Information
330 Yeonamyulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea
+82 41-539-6120
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Overview
- Summary
- A company specializing in the manufacturing and supply of semiconductor front-end and back-end materials, as well as exterior cases and packaging for next-generation SSDsA company specializing in the manufacturing and supply of semiconductor front-end and back-end materials, as well as exterior cases and packaging for next-generation SSDs
- Key Products/Technologies
- IC-Tray products for semiconductor component packaging and transport, offering protection against electromagnetic waves, static electricity, external impact, and high temperatures. Applicable to various packages such as TSOP, QFP, QFN, MLF, BGA, CSP, BOC, MCP, LGA, LPDDR, eMMC, eMCP, Flip Chip, SiP, with heat resistance from 130℃ to 260℃ and surface resistance ranging from 10E5 to 10E10. Utilizing diverse materials including ABS, PPE, PPO, PSU, PES, PEEK, and Low Particle PPO (Carbon Powder, Carbon Fiber).IC-Tray products for semiconductor component packaging and transport, offering protection against electromagnetic waves, static electricity, external impact, and high temperatures. Applicable to various packages such as TSOP, QFP, QFN, MLF, BGA, CSP, BOC, MCP, LGA, LPDDR, eMMC, eMCP, Flip Chip, SiP, with heat resistance from 130℃ to 260℃ and surface resistance ranging from 10E5 to 10E10. Utilizing diverse materials including ABS, PPE, PPO, PSU, PES, PEEK, and Low Particle PPO (Carbon Powder, Carbon Fiber).
- Module Tray products, high-functionality plastic vacuum-formed items designed to safely protect semiconductor and LCD module products, as well as other precision electronic components, from external impact and electromagnetic waves. Applicable to a wide range of products including DRAM & SSD modules, FPCB modules, BLU panels, camera lens modules, memory cards, HDD components, and various packaging containers. Possessing technology to handle various sheet thicknesses from 0.35mm to 3.0mm and simultaneous vacuum forming of concave and convex shapes. Using materials such as mPS (HIPS, GPPS), PP, PET, ABS, and PC.Module Tray products, high-functionality plastic vacuum-formed items designed to safely protect semiconductor and LCD module products, as well as other precision electronic components, from external impact and electromagnetic waves. Applicable to a wide range of products including DRAM & SSD modules, FPCB modules, BLU panels, camera lens modules, memory cards, HDD components, and various packaging containers. Possessing technology to handle various sheet thicknesses from 0.35mm to 3.0mm and simultaneous vacuum forming of concave and convex shapes. Using materials such as mPS (HIPS, GPPS), PP, PET, ABS, and PC.
- Carrier Tape products for protecting components from physical force and ESD during transport and storage, primarily used for automatic insertion of electrical and electronic components onto PCBs. Applied in various applications including semiconductors (memory/non-memory), electrical/electronic components, capacitors, LEDs, resistors, diode SMD products, batteries, cases, and connectors. Offering widths from 8mm to 44mm, thicknesses from 0.10mm to 0.50mm, and lengths exceeding 2,000 meters, with surface resistance characteristics of 10E4 to 10E10 using PS, PET, PC, and PC-ABS materials.Carrier Tape products for protecting components from physical force and ESD during transport and storage, primarily used for automatic insertion of electrical and electronic components onto PCBs. Applied in various applications including semiconductors (memory/non-memory), electrical/electronic components, capacitors, LEDs, resistors, diode SMD products, batteries, cases, and connectors. Offering widths from 8mm to 44mm, thicknesses from 0.10mm to 0.50mm, and lengths exceeding 2,000 meters, with surface resistance characteristics of 10E4 to 10E10 using PS, PET, PC, and PC-ABS materials.
- Wafer Carrier products, essential materials used in semiconductor front-end processes, supplied to leading domestic and international semiconductor manufacturers with world-class technology and mass production capabilities.Wafer Carrier products, essential materials used in semiconductor front-end processes, supplied to leading domestic and international semiconductor manufacturers with world-class technology and mass production capabilities.
- SSD Enclosure products, exterior cases for mounting semiconductor flash memory chips in SSDs. Employing various manufacturing methods such as die-casting, stamping, and injection molding, along with internalized post-processing technologies including sanding, hairline finishing, anodizing, ED-coating, CNC, C-Cut, tapping, press fit-in, laser marking, and printing. Utilizing metal (AL, ALDC 12, etc.) and plastic (PC) materials.SSD Enclosure products, exterior cases for mounting semiconductor flash memory chips in SSDs. Employing various manufacturing methods such as die-casting, stamping, and injection molding, along with internalized post-processing technologies including sanding, hairline finishing, anodizing, ED-coating, CNC, C-Cut, tapping, press fit-in, laser marking, and printing. Utilizing metal (AL, ALDC 12, etc.) and plastic (PC) materials.
- Turnkey Box products, complete packaged SSD products for consumer and enterprise sales, with proprietary systematic development processes and know-how as a domestic pioneer. Demonstrating fast and flexible production response capabilities from material procurement to production, assembly, and packaging. Including SSD finished products, user manuals, product labels, and protective cases in its composition.Turnkey Box products, complete packaged SSD products for consumer and enterprise sales, with proprietary systematic development processes and know-how as a domestic pioneer. Demonstrating fast and flexible production response capabilities from material procurement to production, assembly, and packaging. Including SSD finished products, user manuals, product labels, and protective cases in its composition.
- Core Advantages
- Possession of world-class technology and mass production capabilities in semiconductor front-end and back-end component materials.Possession of world-class technology and mass production capabilities in semiconductor front-end and back-end component materials.
- Maintenance of strong business partnerships with leading domestic and international semiconductor manufacturers such as Samsung Electronics, SK Hynix, and Micron.Maintenance of strong business partnerships with leading domestic and international semiconductor manufacturers such as Samsung Electronics, SK Hynix, and Micron.
- Ability to continuously grow by adapting to SSD market trends, supplying exterior cases and turnkey boxes for next-generation storage devices.Ability to continuously grow by adapting to SSD market trends, supplying exterior cases and turnkey boxes for next-generation storage devices.
- Establishment of a global production infrastructure in Korea, China (Suzhou, Xi'an), the Philippines, and Vietnam, enhancing production efficiency and market responsiveness.Establishment of a global production infrastructure in Korea, China (Suzhou, Xi'an), the Philippines, and Vietnam, enhancing production efficiency and market responsiveness.
- Internalization of various manufacturing processes (die-casting, stamping, injection molding) and post-processing technologies (sanding, anodizing, CNC) for SSD cases, ensuring high quality and cost competitiveness.Internalization of various manufacturing processes (die-casting, stamping, injection molding) and post-processing technologies (sanding, anodizing, CNC) for SSD cases, ensuring high quality and cost competitiveness.
- Successful localization development of semiconductor front-end materials and direct supply to domestic and international semiconductor component manufacturers, indicating a technological edge.Successful localization development of semiconductor front-end materials and direct supply to domestic and international semiconductor component manufacturers, indicating a technological edge.
- Target Industrie
- Semiconductor Industry (Front-end and Back-end processes)Semiconductor Industry (Front-end and Back-end processes)
- Memory Market (SSD)Memory Market (SSD)
- Electrical/Electronic Components IndustryElectrical/Electronic Components Industry
- Automotive IndustryAutomotive Industry
- Display IndustryDisplay Industry
- Smartphone IndustrySmartphone Industry
- Major Markets
- China, Philippines, Vietnam, Taiwan, Singapore, MalaysiaChina, Philippines, Vietnam, Taiwan, Singapore, Malaysia
- Certifications/Patents
- ISO 9001:2015 (Quality Management System) certification.ISO 9001:2015 (Quality Management System) certification.
- ISO 14001:2015 (Environmental Management System) certification.ISO 14001:2015 (Environmental Management System) certification.
- ISO 45001:2018 (Occupational Health and Safety Management System) certification.ISO 45001:2018 (Occupational Health and Safety Management System) certification.
- ISO 16949:2016 (Automotive Industry Quality Management System) certification.ISO 16949:2016 (Automotive Industry Quality Management System) certification.
- Possession of a total of 24 patents, 9 design rights, and 15 trademarks.Possession of a total of 24 patents, 9 design rights, and 15 trademarks.
- Key patents include 'Semiconductor Carrier Tape Winding Reel', 'Tape Winding Reel', 'Method for Purifying Polycarbonate and Polycarbonate Purified Thereby', 'Heat-Resistant Thermoplastic Resin Composition and Method for Manufacturing the Same', 'Case for SSD', 'Jig for 3D Measurement', 'Semiconductor Chip Tray Manufacturing Apparatus and Method Thereof', 'Apparatus and Method for Correcting Flatness of SSD Case', 'Case Flatness Correction Apparatus', and 'Semiconductor Chip Tray'.Key patents include 'Semiconductor Carrier Tape Winding Reel', 'Tape Winding Reel', 'Method for Purifying Polycarbonate and Polycarbonate Purified Thereby', 'Heat-Resistant Thermoplastic Resin Composition and Method for Manufacturing the Same', 'Case for SSD', 'Jig for 3D Measurement', 'Semiconductor Chip Tray Manufacturing Apparatus and Method Thereof', 'Apparatus and Method for Correcting Flatness of SSD Case', 'Case Flatness Correction Apparatus', and 'Semiconductor Chip Tray'.
Introduction
Location
330 Yeonamyulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea
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