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  • High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    KSEM

    KSEM

    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    Model
    AD-200
    Series
    Die Bonder

    Product Description

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100