KSEM
About Supplier
K-SEM, DIE Bonder & Sorter Manufacturer, the company is built with the professsional engineers from SEMES, a subsidiary company of Samsung.
KSEM manufacture DIe Bonder and Sorter equipment for semiconductor, display, and camera module productions.
We provide total solutions for Micro LED & Mini LED, DDI, IC, LSI, Image Sensor, WLP & PLP, and CELL Type Tape Full Auto Lamination Solution Equipment.
+82-41-545-0943
+82-41-901-4136
145-27, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, Korea
Product List
Die Bonder
High-speed, high-accuracy die bonder for 8 inch wafer IC･LSI
AD-100
High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
AD-200
High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
AD-300
High performance FO-PLP BONDER
AD-400
Lamination
Tape Full Auto Lamination For Cell
ALM-100