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  • LEADTEC

    LEADTEC

    About Supplier

    Began in 2008, our focus was to develop diebonder & semiconductor equipment and to be global company.

    We introduce an innovation in chipmaking industry with unremitting efforts.

    We provide new technology semiconductor equipment to the semiconductor manufacturer and becoming global semiconductor manufacturer.

    Furthermore, we devoted over half of sales to developing equipment, and develop new concepts and techniques.

    LEADTEC is growing by taking over NIDECTOSOK company, and develping new technology with Korea & Japan laboratory.

    +82-70-8677-7676
    +82-41-543-2203
    260, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, Korea

    Product List

    Die Bonder

    Epoxy DIe Bonder
    LDB-200D
    Epoxy / Eutectic DIe Bonder
    LDB-200ED
    Epoxy DIe Bonder
    LDB-2000D
    Epoxy / Eutectic DIe Bonder
    LDB-2000ED
    Epoxy DIe Bonder
    LDB-310D
    Eutectic DIe Bonder
    LDB-200E
    Eutectic DIe Bonder
    LDB-2000E
    Solder Die Bonder
    LDB-S1
    MCP Die Bonder
    DBD-7000
    Multi Die Bonder
    LDB-M1
    Full Automatic Lead Frame Cutter
    LCT-10
    Others
    UC-10
    Epoxy Syringe Mixer
    LEM-100

    Laser Deflash System

    Full Automatic Solder Diebonder
    LDS-100
    LDS-200D
    LDS-250U

    Trim & Form

    LTF-S

    Marking Equipment

    LME-10
    LME-20

    Test Handlers

    LTH-maxpm

    Inspection Equipment

    LVI-A