Information
43 Deokseongsandan 2-ro 50beon-gil, Idong-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, South Korea
+82 31-659-7979
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Overview
- Summary
- Micro2Nano, established in 2000, is an advanced technology company utilizing proprietary MEMS technology derived from semiconductor processes. The company specializes in the development and production of various core components for semiconductors, medical devices, optical communications, and automotive applications. Its product range includes ultra-precision optical communication components, probe cards for semiconductor inspection, nano probes for atomic microscopy, and pressure sensors for automotive brakes. The company is a leader in the micro to nano scale device component industry, playing a pivotal role in MEMS-based micro-device component sectors.Micro2Nano, established in 2000, is an advanced technology company utilizing proprietary MEMS technology derived from semiconductor processes. The company specializes in the development and production of various core components for semiconductors, medical devices, optical communications, and automotive applications. Its product range includes ultra-precision optical communication components, probe cards for semiconductor inspection, nano probes for atomic microscopy, and pressure sensors for automotive brakes. The company is a leader in the micro to nano scale device component industry, playing a pivotal role in MEMS-based micro-device component sectors.
- Key Products/Technologies
- Probe Card: A critical component in semiconductor inspection equipment, connecting semiconductor chips on wafers to test equipment. This includes both NAND and DRAM probe cards, with global customer qualification for HBM EDS process probe cards. Capabilities extend to developing High-Speed CIS probe cards and Multi-DUT probe cards for 5G RF Modules. These high-value consumables are essential in the semiconductor testing market.Probe Card: A critical component in semiconductor inspection equipment, connecting semiconductor chips on wafers to test equipment. This includes both NAND and DRAM probe cards, with global customer qualification for HBM EDS process probe cards. Capabilities extend to developing High-Speed CIS probe cards and Multi-DUT probe cards for 5G RF Modules. These high-value consumables are essential in the semiconductor testing market.
- Microneedle: A micro-sized injection probe designed for painless drug delivery through tiny holes, approximately 60㎛ in size. Developed and commercialized in collaboration with NanoPass Technologies Ltd. This product represents a key item in the company's expansion into the medical device sector.Microneedle: A micro-sized injection probe designed for painless drug delivery through tiny holes, approximately 60㎛ in size. Developed and commercialized in collaboration with NanoPass Technologies Ltd. This product represents a key item in the company's expansion into the medical device sector.
- V-Groove: An ultra-precision optical communication component used as a substrate for optical fiber arrays, ensuring precise alignment of various fibers in waveguide devices. It is a significant item in optical component commercialization and foundry services. This technology is central to precise optical fiber alignment.V-Groove: An ultra-precision optical communication component used as a substrate for optical fiber arrays, ensuring precise alignment of various fibers in waveguide devices. It is a significant item in optical component commercialization and foundry services. This technology is central to precise optical fiber alignment.
- Pressure Sensor: A crucial component for automotive ABS, ESC, and TCS systems. Mass production commenced in 2019, contributing to the enhanced safety and performance of automotive braking systems.Pressure Sensor: A crucial component for automotive ABS, ESC, and TCS systems. Mass production commenced in 2019, contributing to the enhanced safety and performance of automotive braking systems.
- MEMS Foundry Service: A service offering customized process development and manufacturing support for the semiconductor and sensor industries. This includes the contract manufacturing of various MEMS-based products like V-Groove and Microneedles. The service provides flexible production systems tailored to customer requirements.MEMS Foundry Service: A service offering customized process development and manufacturing support for the semiconductor and sensor industries. This includes the contract manufacturing of various MEMS-based products like V-Groove and Microneedles. The service provides flexible production systems tailored to customer requirements.
- Core Advantages
- Proprietary MEMS Technology: The company's unique MEMS (Micro-Electro Mechanical Systems) technology, applied from semiconductor processes, enables the development and production of precision components ranging from micro to nano scales. This technological prowess is a driving force behind delivering core components across diverse industrial sectors. Continuous R&D efforts ensure technological leadership.Proprietary MEMS Technology: The company's unique MEMS (Micro-Electro Mechanical Systems) technology, applied from semiconductor processes, enables the development and production of precision components ranging from micro to nano scales. This technological prowess is a driving force behind delivering core components across diverse industrial sectors. Continuous R&D efforts ensure technological leadership.
- Diversified Product Portfolio: A comprehensive range of applications including semiconductor inspection probe cards, medical microneedles, V-Groove optical communication components, and automotive pressure sensors. This diversification reduces reliance on specific industries and allows for flexible responses to market changes. Ongoing product diversification secures future growth engines.Diversified Product Portfolio: A comprehensive range of applications including semiconductor inspection probe cards, medical microneedles, V-Groove optical communication components, and automotive pressure sensors. This diversification reduces reliance on specific industries and allows for flexible responses to market changes. Ongoing product diversification secures future growth engines.
- Strong Position in Semiconductor Test Market: Supply of probe cards to major domestic semiconductor companies like SK Hynix and Samsung Electronics, securing a high market share in the NAND sector. Global customer qualification for HBM EDS process probe cards strengthens its competitiveness in the AI semiconductor test market. Regular high-grade quality evaluations from major clients further validate its standing.Strong Position in Semiconductor Test Market: Supply of probe cards to major domestic semiconductor companies like SK Hynix and Samsung Electronics, securing a high market share in the NAND sector. Global customer qualification for HBM EDS process probe cards strengthens its competitiveness in the AI semiconductor test market. Regular high-grade quality evaluations from major clients further validate its standing.
- Continuous Technological Innovation and R&D: Active investment in developing next-generation items through collaboration with domestic and international research institutes and companies. Pursuing localization of DRAM EDS probe cards and expansion into non-memory fields. Objective recognition of its technological capabilities through achieving A-grade in technology evaluations.Continuous Technological Innovation and R&D: Active investment in developing next-generation items through collaboration with domestic and international research institutes and companies. Pursuing localization of DRAM EDS probe cards and expansion into non-memory fields. Objective recognition of its technological capabilities through achieving A-grade in technology evaluations.
- Target Industries
- Semiconductor Industry (Memory, Non-Memory, HBM)Semiconductor Industry (Memory, Non-Memory, HBM)
- Medical Device IndustryMedical Device Industry
- Optical Communication IndustryOptical Communication Industry
- Automotive Industry (ABS, ESC, TCS Systems)Automotive Industry (ABS, ESC, TCS Systems)
- Industrial SystemsIndustrial Systems
- Telecommunications IndustryTelecommunications Industry
- Consumer ElectronicsConsumer Electronics
- Major Markets
- South Korea, China, JapanSouth Korea, China, Japan
- IsraelIsrael
- USAUSA
- Certifications/Patents
- 36 domestic patents, 3 US patents, and 1 PCT (international) patent (as of January 2025) ownership36 domestic patents, 3 US patents, and 1 PCT (international) patent (as of January 2025) ownership
- ISO 9001 Quality Management System certification acquisitionISO 9001 Quality Management System certification acquisition
- ISO14001 Environmental Management System certification acquisitionISO14001 Environmental Management System certification acquisition
- IATF 16949:2016 Automotive Quality Management System certification acquisitionIATF 16949:2016 Automotive Quality Management System certification acquisition
- Venture Company certification (R&D company)Venture Company certification (R&D company)
- Innovative Business (INNO-biz) certificationInnovative Business (INNO-biz) certification
- Transparent Management Company certificationTransparent Management Company certification
- Yongin City Excellent Company certification acquisitionYongin City Excellent Company certification acquisition
- Prime Minister's Award in the Industrial Technology category at the Nano Korea 2024 Awards (July 2024)Prime Minister's Award in the Industrial Technology category at the Nano Korea 2024 Awards (July 2024)
- Minister of Trade, Industry and Energy Commendation for Nano-Convergence Technology Manpower Training Project (January 2019)Minister of Trade, Industry and Energy Commendation for Nano-Convergence Technology Manpower Training Project (January 2019)
- SK Hynix SHE Consulting 'Competency Improvement Sector' Grand Prize selection (December 2022)SK Hynix SHE Consulting 'Competency Improvement Sector' Grand Prize selection (December 2022)
Introduction
Location
43 Deokseongsandan 2-ro 50beon-gil, Idong-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, South Korea
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