
LEADTEC
About Supplier
Began in 2008, our focus was to develop diebonder & semiconductor equipment and to be global company.
We introduce an innovation in chipmaking industry with unremitting efforts.
We provide new technology semiconductor equipment to the semiconductor manufacturer and becoming global semiconductor manufacturer.
Furthermore, we devoted over half of sales to developing equipment, and develop new concepts and techniques.
LEADTEC is growing by taking over NIDECTOSOK company, and develping new technology with Korea & Japan laboratory.
+82-70-8677-7676
+82-41-543-2203
260, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, Korea
Product List
Die Bonder
Epoxy DIe Bonder
LDB-200D
Epoxy / Eutectic DIe Bonder
LDB-200ED
Epoxy DIe Bonder
LDB-2000D
Epoxy / Eutectic DIe Bonder
LDB-2000ED
Epoxy DIe Bonder
LDB-310D
Eutectic DIe Bonder
LDB-200E
Eutectic DIe Bonder
LDB-2000E
Solder Die Bonder
LDB-S1
MCP Die Bonder
DBD-7000
Multi Die Bonder
LDB-M1
Full Automatic Lead Frame Cutter
LCT-10
Others
UC-10
Epoxy Syringe Mixer
LEM-100
Laser Deflash System
Full Automatic Solder Diebonder
LDS-100
LDS-200D
LDS-250U
Trim & Form
LTF-S
Marking Equipment
LME-10
LME-20
Test Handlers
LTH-maxpm
Inspection Equipment
LVI-A