Chat with us, powered by LiveChat High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers. | KSEM - Komachine
Product Name High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
Model AD-300
Series Die Bonder
Catalog
Product Description


Basic Information

Model name : AD-300

High-accuracy  & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.



Features

1.High productivity : UPH 7K (B’g time 0.5s , dual two in one concept)

2.Single lane(standard) , Dual lane(option) : Bin 1 & Bin 2 division bonding

3.High placement accuracy : ±10㎛@3σ 

4.Thin die bonding technology

    Patented slide ejector

    Multi step ejector compatible

    Min thickness 20㎛

5. 100class cleanness of FFU

6.Auto device change

    Auto tool change : Bond, Pickup tool    Ultra thin die thickness : Min 20㎛

7.OHT automation

8.Wafer auto change system



Main Specs

Bonding MethodEpoxy bonding / DAF Tape
Bonding Speed0.5sec/cycle
Bonding Accuracy
XY : ±10μm,3σ
θ : ±0.05°,3σ
Die Size Ø5.0-25.0mm t=30μm-
Substrate Size
Length : 100–300 mm
Width : 30–102 mm
Magazine Size
Length : 100–315 mm
Width : 30–115 mm
Thickness : 50–200 mm
Wafer Size
Max 12 inch
Power requirements
Power supply : AC 220 V 30 A
Dry air 
0.5 MPa (60 L/min)
Vacuum
-80 KPa (100 L/min)
Dimensions
(W) 2,160 × (D) 1,470 × (H) 1,600 mm
Weight
Approximately 2,500 kg



Options

Optional FunctionsDual lane
Ionizer blower
Needleless pickup unit
Wafer mapping
Secs & gem
FFU / ATC / OHT



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