Information
138 Cheongbuksandan-ro, Cheongbuk-eup, Pyeongtaek, Gyeonggi-do, South Korea
+82 31-680-1798
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Overview
- Summary
- LB Semicon is a specialized outsourced semiconductor assembly and test (OSAT) company providing bumping, probe test, back-end processes, and WLCSP services for semiconductor chips such as DDI, CIS, and PMIC used in electronic devices like TVs, monitors, and mobile phones. Since its establishment in 2000, the company has accumulated advanced technology, being the first in Korea to initiate flip-chip wafer bumping operations. Recently, it has expanded its business into AI semiconductor packaging (FIWLP, FOWLP), enhancing its capabilities in advanced packaging solutions. The company maintains strong partnerships with leading domestic and international semiconductor manufacturers, solidifying its position in the global market.LB Semicon is a specialized outsourced semiconductor assembly and test (OSAT) company providing bumping, probe test, back-end processes, and WLCSP services for semiconductor chips such as DDI, CIS, and PMIC used in electronic devices like TVs, monitors, and mobile phones. Since its establishment in 2000, the company has accumulated advanced technology, being the first in Korea to initiate flip-chip wafer bumping operations. Recently, it has expanded its business into AI semiconductor packaging (FIWLP, FOWLP), enhancing its capabilities in advanced packaging solutions. The company maintains strong partnerships with leading domestic and international semiconductor manufacturers, solidifying its position in the global market.
- Key Products/Technologies
- **Bumping Services**: Offering various bumping technologies including Gold bumping for TFT LCD & OLED Display Driver IC (DDI), Solder bumping for CMOS Image Sensor (CIS), Cu pillar bumping, Au RDL, and Thick Cu. This core process enables electrical connections between chips and substrates at the wafer level.**Bumping Services**: Offering various bumping technologies including Gold bumping for TFT LCD & OLED Display Driver IC (DDI), Solder bumping for CMOS Image Sensor (CIS), Cu pillar bumping, Au RDL, and Thick Cu. This core process enables electrical connections between chips and substrates at the wafer level.
- **Probe Test**: Providing wafer test services for DDI, CIS, PMIC, AP (Application Processor), and SoC (System on Chip), performing electrical performance and quality inspections for various semiconductor chips. The company possesses extensive testing capabilities with the largest number of probe testers in Korea.**Probe Test**: Providing wafer test services for DDI, CIS, PMIC, AP (Application Processor), and SoC (System on Chip), performing electrical performance and quality inspections for various semiconductor chips. The company possesses extensive testing capabilities with the largest number of probe testers in Korea.
- **Back-end Services**: Offering comprehensive post-processing services including laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection, and packing services. Capabilities also include COG (Chip on Glass) and COF (Chip on Film) assembly processes.**Back-end Services**: Offering comprehensive post-processing services including laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection, and packing services. Capabilities also include COG (Chip on Glass) and COF (Chip on Film) assembly processes.
- **WLCSP (Wafer Level Chip Scale Package)**: A technology that performs packaging processes directly on the wafer, minimizing chip size and enhancing electrical characteristics and cost-effectiveness. This solution aligns with the trend of high-density integration and miniaturization in semiconductors.**WLCSP (Wafer Level Chip Scale Package)**: A technology that performs packaging processes directly on the wafer, minimizing chip size and enhancing electrical characteristics and cost-effectiveness. This solution aligns with the trend of high-density integration and miniaturization in semiconductors.
- **Advanced Packaging Technologies**: Development of Fan-out Wafer Level Package (FOWLP) and securing orders for Fan-in Wafer Level Package (FIWLP), marking entry into the AI semiconductor packaging market. Pursuing the development of next-generation packaging technologies such as 2.xD and 3D Fan-Out WLP. Providing BGBM, RDL, ENIG, Taiko grinding, and MOSFET process technologies for packaging power management chips in AI data centers.**Advanced Packaging Technologies**: Development of Fan-out Wafer Level Package (FOWLP) and securing orders for Fan-in Wafer Level Package (FIWLP), marking entry into the AI semiconductor packaging market. Pursuing the development of next-generation packaging technologies such as 2.xD and 3D Fan-Out WLP. Providing BGBM, RDL, ENIG, Taiko grinding, and MOSFET process technologies for packaging power management chips in AI data centers.
- Core Advantages
- **Pioneering Flip-Chip Wafer Bumping Technology**: Status as a pioneering company, being the first in Korea to establish full production facilities for flip-chip wafer bumping in 2000. Continuous expansion of technology from Gold bumping to Solder bumping, Cu pillar bumping, and WLCSP.**Pioneering Flip-Chip Wafer Bumping Technology**: Status as a pioneering company, being the first in Korea to establish full production facilities for flip-chip wafer bumping in 2000. Continuous expansion of technology from Gold bumping to Solder bumping, Cu pillar bumping, and WLCSP.
- **Accumulated Mass Production Experience and Technical Know-how**: Over 20 years of rich mass production experience accumulated through business with leading domestic and international semiconductor manufacturers, forming the basis of its advanced technology. A key capability for producing and supplying high-quality semiconductors.**Accumulated Mass Production Experience and Technical Know-how**: Over 20 years of rich mass production experience accumulated through business with leading domestic and international semiconductor manufacturers, forming the basis of its advanced technology. A key capability for producing and supplying high-quality semiconductors.
- **Provision of Comprehensive Semiconductor Post-Processing Turnkey Solutions**: Establishment of an integrated process covering bumping, probe test, back-end, and WLCSP across the entire semiconductor post-processing spectrum. Securing technological capabilities and service competitiveness to meet diverse customer demands.**Provision of Comprehensive Semiconductor Post-Processing Turnkey Solutions**: Establishment of an integrated process covering bumping, probe test, back-end, and WLCSP across the entire semiconductor post-processing spectrum. Securing technological capabilities and service competitiveness to meet diverse customer demands.
- **Diversification of Business Portfolio and Enhancement of Advanced Packaging Capabilities**: Expansion of business areas beyond DDI to include CIS, PMIC, AP, SoC testing, and AI semiconductor packaging (FIWLP, FOWLP). Continuous investment and technology development in high-profit advanced packaging fields.**Diversification of Business Portfolio and Enhancement of Advanced Packaging Capabilities**: Expansion of business areas beyond DDI to include CIS, PMIC, AP, SoC testing, and AI semiconductor packaging (FIWLP, FOWLP). Continuous investment and technology development in high-profit advanced packaging fields.
- **Robust Domestic and International Customer Network**: Close and long-term cooperative relationships with major domestic and international semiconductor and display manufacturers, including Samsung Electronics, LX Semicon, LG Display, SK Hynix, and MagnaChip. Securing all top three DDI development companies worldwide as clients.**Robust Domestic and International Customer Network**: Close and long-term cooperative relationships with major domestic and international semiconductor and display manufacturers, including Samsung Electronics, LX Semicon, LG Display, SK Hynix, and MagnaChip. Securing all top three DDI development companies worldwide as clients.
- **Quality and Sustainability Management Systems**: Acquisition of numerous international quality, environmental, and occupational health and safety management system certifications, including ISO 9001, ISO 14001, ISO 45001, and IATF 16949. Implementation of eco-friendly management practices such as Samsung Electronics Eco-partner, Sony Green Partner certifications, and RoHS compliance.**Quality and Sustainability Management Systems**: Acquisition of numerous international quality, environmental, and occupational health and safety management system certifications, including ISO 9001, ISO 14001, ISO 45001, and IATF 16949. Implementation of eco-friendly management practices such as Samsung Electronics Eco-partner, Sony Green Partner certifications, and RoHS compliance.
- Target Industrie
- **Consumer Electronics and Mobile Device Industry**: Application in Display Driver ICs (DDI), Image Sensors (CIS), and Power Management ICs (PMIC) for various electronic devices such as TVs, monitors, mobile phones, and tablet PCs.**Consumer Electronics and Mobile Device Industry**: Application in Display Driver ICs (DDI), Image Sensors (CIS), and Power Management ICs (PMIC) for various electronic devices such as TVs, monitors, mobile phones, and tablet PCs.
- **Automotive Industry**: Meeting automotive semiconductor quality management system requirements through IATF 16949 certification, indicating potential for market entry.**Automotive Industry**: Meeting automotive semiconductor quality management system requirements through IATF 16949 certification, indicating potential for market entry.
- **AI and Data Center Industry**: Providing packaging services for power management chips in AI data centers and for AI semiconductors used in smart devices, autonomous vehicles, home appliances, robots, and cameras for on-device AI implementation.**AI and Data Center Industry**: Providing packaging services for power management chips in AI data centers and for AI semiconductors used in smart devices, autonomous vehicles, home appliances, robots, and cameras for on-device AI implementation.
- **Communication Industry**: Strengthening its presence in the communication semiconductor market through advanced packaging technologies like Fan-out Wafer Level Package (FO-WLP).**Communication Industry**: Strengthening its presence in the communication semiconductor market through advanced packaging technologies like Fan-out Wafer Level Package (FO-WLP).
- Major Markets
- South Korea, China, Taiwan, SingaporeSouth Korea, China, Taiwan, Singapore
- USAUSA
- Certifications/Patents
- **Certifications**: ISO 9001:2015 (Quality Management System), ISO 14001:2015 (Environmental Management System), ISO 45001:2018 (Occupational Health & Safety Management System), IATF 16949:2016 (Automotive Quality Management System), IECQ QC 080000:2017 (Hazardous Substance Process Management System - HSPM), ANSI/ESD S20.20-2021 (Electrostatic Discharge Protection Standard), Samsung Electronics Eco-partner Certificate, Sony Green Partner Certification, Authorized Economic Operator (AEO) Certificate (Importer/Exporter), Certificate of Excellent Technology Evaluation Enterprise, Root-technology Specialized Company designation, RoHS compliance, preparing for CC certification (ISO/IEC 15408) acquisition.**Certifications**: ISO 9001:2015 (Quality Management System), ISO 14001:2015 (Environmental Management System), ISO 45001:2018 (Occupational Health & Safety Management System), IATF 16949:2016 (Automotive Quality Management System), IECQ QC 080000:2017 (Hazardous Substance Process Management System - HSPM), ANSI/ESD S20.20-2021 (Electrostatic Discharge Protection Standard), Samsung Electronics Eco-partner Certificate, Sony Green Partner Certification, Authorized Economic Operator (AEO) Certificate (Importer/Exporter), Certificate of Excellent Technology Evaluation Enterprise, Root-technology Specialized Company designation, RoHS compliance, preparing for CC certification (ISO/IEC 15408) acquisition.
- **Patents**: Holding over 30 patents. Specific patents include wafer rotating plating apparatus, solder bump structure and manufacturing method for flip-chip packages, manufacturing method for flip-chip bumps of semiconductor packages, image sensor package using flip-chip technique and its manufacturing method, probe card for semiconductor chip tester and testing method, and bump structure for semiconductor devices and its manufacturing method. Patents related to double-sided plating process for semiconductor packaging. Conducting various R&D projects such as high-efficiency/high-reliability power device development using thick copper process, double-sided plating process technology for ultra-small IC packages and modules, micro bump development for Micro LED electrode formation, and research on next-generation millimeter-wave circuits, packages, and application technologies (utilizing FOWLP process).**Patents**: Holding over 30 patents. Specific patents include wafer rotating plating apparatus, solder bump structure and manufacturing method for flip-chip packages, manufacturing method for flip-chip bumps of semiconductor packages, image sensor package using flip-chip technique and its manufacturing method, probe card for semiconductor chip tester and testing method, and bump structure for semiconductor devices and its manufacturing method. Patents related to double-sided plating process for semiconductor packaging. Conducting various R&D projects such as high-efficiency/high-reliability power device development using thick copper process, double-sided plating process technology for ultra-small IC packages and modules, micro bump development for Micro LED electrode formation, and research on next-generation millimeter-wave circuits, packages, and application technologies (utilizing FOWLP process).
Introduction
Location
138 Cheongbuksandan-ro, Cheongbuk-eup, Pyeongtaek, Gyeonggi-do, South Korea
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