Chat with us, powered by LiveChat High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers. | KSEM - Komachine
Product Name High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
Model AD-200
Series Die Bonder
Catalog
Product Description


Basic Information

Model name : AD-200

High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.



Features

1.High quality / High productivity  : two in one concept.

    Use of intermediate stage ensures high quality and high productivity.

2.Best Quality of Patented paste controller(syringe 5cc, 10cc, option 30cc~).

3.Applied Force Control of Air Actuator.

4.Applied High Speed linear motor system.

5.Real time pre/post Inspection System  6.High-accuracy small die pickup    Min 0.2mm compatibility.

7.Thin die bonding technology

    Patented slide ejector

    Multi step ejector compatible

    Min thickness 20㎛

8. 100class cleanness of FFU

9. Wafer auto change system



Main Specs

Bonding MethodEpoxy bonding / DAF Tape
Bonding Speed0.35sec/cycle
Bonding Accuracy
Epoxy : XY ± 20 μm , 3σ
DAF : XY ± 10 μm , 3σ
Bonding Force 
0.5~30N(Option 50N)
Lead frame Size
Length : 100–300 mm
Width : 30–102 mm
Thickness : 0.075–2.0 mm
Magazine Size
Length : 100–315 mm
Width : 30–115 mm
Thickness : 50–200 mm
Wafer Size
8/12 inch
Power requirements
Power supply : AC 220 V 30 A
Dry air 
0.4 MPa (60 L/min)
Vacuum
-70KPa (100 L/min)
Dimensions
(W) 1,930 × (D) 1,400 × (H) 1,600 mm
Weight
Approximately 2,000 kg



Options

Optional FunctionsTwo in one die stage unit
Magazine stacker loader
Needleless pickup unit
Polishing cover
Wafer mapping
SECS & GEM
FFU



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