Information
169-23 Gasan digital 2-ro, Geumcheon District, Seoul, South Korea
+82 2-3397-3566
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Overview
- Summary
- KOVIS TECHNOLOGY is a company dedicated to exploring advanced mechanical physics science, reaching the essence of matter through cutting-edge metrology technology. It is a specialized enterprise that develops, manufactures, and supplies innovative Metrology and Inspection equipment of the highest quality. The company provides inspection and measurement solutions with high accuracy, productivity, and reliability to the semiconductor and advanced industries. Its core technology is 'algorithmic technology,' utilizing advanced measurement sensors and optimal algorithms. KOVIS TECHNOLOGY offers innovative process inspection (MI) and measurement solutions across the entire semiconductor value chain, from R&D to final production.KOVIS TECHNOLOGY is a company dedicated to exploring advanced mechanical physics science, reaching the essence of matter through cutting-edge metrology technology. It is a specialized enterprise that develops, manufactures, and supplies innovative Metrology and Inspection equipment of the highest quality. The company provides inspection and measurement solutions with high accuracy, productivity, and reliability to the semiconductor and advanced industries. Its core technology is 'algorithmic technology,' utilizing advanced measurement sensors and optimal algorithms. KOVIS TECHNOLOGY offers innovative process inspection (MI) and measurement solutions across the entire semiconductor value chain, from R&D to final production.
- Key Products/Technologies
- OptiMass, a mass metrology equipment for ultra-fine and micro semiconductor wafers. It possesses the capability to measure wafer weight at a microgram level. The equipment shows over 10% improved throughput compared to existing foreign products. It was supplied to SK Hynix's mass production line in 2022. The company is developing the next-generation ultra-fine mass equipment (OptiMax), aiming for 50% improved measurement performance and speed.OptiMass, a mass metrology equipment for ultra-fine and micro semiconductor wafers. It possesses the capability to measure wafer weight at a microgram level. The equipment shows over 10% improved throughput compared to existing foreign products. It was supplied to SK Hynix's mass production line in 2022. The company is developing the next-generation ultra-fine mass equipment (OptiMax), aiming for 50% improved measurement performance and speed.
- ATLAN (Advanced Scanning Acoustic Tomography), a next-generation automated C-SAM system utilizing advanced SAT technology. It features inspection capabilities for voids, defects, and micro-cracks between HBM wafers and wafer bonding layers. The application of a swirling spinning scan method reduces HBM inspection time by 5 times, from 1 hour to approximately 10 minutes. It offers non-destructive inspection and 2.5D/3D IC stacked defect inspection solutions. Joint development and production line application with SK Hynix are notable achievements.ATLAN (Advanced Scanning Acoustic Tomography), a next-generation automated C-SAM system utilizing advanced SAT technology. It features inspection capabilities for voids, defects, and micro-cracks between HBM wafers and wafer bonding layers. The application of a swirling spinning scan method reduces HBM inspection time by 5 times, from 1 hour to approximately 10 minutes. It offers non-destructive inspection and 2.5D/3D IC stacked defect inspection solutions. Joint development and production line application with SK Hynix are notable achievements.
- WARP Series (WARP™), a non-contact high-precision wafer shape measurement instrument for measuring thickness, TTV, flatness, warp, and bow of wafers and PLPs with nanometer resolution. RT-3500™, a hybrid metrology equipment that simultaneously measures the thickness and surface roughness of various semiconductor wafers. It offers 10nm resolution for wafer thickness, TTV, warpage & bow measurement, and nanometer-level roughness and 3D shape precision measurement with 0.1nm height resolution.WARP Series (WARP™), a non-contact high-precision wafer shape measurement instrument for measuring thickness, TTV, flatness, warp, and bow of wafers and PLPs with nanometer resolution. RT-3500™, a hybrid metrology equipment that simultaneously measures the thickness and surface roughness of various semiconductor wafers. It offers 10nm resolution for wafer thickness, TTV, warpage & bow measurement, and nanometer-level roughness and 3D shape precision measurement with 0.1nm height resolution.
- DEEP-Via, a TSV (Through-Silicon Via) metrology equipment for measuring micro-holes (via holes) for vertical stacking of HBM and 3D logic semiconductors. It has the capability to measure holes smaller than 3 micrometers (㎛) and utilizes spectroscopic interferometric optical technology through light reflection and refraction. It provides precise measurement of hole size and depth, with a high aspect ratio of up to 1:20.DEEP-Via, a TSV (Through-Silicon Via) metrology equipment for measuring micro-holes (via holes) for vertical stacking of HBM and 3D logic semiconductors. It has the capability to measure holes smaller than 3 micrometers (㎛) and utilizes spectroscopic interferometric optical technology through light reflection and refraction. It provides precise measurement of hole size and depth, with a high aspect ratio of up to 1:20.
- µGOI™ (Micro-GOI™), a state-of-the-art in-line metrology instrument for real-time measurement of electrical characteristics of MOSFET Gate Oxide/High-K thin films. It functions to minimize process defects and prevent potential electrical characteristic flaws in advance. Developed through SK Hynix's win-win cooperation program, it boasts over 10 times higher measurement precision compared to competitors.µGOI™ (Micro-GOI™), a state-of-the-art in-line metrology instrument for real-time measurement of electrical characteristics of MOSFET Gate Oxide/High-K thin films. It functions to minimize process defects and prevent potential electrical characteristic flaws in advance. Developed through SK Hynix's win-win cooperation program, it boasts over 10 times higher measurement precision compared to competitors.
- Filcon (Spectroscopic Reflectometer) and Ellis (Spectroscopic Ellipsometer), equipment for measuring thickness, reflectance, and transmittance of transparent thin films from 1nm to 1000㎛. It features precise localized area measurement with a micro-spot of less than 20um.Filcon (Spectroscopic Reflectometer) and Ellis (Spectroscopic Ellipsometer), equipment for measuring thickness, reflectance, and transmittance of transparent thin films from 1nm to 1000㎛. It features precise localized area measurement with a micro-spot of less than 20um.
- μRS (Micro 4Point Probe Metrology) and Macro-RS (Macro RS 4PP), sheet resistance measurement instruments.μRS (Micro 4Point Probe Metrology) and Macro-RS (Macro RS 4PP), sheet resistance measurement instruments.
- Hawk, a bond tester.Hawk, a bond tester.
- Nanomez, a non-contact 3D profiler (White Light Interferometer).Nanomez, a non-contact 3D profiler (White Light Interferometer).
- IR Microscopes System in its portfolio.IR Microscopes System in its portfolio.
- Vision products and solutions, including lenses, cables, connectors, and I/O boards, for improving machine vision inspection environments.Vision products and solutions, including lenses, cables, connectors, and I/O boards, for improving machine vision inspection environments.
- Core Advantages
- Possession of proprietary 'algorithmic technology' utilizing advanced measurement sensors and optimal algorithms. This represents a core capability in exploring advanced mechanical physics science to reach the essence of matter.Possession of proprietary 'algorithmic technology' utilizing advanced measurement sensors and optimal algorithms. This represents a core capability in exploring advanced mechanical physics science to reach the essence of matter.
- Leading the successful localization of key semiconductor metrology equipment, such as wafer mass metrology instruments, HBM C-SAM, and TSV metrology equipment, which were previously dominated by foreign products. Contribution to technological self-reliance through joint development with SK Hynix, leading to localization and application in mass production lines.Leading the successful localization of key semiconductor metrology equipment, such as wafer mass metrology instruments, HBM C-SAM, and TSV metrology equipment, which were previously dominated by foreign products. Contribution to technological self-reliance through joint development with SK Hynix, leading to localization and application in mass production lines.
- Overwhelming performance advantages, including more than 10% improved throughput for wafer mass metrology equipment, 5 times faster C-SAM inspection time, and over 10 times higher measurement precision for GOI facilities compared to competitors. Securing ultra-precision measurement capabilities with nanometer resolution and 0.1nm height resolution.Overwhelming performance advantages, including more than 10% improved throughput for wafer mass metrology equipment, 5 times faster C-SAM inspection time, and over 10 times higher measurement precision for GOI facilities compared to competitors. Securing ultra-precision measurement capabilities with nanometer resolution and 0.1nm height resolution.
- Provision of a broad technology portfolio and integrated solutions, ranging from in-line metrology for wafer micro-mass and electrical characteristics to advanced C-SAM-based 2.5D/3D IC stacked defect inspection. Capability to offer innovative process inspection and measurement solutions across the entire semiconductor value chain.Provision of a broad technology portfolio and integrated solutions, ranging from in-line metrology for wafer micro-mass and electrical characteristics to advanced C-SAM-based 2.5D/3D IC stacked defect inspection. Capability to offer innovative process inspection and measurement solutions across the entire semiconductor value chain.
- Retention of highly skilled professional personnel, including top technicians with over 15 years of experience in semiconductor metrology and specialized master's and doctoral-level researchers. This serves as a driving force for continuous technological innovation and high-quality equipment development.Retention of highly skilled professional personnel, including top technicians with over 15 years of experience in semiconductor metrology and specialized master's and doctoral-level researchers. This serves as a driving force for continuous technological innovation and high-quality equipment development.
- Ability to provide customized automation systems, from stand-alone to fully automated in-line solutions. Flexibility in building optimized solutions for various customer environments.Ability to provide customized automation systems, from stand-alone to fully automated in-line solutions. Flexibility in building optimized solutions for various customer environments.
- Target Industrie
- Semiconductor Industry (Wafer FAB, Wafer Level Packaging, IC Packaging, HBM, 3D IC)Semiconductor Industry (Wafer FAB, Wafer Level Packaging, IC Packaging, HBM, 3D IC)
- Display IndustryDisplay Industry
- Electrical and Electronics IndustryElectrical and Electronics Industry
- Mobile Internet SectorMobile Internet Sector
- Computing SectorComputing Sector
- Automotive IndustryAutomotive Industry
- LED IndustryLED Industry
- Solar Energy IndustrySolar Energy Industry
- MEMS SectorMEMS Sector
- PLP (Panel Level Package) ManufacturingPLP (Panel Level Package) Manufacturing
- PCB (Printed Circuit Board) ManufacturingPCB (Printed Circuit Board) Manufacturing
- Major Markets
- South Korea, Global semiconductor and electronics industry marketsSouth Korea, Global semiconductor and electronics industry markets
- France (market with expected replacement of foreign equipment)France (market with expected replacement of foreign equipment)
- United States (market with expected replacement of foreign equipment)United States (market with expected replacement of foreign equipment)
- Certifications/Patents
- Possession of a venture company certification from the Korea Technology Finance Corporation.Possession of a venture company certification from the Korea Technology Finance Corporation.
- Establishment of a dedicated R&D department.Establishment of a dedicated R&D department.
- Holding a total of 24 patents (as of January 2025).Holding a total of 24 patents (as of January 2025).
- Patented technology related to automatic micro-probing contact detection and nano-level contact force control (applied in µGOI™ equipment).Patented technology related to automatic micro-probing contact detection and nano-level contact force control (applied in µGOI™ equipment).
- History of conducting multiple national R&D projects related to semiconductors, sheet resistance, and non-destructive testing.History of conducting multiple national R&D projects related to semiconductors, sheet resistance, and non-destructive testing.
- Selected as a 'Technology Innovation Company' among SK Hynix partners, recognized for achievements in localizing materials, components, and equipment.Selected as a 'Technology Innovation Company' among SK Hynix partners, recognized for achievements in localizing materials, components, and equipment.
Introduction
Location
169-23 Gasan digital 2-ro, Geumcheon District, Seoul, South Korea
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