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  • KSEM
    KSEM

    KSEM

    About Supplier

    K-SEM, DIE Bonder & Sorter Manufacturer, the company is built with the professsional engineers from SEMES, a subsidiary company of Samsung. 

    KSEM manufacture DIe Bonder and Sorter equipment for semiconductor, display, and camera module productions.

    We provide total solutions for Micro LED & Mini LED, DDI, IC, LSI, Image Sensor, WLP & PLP, and CELL Type Tape Full Auto Lamination Solution Equipment.

     

    +82-41-545-0943
    +82-41-901-4136
    145-27, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, Korea

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100