Information
9-9 Dongtansandan 4-gil, Hwaseong-si, Gyeonggi-do, South Korea
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Overview
- Summary
- A pioneering company providing selective soldering and bonding solutions for advanced industries like semiconductors, displays, and EV/secondary batteries, based on Area Laser technology.A pioneering company providing selective soldering and bonding solutions for advanced industries like semiconductors, displays, and EV/secondary batteries, based on Area Laser technology.
- Key Products/Technologies
- Laserssel's core technology involves converting spot lasers into area lasers, enabling uniform laser beam irradiation over large areas. This is achieved through its patented Beam Shaping Optic Module (BSOM) technology, boasting over 90% beam uniformity. The company secures superior beam uniformity by utilizing a single laser source, unlike competitors employing multiple laser diodes. Furthermore, its unique capability allows for flexible adjustment of the laser bonding area according to customer requirements.Laserssel's core technology involves converting spot lasers into area lasers, enabling uniform laser beam irradiation over large areas. This is achieved through its patented Beam Shaping Optic Module (BSOM) technology, boasting over 90% beam uniformity. The company secures superior beam uniformity by utilizing a single laser source, unlike competitors employing multiple laser diodes. Furthermore, its unique capability allows for flexible adjustment of the laser bonding area according to customer requirements.
- Among its main product lines, the LSR (Laser Selective Reflow) Series represents laser selective reflow equipment. The LSR1000 model offers a 1kW single laser head and bonding accuracy exceeding ±5.0 microns. It supports variable beam sizes of 5-50mm and/or 15-75mm, with fixed beams up to 100x100mm, in square and rectangular shapes. Laserssel achieved the world's first commercialization of 200x200mm and 300x300mm (12-inch wafer size) Area∙Laser based LSR.Among its main product lines, the LSR (Laser Selective Reflow) Series represents laser selective reflow equipment. The LSR1000 model offers a 1kW single laser head and bonding accuracy exceeding ±5.0 microns. It supports variable beam sizes of 5-50mm and/or 15-75mm, with fixed beams up to 100x100mm, in square and rectangular shapes. Laserssel achieved the world's first commercialization of 200x200mm and 300x300mm (12-inch wafer size) Area∙Laser based LSR.
- The LCB (Laser Compression Bonder) Series is a laser compression bonder for semiconductor packages. The LCB3000 model features a 3kW single laser head, applicable to 2.5D packaging larger than 60x60mm and NAND modules thinner than 50um. This technology combines high-precision compression tools with area laser bonding to minimize warpage in extremely thin packages and substrates. It includes monitoring functions such as an IR camera, beam profiler, and real-time power meter.The LCB (Laser Compression Bonder) Series is a laser compression bonder for semiconductor packages. The LCB3000 model features a 3kW single laser head, applicable to 2.5D packaging larger than 60x60mm and NAND modules thinner than 50um. This technology combines high-precision compression tools with area laser bonding to minimize warpage in extremely thin packages and substrates. It includes monitoring functions such as an IR camera, beam profiler, and real-time power meter.
- The rLSR (Mini LED Rework System) Series is a mini/micro LED rework system. It utilizes a 400W laser for reworking all types of chips, passive components, and micro-sized LEDs. The system enables rework of ultra-small mini/micro LEDs without affecting adjacent components, providing over 99% rework yield in backlight panel production lines for tablets and notebook PCs. The pLSR Series is a 100W laser-based equipment specialized for cantilever bonding on probe cards.The rLSR (Mini LED Rework System) Series is a mini/micro LED rework system. It utilizes a 400W laser for reworking all types of chips, passive components, and micro-sized LEDs. The system enables rework of ultra-small mini/micro LEDs without affecting adjacent components, providing over 99% rework yield in backlight panel production lines for tablets and notebook PCs. The pLSR Series is a 100W laser-based equipment specialized for cantilever bonding on probe cards.
- Core Advantages
- Possession of World's First Area Laser Original Technology: A unique technological capability to convert spot lasers into area lasers, enabling uniform energy irradiation over large areas in a short time. This represents an innovative approach overcoming the limitations of conventional laser technologies.Possession of World's First Area Laser Original Technology: A unique technological capability to convert spot lasers into area lasers, enabling uniform energy irradiation over large areas in a short time. This represents an innovative approach overcoming the limitations of conventional laser technologies.
- Solutions for Advanced Semiconductor Packaging Challenges: Providing solutions for various packaging difficulties, such as preventing warpage in large-area, ultra-thin advanced semiconductors and bonding heat-sensitive substrates, which were previously unresolvable with conventional reflow processes.Solutions for Advanced Semiconductor Packaging Challenges: Providing solutions for various packaging difficulties, such as preventing warpage in large-area, ultra-thin advanced semiconductors and bonding heat-sensitive substrates, which were previously unresolvable with conventional reflow processes.
- High Productivity and Cost Efficiency: Rapid ramp-up in seconds, fast cooling rate of 65°C/second, selective area heating, reduced footprint, energy savings from eliminating nitrogen purge, and quick tact time, leading to enhanced productivity and lower operating costs.High Productivity and Cost Efficiency: Rapid ramp-up in seconds, fast cooling rate of 65°C/second, selective area heating, reduced footprint, energy savings from eliminating nitrogen purge, and quick tact time, leading to enhanced productivity and lower operating costs.
- High Reliability and Precision Bonding: A fast laser bonding process of 1-3 seconds, support for 40-micron pitch solder bumps and 30-micron chip soldering, shorter TAL (Time Above Liquidus), and superior shear strength, ensuring high bonding reliability.High Reliability and Precision Bonding: A fast laser bonding process of 1-3 seconds, support for 40-micron pitch solder bumps and 30-micron chip soldering, shorter TAL (Time Above Liquidus), and superior shear strength, ensuring high bonding reliability.
- Global Market Leadership and Technological Innovation: World's first commercialization of 300x300mm (12-inch wafer size) Area∙Laser based LSR and completion of development for large-area LSRs up to 450x450mm and 600x600mm, demonstrating leading technology in the next-generation packaging market.Global Market Leadership and Technological Innovation: World's first commercialization of 300x300mm (12-inch wafer size) Area∙Laser based LSR and completion of development for large-area LSRs up to 450x450mm and 600x600mm, demonstrating leading technology in the next-generation packaging market.
- Diverse Industrial Applications and Market Diversification: A broad technology portfolio applicable across various industries, including semiconductors, high-end displays, electric vehicles/secondary batteries, advanced consumer electronics, and defense.Diverse Industrial Applications and Market Diversification: A broad technology portfolio applicable across various industries, including semiconductors, high-end displays, electric vehicles/secondary batteries, advanced consumer electronics, and defense.
- Target Industrie
- Advanced Semiconductors: Warpage prevention and heterogeneous integration package bonding solutions for high-performance semiconductors demanded in AI, 5G, IoT, and autonomous driving industries. Specifically, the application of area laser technology in HBM (High Bandwidth Memory) bonding processes and ultra-thin die bonding.Advanced Semiconductors: Warpage prevention and heterogeneous integration package bonding solutions for high-performance semiconductors demanded in AI, 5G, IoT, and autonomous driving industries. Specifically, the application of area laser technology in HBM (High Bandwidth Memory) bonding processes and ultra-thin die bonding.
- Next-Generation Displays: Production of backlight units (BLU) for mini/micro LED displays and bonding/rework processes for ultra-small LED components. The rLSR Mini LED Rework System is applied in backlight panel production lines for tablets and notebook PCs.Next-Generation Displays: Production of backlight units (BLU) for mini/micro LED displays and bonding/rework processes for ultra-small LED components. The rLSR Mini LED Rework System is applied in backlight panel production lines for tablets and notebook PCs.
- Electric Vehicles/Secondary Batteries: Soldering heat-sensitive components on EV battery modules and FPCBs (Flexible Printed Circuit Boards) without damage. Examples include supplying LSR equipment to multiple premium EV manufacturers in Europe.Electric Vehicles/Secondary Batteries: Soldering heat-sensitive components on EV battery modules and FPCBs (Flexible Printed Circuit Boards) without damage. Examples include supplying LSR equipment to multiple premium EV manufacturers in Europe.
- Advanced Consumer Electronics and Mobile/Wearables: Precision component bonding and rework for high-performance consumer electronics and miniaturized, lightweight mobile/wearable devices.Advanced Consumer Electronics and Mobile/Wearables: Precision component bonding and rework for high-performance consumer electronics and miniaturized, lightweight mobile/wearable devices.
- Military and Industrial Segments: Soldering of specialized electronic devices and components for defense and general industrial applications.Military and Industrial Segments: Soldering of specialized electronic devices and components for defense and general industrial applications.
- Medical Devices and Solar Cells: Various precision soldering applications, including medical device components and solar cell packaging.Medical Devices and Solar Cells: Various precision soldering applications, including medical device components and solar cell packaging.
- Major Markets
- South Korea, Japan, Singapore, China, Malaysia, TaiwanSouth Korea, Japan, Singapore, China, Malaysia, Taiwan
- Netherlands, Czech RepublicNetherlands, Czech Republic
- United States, MexicoUnited States, Mexico
- Certifications/Patents
- Acquisition of ISO 9001:2015 Quality Management System certification.Acquisition of ISO 9001:2015 Quality Management System certification.
- Designated as a 'PPURI Technology Specialized Company' and 'Innovation-Business (INNO-BIZ)' by the Ministry of SMEs and Startups.Designated as a 'PPURI Technology Specialized Company' and 'Innovation-Business (INNO-BIZ)' by the Ministry of SMEs and Startups.
- Recognized as a 'Materials, Components and Equipment Specialized Company' by the Korea Planning & Evaluation of Industrial Technology.Recognized as a 'Materials, Components and Equipment Specialized Company' by the Korea Planning & Evaluation of Industrial Technology.
- Holds international and domestic safety/quality standard certifications including SEMI, CE, KCs, and UL.Holds international and domestic safety/quality standard certifications including SEMI, CE, KCs, and UL.
- Exclusive advantage in area laser beam uniformity and control technology through its patented Beam Shaping Optic Module (BSOM).Exclusive advantage in area laser beam uniformity and control technology through its patented Beam Shaping Optic Module (BSOM).
- Enhanced intellectual property competitiveness through selection as a 'Global IP Company'.Enhanced intellectual property competitiveness through selection as a 'Global IP Company'.
- Participation in and leadership of government projects, including 'Development of Non Conductive Film (NCF) for Stacked Package of TSV 3D IC' and 'Development of Multi Beam Large Area Laser Reflow System for High-Efficiency Production of Advanced Flip Chip Semiconductors'.Participation in and leadership of government projects, including 'Development of Non Conductive Film (NCF) for Stacked Package of TSV 3D IC' and 'Development of Multi Beam Large Area Laser Reflow System for High-Efficiency Production of Advanced Flip Chip Semiconductors'.
Introduction
Location
9-9 Dongtansandan 4-gil, Hwaseong-si, Gyeonggi-do, South Korea
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