MIT is a global leader in the development of fully automated in-line ultrasonic inspection equipment for internal defect inspection of memory and packages in the semiconductor and electric vehicle sectors. The company provides solutions for automatic inspection and analysis of ultra-fine defects inside wafers, chips, and packages at all stages from front-end to back-end processes of semiconductors.MITisagloballeaderinthedevelopmentoffullyautomatedin-lineultrasonicinspectionequipmentforinternaldefectinspectionofmemoryandpackagesinthesemiconductorandelectricvehiclesectors.Thecompanyprovidessolutionsforautomaticinspectionandanalysisofultra-finedefectsinsidewafers,chips,andpackagesatallstagesfromfront-endtoback-endprocessesofsemiconductors.
Key Products/TechnologiesKeyProducts/Technologies
The main product line includes Super Fast Scanning Acoustic Tomography (SFSAT) ultrasonic inspection equipment, offering solutions for internal defect inspection of semiconductor wafers, packages, substrates, and power semiconductors.ThemainproductlineincludesSuperFastScanningAcousticTomography(SFSAT)ultrasonicinspectionequipment,offeringsolutionsforinternaldefectinspectionofsemiconductorwafers,packages,substrates,andpowersemiconductors.
The company possesses single, dual, quadruple, and array solutions for automated ultrasonic inspection systems in semiconductor (wafer) and automotive (power module/DCB, etc.) fields.Thecompanypossessessingle,dual,quadruple,andarraysolutionsforautomatedultrasonicinspectionsystemsinsemiconductor(wafer)andautomotive(powermodule/DCB,etc.)fields.
Specialized in precise inspection technologies for various applications such as DCB substrates, AMB substrates, power modules, TGV (Through Glass Via), micro LED, HBM, DRAM/NAND Flash, advanced chip packaging, and MLCC.SpecializedinpreciseinspectiontechnologiesforvariousapplicationssuchasDCBsubstrates,AMBsubstrates,powermodules,TGV(ThroughGlassVia),microLED,HBM,DRAM/NANDFlash,advancedchippackaging,andMLCC.
Application of high-speed scanning-based ultrasonic tomography technology ensures high throughput performance for mass production lines.Applicationofhigh-speedscanning-basedultrasonictomographytechnologyensureshighthroughputperformanceformassproductionlines.
Integration of deep learning-based algorithms in inspection data analysis enhances defect detection reliability.Integrationofdeeplearning-basedalgorithmsininspectiondataanalysisenhancesdefectdetectionreliability.
Pioneering technology for the commercialization of fully automated ultrasonic inspection equipment for both front-end and back-end semiconductor processes in Korea.Pioneeringtechnologyforthecommercializationoffullyautomatedultrasonicinspectionequipmentforbothfront-endandback-endsemiconductorprocessesinKorea.
Key capabilities include 'water holder (dam) fusion for waterfall method implementation' technology and 'multi-layer inspection through dual frequency scanning' technology.Keycapabilitiesinclude'waterholder(dam)fusionforwaterfallmethodimplementation'technologyand'multi-layerinspectionthroughdualfrequencyscanning'technology.
As a smart factory solution provider, the company offers smart factory implementation capabilities combining XR (mixed reality), digital twin, and robots.Asasmartfactorysolutionprovider,thecompanyofferssmartfactoryimplementationcapabilitiescombiningXR(mixedreality),digitaltwin,androbots.
Provision of various XR-based solutions, including immersive XR training solutions, real-time remote collaboration solutions (ASSIST SOLUTION), and XR-based CAD quality inspection solutions (QUALITY SOLUTION).ProvisionofvariousXR-basedsolutions,includingimmersiveXRtrainingsolutions,real-timeremotecollaborationsolutions(ASSISTSOLUTION),andXR-basedCADqualityinspectionsolutions(QUALITYSOLUTION).
Development capabilities for System Integration SW encompassing Machine Automation, Robot Control, AOI Algorithm, and MES/CIM/SECS GEM Communication Platform Integration.DevelopmentcapabilitiesforSystemIntegrationSWencompassingMachineAutomation,RobotControl,AOIAlgorithm,andMES/CIM/SECSGEMCommunicationPlatformIntegration.
Core AdvantagesCoreAdvantages
World-class inspection precision and fast inspection speed, contributing to production stability and quality improvement for customer products.World-classinspectionprecisionandfastinspectionspeed,contributingtoproductionstabilityandqualityimprovementforcustomerproducts.
Successful pioneering and market leadership in supplying the first mass-production type automated ultrasonic inspection equipment in Korea.Successfulpioneeringandmarketleadershipinsupplyingthefirstmass-productiontypeautomatedultrasonicinspectionequipmentinKorea.
Ability to overcome limitations of existing manual overseas equipment by developing advanced automation and inspection technologies applicable to mass production lines.Abilitytoovercomelimitationsofexistingmanualoverseasequipmentbydevelopingadvancedautomationandinspectiontechnologiesapplicabletomassproductionlines.
Integration of the latest AI Deep Learning system ensures unparalleled defect detection accuracy.IntegrationofthelatestAIDeepLearningsystemensuresunparalleleddefectdetectionaccuracy.
The 'water holder (dam) fusion for waterfall method implementation' technology, where ultrasound is incident with water on the wafer substrate, enables high-speed scanning and high-quality image acquisition.The'waterholder(dam)fusionforwaterfallmethodimplementation'technology,whereultrasoundisincidentwithwateronthewafersubstrate,enableshigh-speedscanningandhigh-qualityimageacquisition.
Possession of a unique patented technology, 'multi-layer inspection through dual frequency scanning,' equipped with two ultrasonic probes.Possessionofauniquepatentedtechnology,'multi-layerinspectionthroughdualfrequencyscanning,'equippedwithtwoultrasonicprobes.
Contribution to replacing imported equipment monopolized by foreign companies and offering flexible, customized solutions tailored to domestic customer needs with proprietary Korean technology.Contributiontoreplacingimportedequipmentmonopolizedbyforeigncompaniesandofferingflexible,customizedsolutionstailoredtodomesticcustomerneedswithproprietaryKoreantechnology.
Exceptional capability to perform full inspection and automatic analysis of ultra-fine defects such as cracks, delamination, and voids inside semiconductors.Exceptionalcapabilitytoperformfullinspectionandautomaticanalysisofultra-finedefectssuchascracks,delamination,andvoidsinsidesemiconductors.
Innovative capability to pioneer new inspection equipment markets by converging ultrasonic, optical, and artificial intelligence (AI) technologies.Innovativecapabilitytopioneernewinspectionequipmentmarketsbyconvergingultrasonic,optical,andartificialintelligence(AI)technologies.
Target IndustrieTargetIndustrie
Internal defect inspection for various products in the semiconductor industry, including wafers, chips, packages, substrates, power semiconductors, HBM, DRAM/NAND Flash, MLCC, and 2.5D/3D packaging.Internaldefectinspectionforvariousproductsinthesemiconductorindustry,includingwafers,chips,packages,substrates,powersemiconductors,HBM,DRAM/NANDFlash,MLCC,and2.5D/3Dpackaging.
Inspection of power semiconductor modules and DCB ceramic substrates in the electric vehicle industry.InspectionofpowersemiconductormodulesandDCBceramicsubstratesintheelectricvehicleindustry.
Supply of inspection systems to power semiconductor manufacturers for automotive applications and collaborators of finished vehicle manufacturers in the automotive industry.Supplyofinspectionsystemstopowersemiconductormanufacturersforautomotiveapplicationsandcollaboratorsoffinishedvehiclemanufacturersintheautomotiveindustry.
Provision of XR-based industrial safety, quality control, and remote support solutions for smart factory construction.ProvisionofXR-basedindustrialsafety,qualitycontrol,andremotesupportsolutionsforsmartfactoryconstruction.
Major MarketsMajorMarkets
Taiwan, JapanTaiwan,Japan
GermanyGermany
USAUSA
Certifications/PatentsCertifications/Patents
Completion of 44 patent applications related to ultrasound and 28 registered patents.Completionof44patentapplicationsrelatedtoultrasoundand28registeredpatents.
Notably, the 'multi-layer inspection through dual frequency scanning' technology is a unique patented technology.Notably,the'multi-layerinspectionthroughdualfrequencyscanning'technologyisauniquepatentedtechnology.
Acquisition of INNOBIZ certification, establishing its status as a technology innovation company.AcquisitionofINNOBIZcertification,establishingitsstatusasatechnologyinnovationcompany.
Establishment of a corporate research institute concurrently with its founding in 2017, ensuring continuous research and development activities.Establishmentofacorporateresearchinstituteconcurrentlywithitsfoundingin2017,ensuringcontinuousresearchanddevelopmentactivities.
Active participation in national R&D projects, having secured 7 national projects sponsored by the Ministry of SMEs and Startups and the Ministry of Trade, Industry and Energy.ActiveparticipationinnationalR&Dprojects,havingsecured7nationalprojectssponsoredbytheMinistryofSMEsandStartupsandtheMinistryofTrade,IndustryandEnergy.
Recipient of the 2024 IR52 Jang Young-shil Award (for automated in-line ultrasonic inspection equipment for internal semiconductor defects).Recipientofthe2024IR52JangYoung-shilAward(forautomatedin-lineultrasonicinspectionequipmentforinternalsemiconductordefects).
Awarded the 'Grand Prize in the Automated Ultrasonic Inspection Equipment Sector' at the 2024 Korea Innovation Enterprise & Brand Awards.Awardedthe'GrandPrizeintheAutomatedUltrasonicInspectionEquipmentSector'atthe2024KoreaInnovationEnterprise&BrandAwards.
Recipient of the Iron Tower Order of Industrial Service Merit in 2023 and the Technology Innovation Grand Prize at the Korea SME & Venture Business Awards.RecipientoftheIronTowerOrderofIndustrialServiceMeritin2023andtheTechnologyInnovationGrandPrizeattheKoreaSME&VentureBusinessAwards.
Recognized as an 'Baby Unicorn' company in the first half of 2022, officially acknowledging its growth potential.Recognizedasan'BabyUnicorn'companyinthefirsthalfof2022,officiallyacknowledgingitsgrowthpotential.
Achieved TCB technology evaluation T3 grade in 2021 for non-destructive ultrasonic inspection equipment development.AchievedTCBtechnologyevaluationT3gradein2021fornon-destructiveultrasonicinspectionequipmentdevelopment.
Passed the technology evaluation with an A grade for KOSDAQ special listing in 2024, affirming its technological prowess.PassedthetechnologyevaluationwithanAgradeforKOSDAQspeciallistingin2024,affirmingitstechnologicalprowess.
Holding ISO9001, ISO14001, and ISO45001 management system certifications.HoldingISO9001,ISO14001,andISO45001managementsystemcertifications.
Introduction
Location
44 Eungyejungang-ro 306beon-gil, Siheung-si, Gyeonggi-do, South Korea
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Information
44 Eungyejungang-ro 306beon-gil, Siheung-si, Gyeonggi-do, South Korea