Information
9 4gongdan-ro 7-gil, Gumi, Gyeongsangbuk-do, South Korea
+82 54-470-0901
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Overview
- Summary
- LBLusem was a company primarily manufacturing Driver ICs, core components for flat panel displays, and Active Optical Cables (AOC). It focused on expanding its business into various areas based on its core competencies in semiconductor bonding and testing technologies. In late 2024 or early 2025, LBLusem merged with LB Semicon, becoming a part of LB Semicon's integrated back-end service portfolio. This merger aimed to strengthen competitiveness and position the combined entity as a Global Top 10 OSAT company by 2027.LBLusem was a company primarily manufacturing Driver ICs, core components for flat panel displays, and Active Optical Cables (AOC). It focused on expanding its business into various areas based on its core competencies in semiconductor bonding and testing technologies. In late 2024 or early 2025, LBLusem merged with LB Semicon, becoming a part of LB Semicon's integrated back-end service portfolio. This merger aimed to strengthen competitiveness and position the combined entity as a Global Top 10 OSAT company by 2027.
- Key Products/Technologies
- Display Driver ICs (DDI): Production of core semiconductor components for flat panel displays. This includes back-end processes such as Bump, Probe Test (PTEST), Chip on Film (COF), and Fine Scan Mark & Back Grinding Back Metal (FSM&BGBM) technologies. Expertise in COF packaging, primarily used in medium and large OLED and LCD panels. Advanced technologies include resin deposition for heat resistance, application of EMI shielding tape, dual-sided COF for mobile applications, and chip on plastic for OLED panels.Display Driver ICs (DDI): Production of core semiconductor components for flat panel displays. This includes back-end processes such as Bump, Probe Test (PTEST), Chip on Film (COF), and Fine Scan Mark & Back Grinding Back Metal (FSM&BGBM) technologies. Expertise in COF packaging, primarily used in medium and large OLED and LCD panels. Advanced technologies include resin deposition for heat resistance, application of EMI shielding tape, dual-sided COF for mobile applications, and chip on plastic for OLED panels.
- Active Optical Cables (AOC): Hybrid optical cable products for easy installation of video/audio systems in diverse environments such as digital signage, corporate, hospital, classroom, and military settings. These products overcome limitations of traditional copper cables regarding signal degradation, loss, transmission distance, weight, and thickness, supporting the UHD market. They support various standards like HDMI (1.4, 2.0, 2.1 8K video), DisplayPort (1.2a, 1.4a), and DVI. Key features include up to 8K video, lossless signal transmission up to 100m, no EMI, high tensile strength (over 500N), and flame-retardant properties (UL Plenum, LSZH).Active Optical Cables (AOC): Hybrid optical cable products for easy installation of video/audio systems in diverse environments such as digital signage, corporate, hospital, classroom, and military settings. These products overcome limitations of traditional copper cables regarding signal degradation, loss, transmission distance, weight, and thickness, supporting the UHD market. They support various standards like HDMI (1.4, 2.0, 2.1 8K video), DisplayPort (1.2a, 1.4a), and DVI. Key features include up to 8K video, lossless signal transmission up to 100m, no EMI, high tensile strength (over 500N), and flame-retardant properties (UL Plenum, LSZH).
- Power Semiconductor and System IC Test: Strategic expansion into power chip operations to reduce reliance on DDIs. Provision of packaging services for power management chips used in AI data centers. Technologies encompass BGBM, RDL, ENIG, Taiko grinding, and MOSFET testing for both front and back sides of wafers. Capabilities include thinning wafers to 30 micrometers and depositing metal to 50 micrometers.Power Semiconductor and System IC Test: Strategic expansion into power chip operations to reduce reliance on DDIs. Provision of packaging services for power management chips used in AI data centers. Technologies encompass BGBM, RDL, ENIG, Taiko grinding, and MOSFET testing for both front and back sides of wafers. Capabilities include thinning wafers to 30 micrometers and depositing metal to 50 micrometers.
- Mini Solar Cell: A product line including models like MS12-41, MS06-42, MS12-21, MS10-42. Utilizes dispenser and laminator encapsulation types. Offers various package sizes and specifications for voltage, current, and power output.Mini Solar Cell: A product line including models like MS12-41, MS06-42, MS12-21, MS10-42. Utilizes dispenser and laminator encapsulation types. Offers various package sizes and specifications for voltage, current, and power output.
- Core Advantages
- Display Driver IC (DDI) Back-end Expertise: Comprehensive DDI back-end services, including wafer bumping, testing, assembly, and final testing, for flat panel displays. Specialized COF packaging technology for medium and large OLED and LCD panels.Display Driver IC (DDI) Back-end Expertise: Comprehensive DDI back-end services, including wafer bumping, testing, assembly, and final testing, for flat panel displays. Specialized COF packaging technology for medium and large OLED and LCD panels.
- Advanced Semiconductor Bonding and Test Capabilities: Core competence in semiconductor bonding and testing technology, enabling expansion into diverse business areas. Application of these capabilities across Bump, PTEST, COF, FSM&BGBM back-end processes.Advanced Semiconductor Bonding and Test Capabilities: Core competence in semiconductor bonding and testing technology, enabling expansion into diverse business areas. Application of these capabilities across Bump, PTEST, COF, FSM&BGBM back-end processes.
- Strategic Diversification into Power Semiconductors and System ICs: Proactive business expansion into power chip operations and system IC testing to reduce DDI dependency. Entry into high-value markets such as AI data center power management chip packaging.Strategic Diversification into Power Semiconductors and System ICs: Proactive business expansion into power chip operations and system IC testing to reduce DDI dependency. Entry into high-value markets such as AI data center power management chip packaging.
- High-Performance Active Optical Cable (AOC) Technology: Development and production of high-performance hybrid optical cable products suitable for the UHD market. Differentiated product features including long-distance lossless transmission, EMI shielding, durability, and flame retardancy.High-Performance Active Optical Cable (AOC) Technology: Development and production of high-performance hybrid optical cable products suitable for the UHD market. Differentiated product features including long-distance lossless transmission, EMI shielding, durability, and flame retardancy.
- Synergy from Integrated Back-end Services: Enhanced capability to provide comprehensive turn-key services across the entire non-memory semiconductor back-end process through the merger with LB Semicon. This aims to secure a competitive edge in the global OSAT market and diversify its customer base.Synergy from Integrated Back-end Services: Enhanced capability to provide comprehensive turn-key services across the entire non-memory semiconductor back-end process through the merger with LB Semicon. This aims to secure a competitive edge in the global OSAT market and diversify its customer base.
- Strong Global Customer Network and Market Expansion: Long-standing partnerships with key DDI customers like LX Semicon (formerly Silicon Works). Efforts to expand market share by securing new mobile DDI customers and penetrating Chinese panel manufacturers.Strong Global Customer Network and Market Expansion: Long-standing partnerships with key DDI customers like LX Semicon (formerly Silicon Works). Efforts to expand market share by securing new mobile DDI customers and penetrating Chinese panel manufacturers.
- Target Industries
- Flat Panel Display Industry: Supply of Driver ICs, essential components for various flat panel displays including LCD and OLED.Flat Panel Display Industry: Supply of Driver ICs, essential components for various flat panel displays including LCD and OLED.
- Information and Communication & Video System Industry: Application of Active Optical Cables in video/audio systems for digital signage, corporate, residential, military, and medical sectors.Information and Communication & Video System Industry: Application of Active Optical Cables in video/audio systems for digital signage, corporate, residential, military, and medical sectors.
- Power Semiconductor and High-Power Electronic Device Industry: Wafer processing services and packaging for power semiconductors used in electric vehicles and high-power electronic devices.Power Semiconductor and High-Power Electronic Device Industry: Wafer processing services and packaging for power semiconductors used in electric vehicles and high-power electronic devices.
- AI Data Center Industry: Provision of packaging services for power management chips specifically designed for AI data centers.AI Data Center Industry: Provision of packaging services for power management chips specifically designed for AI data centers.
- IT Device Industry: Back-end processing services for non-memory semiconductors like DDI, PMIC, and CIS, closely linked to demand from front-end IT devices such as smartphones and tablets.IT Device Industry: Back-end processing services for non-memory semiconductors like DDI, PMIC, and CIS, closely linked to demand from front-end IT devices such as smartphones and tablets.
- Major Markets
- South Korea, China, Taiwan, JapanSouth Korea, China, Taiwan, Japan
- EuropeEurope
- United StatesUnited States
- Certifications/Patents
- AEO (Authorized Economic Operator) National Certification: Acquired certification as an Authorized Economic Operator for both importer and exporter.AEO (Authorized Economic Operator) National Certification: Acquired certification as an Authorized Economic Operator for both importer and exporter.
- ISO 9001:2015 (Quality Management System): Certification for its quality management system for products and services.ISO 9001:2015 (Quality Management System): Certification for its quality management system for products and services.
- ISO 14001:2015 (Environmental Management System): Certification for its environmental management system.ISO 14001:2015 (Environmental Management System): Certification for its environmental management system.
- ISO/IEC 27001:2013 (Information Security Management System): Certification for its information security management system.ISO/IEC 27001:2013 (Information Security Management System): Certification for its information security management system.
- ISO 45001:2018 (Occupational Health and Safety Management System): Certification for its occupational health and safety management system.ISO 45001:2018 (Occupational Health and Safety Management System): Certification for its occupational health and safety management system.
- IATF 16949:2016 (Automotive Quality Management System): Certification for its quality management system specific to the automotive industry.IATF 16949:2016 (Automotive Quality Management System): Certification for its quality management system specific to the automotive industry.
- ANSI/ESD S20.20-2021: Compliance with the electrostatic discharge control program standard.ANSI/ESD S20.20-2021: Compliance with the electrostatic discharge control program standard.
- Product Certifications: CE, UL, FCC, HDMI Licensing, and KC certifications for its Active Optical Cable products.Product Certifications: CE, UL, FCC, HDMI Licensing, and KC certifications for its Active Optical Cable products.
- High-tech Entrepreneur Certification: Recognition as a company engaged in high-tech and high-value-added businesses.High-tech Entrepreneur Certification: Recognition as a company engaged in high-tech and high-value-added businesses.
- Awards: Presidential Commendation at the Quality Management Competition (2007), Export Tower Awards (100M USD in 2007, 200M USD in 2008, 300M USD in 2011). Gumi City Best Entrepreneur Award (2010), Minister of Strategy and Finance Award (2011), Corporate Win-Win Cooperation Commendation (2014).Awards: Presidential Commendation at the Quality Management Competition (2007), Export Tower Awards (100M USD in 2007, 200M USD in 2008, 300M USD in 2011). Gumi City Best Entrepreneur Award (2010), Minister of Strategy and Finance Award (2011), Corporate Win-Win Cooperation Commendation (2014).
Introduction
Location
9 4gongdan-ro 7-gil, Gumi, Gyeongsangbuk-do, South Korea
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