmaterialproductssuchasEMIUVPre-Tape,BGTape,andBSC(BacksideCoating).
Pursuit of TBDB (Temporary Bonding De-bonding) technology and the development of 10W/m·K class ultra-high performance thermal interface materials (TIM) to address heat dissipation challenges in HBM (High Bandwidth Memory) and advanced packaging processes.PursuitofTBDB(TemporaryBondingDe-bonding)technologyandthedevelopmentof10W/m·Kclassultra-highperformancethermalinterfacematerials(TIM)toaddressheatdissipationchallengesinHBM(HighBandwidthMemory)andadvancedpackagingprocesses.
Current establishment of a mass production system and a product lineup for 2W and 5W class TIM products.Currentestablishmentofamassproductionsystemandaproductlineupfor2Wand5WclassTIMproducts.
Possession of core technologies including high-performance organic/inorganic composite material synthesis, ultra-precision dispersion technology for nanomaterials, optimal filler blending design, and proprietary coating layer development and peeling technology.Possessionofcoretechnologiesincludinghigh-performanceorganic/inorganiccompositematerialsynthesis,ultra-precisiondispersiontechnologyfornanomaterials,optimalfillerblendingdesign,andproprietarycoatinglayerdevelopmentandpeelingtechnology.
Core AdvantagesCoreAdvantages
Securing global exclusive patent, production, and supply capabilities for the MAC-Series used in semiconductor image sensor manufacturing.Securingglobalexclusivepatent,production,andsupplycapabilitiesfortheMAC-Seriesusedinsemiconductorimagesensormanufacturing.
Possession of capabilities for continuous product upgrades through customer feedback and developer experiments, along with customized product development tailored to specific process conditions.Possessionofcapabilitiesforcontinuousproductupgradesthroughcustomerfeedbackanddeveloperexperiments,alongwithcustomizedproductdevelopmenttailoredtospecificprocessconditions.
Focus on continuous R&D investment and new product development efforts, particularly in preempting future technologies such as high-performance thermal interface materials for HBM.FocusoncontinuousR&Dinvestmentandnewproductdevelopmentefforts,particularlyinpreemptingfuturetechnologiessuchashigh-performancethermalinterfacematerialsforHBM.
Commitment to securing product lines that contribute to the highest quality and optimized environmental safety, positioning all products as eco-friendly premium offerings.Commitmenttosecuringproductlinesthatcontributetothehighestqualityandoptimizedenvironmentalsafety,positioningallproductsaseco-friendlypremiumofferings.
Strengthening stable and innovative material supply capabilities through collaborations with world-leading advanced material suppliers such as Nowofol in Germany and AIT in the USA.Strengtheningstableandinnovativematerialsupplycapabilitiesthroughcollaborationswithworld-leadingadvancedmaterialsupplierssuchasNowofolinGermanyandAITintheUSA.
Enhancement of efforts to prevent technology leakage through the development of proprietary technology protection programs and trade secret classification systems.Enhancementofeffortstopreventtechnologyleakagethroughthedevelopmentofproprietarytechnologyprotectionprogramsandtradesecretclassificationsystems.
Demonstrated technological prowess recognized externally, including selection as a “Materials, Parts, and Equipment Strong Small Business 100+” in 2021, “National Representative Innovative Company 1000” in 2022, and receiving the Presidential Commendation and Minister of Trade, Industry and Energy Award in 2023.Demonstratedtechnologicalprowessrecognizedexternally,includingselectionasa“Materials,Parts,andEquipmentStrongSmallBusiness100+”in2021,“NationalRepresentativeInnovativeCompany1000”in2022,andreceivingthePresidentialCommendationandMinisterofTrade,IndustryandEnergyAwardin2023.
Target IndustrieTargetIndustrie
Semiconductor processesSemiconductorprocesses
Display industryDisplayindustry
LED assembly manufacturingLEDassemblymanufacturing
HBM (High Bandwidth Memory) and advanced packaging processesHBM(HighBandwidthMemory)andadvancedpackagingprocesses
Major MarketsMajorMarkets
South Korea, Semiconductor companies in Asia, China, SingaporeSouthKorea,SemiconductorcompaniesinAsia,China,Singapore
GermanyGermany
USAUSA
BrazilBrazil
Certifications/PatentsCertifications/Patents
Possession of global exclusive patents related to MAC-Series.PossessionofglobalexclusivepatentsrelatedtoMAC-Series.
Selected as a “Materials, Parts, and Equipment Strong Small Business 100+” by the Ministry of SMEs and Startups in 2021.Selectedasa“Materials,Parts,andEquipmentStrongSmallBusiness100+”bytheMinistryofSMEsandStartupsin2021.
Selected as a “National Representative Innovative Company 1000” by the Financial Services Commission in 2022.Selectedasa“NationalRepresentativeInnovativeCompany1000”bytheFinancialServicesCommissionin2022.
Acquisition of T-3 certification (Excellent) for technology evaluation for 6 consecutive years (NICE Information Service Co., Ltd.).AcquisitionofT-3certification(Excellent)fortechnologyevaluationfor6consecutiveyears(NICEInformationServiceCo.,Ltd.).
Obtained ISO 9001 and ISO 14001 international standard certifications.ObtainedISO9001andISO14001internationalstandardcertifications.
Acquisition of certification for excellent employee invention compensation (Korean Intellectual Property Office).Acquisitionofcertificationforexcellentemployeeinventioncompensation(KoreanIntellectualPropertyOffice).
Obtained confirmation as a specialized material and component company (Ministry of Trade, Industry and Energy).Obtainedconfirmationasaspecializedmaterialandcomponentcompany(MinistryofTrade,IndustryandEnergy).
Acquisition of venture company confirmation (KIBO Technology Guarantee Fund).Acquisitionofventurecompanyconfirmation(KIBOTechnologyGuaranteeFund).
Completion of corporate research institute establishment (Korea Industrial Technology Association).Completionofcorporateresearchinstituteestablishment(KoreaIndustrialTechnologyAssociation).
Awarded a Gold Medal for CSR performance by EcoVadis.AwardedaGoldMedalforCSRperformancebyEcoVadis.
Received the “Presidential Commendation” (for contributions to technology protection) at the 2023 SME Technology and Management Innovation Daejeon hosted by the Ministry of SMEs and Startups.Receivedthe“PresidentialCommendation”(forcontributionstotechnologyprotection)atthe2023SMETechnologyandManagementInnovationDaejeonhostedbytheMinistryofSMEsandStartups.
Received the “Minister of Trade, Industry and Energy Award” (for special material technology in semiconductor post-processing) at the 2023 Korea Industrial Technology R&D Daejeon hosted by the Ministry of Trade, Industry and Energy.Receivedthe“MinisterofTrade,IndustryandEnergyAward”(forspecialmaterialtechnologyinsemiconductorpost-processing)atthe2023KoreaIndustrialTechnologyR&DDaejeonhostedbytheMinistryofTrade,IndustryandEnergy.
Scheduled to receive the Prime Minister's Commendation (Ministry of Trade, Industry and Energy) at the 2025 K-Tech Inside Show (formerly Materials, Parts, and Equipment Root Technology Daejeon).ScheduledtoreceivethePrimeMinister'sCommendation(MinistryofTrade,IndustryandEnergy)atthe2025K-TechInsideShow(formerlyMaterials,Parts,andEquipmentRootTechnologyDaejeon).
Introduction
Location
154-23 Wonsi-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
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Information
154-23 Wonsi-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea