Information
261 Namdongseo-ro, Namdong-gu, Incheon, South Korea
+82 32-822-4923
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Overview
- Summary
- KOSTECSYS is a company aiming to be a global leader in low thermal expansion, high heat dissipation materials and components for SiC and GaN next-generation power semiconductors and communication sectors. Based on the future growth potential of low thermal expansion and high heat dissipation materials, essential for various advanced industries such as 5G communication, electric vehicles, radar, robots, aerospace, and military, the company is growing into a key material enterprise for next-generation power semiconductors. It has secured unique technological competitiveness through vertical integration from high heat dissipation material development to package product manufacturing, specializing in semiconductor components. Particularly, it has established a leading position in the global market for RF communication packages and power semiconductor spacers.KOSTECSYS is a company aiming to be a global leader in low thermal expansion, high heat dissipation materials and components for SiC and GaN next-generation power semiconductors and communication sectors. Based on the future growth potential of low thermal expansion and high heat dissipation materials, essential for various advanced industries such as 5G communication, electric vehicles, radar, robots, aerospace, and military, the company is growing into a key material enterprise for next-generation power semiconductors. It has secured unique technological competitiveness through vertical integration from high heat dissipation material development to package product manufacturing, specializing in semiconductor components. Particularly, it has established a leading position in the global market for RF communication packages and power semiconductor spacers.
- Key Products/Technologies
- KCMC® High Heat Dissipation Materials: Copper-Molybdenum composite-based low thermal expansion, high heat dissipation new materials, playing a critical role in the heat dissipation, performance, reliability, durability, fire, and explosion protection properties of SiC and GaN next-generation semiconductors.KCMC® High Heat Dissipation Materials: Copper-Molybdenum composite-based low thermal expansion, high heat dissipation new materials, playing a critical role in the heat dissipation, performance, reliability, durability, fire, and explosion protection properties of SiC and GaN next-generation semiconductors.
- Copper Pin, Copper Pillar: Copper and copper alloy pins and pillars manufactured using Swiss turning lathe technology, suitable for mass production of complex parts.Copper Pin, Copper Pillar: Copper and copper alloy pins and pillars manufactured using Swiss turning lathe technology, suitable for mass production of complex parts.
- Thermal Matched Lead Frame: Lead frames with matched thermal expansion coefficients, applied in GaN, LDMOS, SiC devices, 5G wireless infrastructure, automotive, aerospace, and defense industries.Thermal Matched Lead Frame: Lead frames with matched thermal expansion coefficients, applied in GaN, LDMOS, SiC devices, 5G wireless infrastructure, automotive, aerospace, and defense industries.
- Air Cavity Packages: Air cavity structured packages used in RF power amplifiers and high-frequency communication modules.Air Cavity Packages: Air cavity structured packages used in RF power amplifiers and high-frequency communication modules.
- KCMC® Base Plate, Copper Base Plate (Pin Fin / Flat type): Pin fin or flat type KCMC® and copper base plates, providing high heat dissipation performance.KCMC® Base Plate, Copper Base Plate (Pin Fin / Flat type): Pin fin or flat type KCMC® and copper base plates, providing high heat dissipation performance.
- Photonic Integrated Circuit Packages: Opto-electronic butterfly packages and 14-pin butterfly packages utilized in optical communication, quantum computing, and medical sensors.Photonic Integrated Circuit Packages: Opto-electronic butterfly packages and 14-pin butterfly packages utilized in optical communication, quantum computing, and medical sensors.
- Liquid Cold Plate, Cooling Block: Liquid cold plates and cooling blocks for efficient thermal management of high-performance semiconductors and power modules.Liquid Cold Plate, Cooling Block: Liquid cold plates and cooling blocks for efficient thermal management of high-performance semiconductors and power modules.
- LD Packages for Laser Modules: Packages for laser diode modules, including high-power laser diode stems, C-mount blocks, and CCPs.LD Packages for Laser Modules: Packages for laser diode modules, including high-power laser diode stems, C-mount blocks, and CCPs.
- Current Sensor Shunt Resistors: Shunt resistor products used in current sensors.Current Sensor Shunt Resistors: Shunt resistor products used in current sensors.
- Spacer and Via Spacer: Key components implementing advanced power semiconductor packaging technology without wire bonding, reducing parasitic inductance and improving electrical characteristics.Spacer and Via Spacer: Key components implementing advanced power semiconductor packaging technology without wire bonding, reducing parasitic inductance and improving electrical characteristics.
- Key Technologies: Development and mass production of low thermal expansion, high heat dissipation materials, precision ceramic package technology, diffusion bonding, automated robot plating, automatic stamping, next-generation thermal simulation, and reliability prediction technologies.Key Technologies: Development and mass production of low thermal expansion, high heat dissipation materials, precision ceramic package technology, diffusion bonding, automated robot plating, automatic stamping, next-generation thermal simulation, and reliability prediction technologies.
- Core Advantages
- Establishment of a vertically integrated production system from high heat dissipation materials to package products, ensuring superior global competitiveness in product characteristics, cost, and delivery.Establishment of a vertically integrated production system from high heat dissipation materials to package products, ensuring superior global competitiveness in product characteristics, cost, and delivery.
- Successful development and mass production of KCMC®, a low thermal expansion, high heat dissipation new material, as the first in Korea, securing independent technological superiority and reducing reliance on foreign products.Successful development and mass production of KCMC®, a low thermal expansion, high heat dissipation new material, as the first in Korea, securing independent technological superiority and reducing reliance on foreign products.
- Leading advanced power semiconductor packaging technology without wire bonding, utilizing spacers and via spacers, overcoming the limitations of wire bonding and enhancing semiconductor performance and reliability in high-voltage, high-frequency environments.Leading advanced power semiconductor packaging technology without wire bonding, utilizing spacers and via spacers, overcoming the limitations of wire bonding and enhancing semiconductor performance and reliability in high-voltage, high-frequency environments.
- Securing leading global semiconductor companies such as NXP Semiconductors (world's largest automotive semiconductor company) and a major US semiconductor company (T-company, a global leader in AI, data center, and GPU fields) as key clients, demonstrating recognized technological capability and product reliability.Securing leading global semiconductor companies such as NXP Semiconductors (world's largest automotive semiconductor company) and a major US semiconductor company (T-company, a global leader in AI, data center, and GPU fields) as key clients, demonstrating recognized technological capability and product reliability.
- Official validation of technological capabilities through successful completion of rigorous qualification tests by global power semiconductor companies like Onsemi.Official validation of technological capabilities through successful completion of rigorous qualification tests by global power semiconductor companies like Onsemi.
- A global market-oriented business structure with the majority of sales from core products like RF communication packages and power semiconductor spacers generated from exports.A global market-oriented business structure with the majority of sales from core products like RF communication packages and power semiconductor spacers generated from exports.
- Target Industrie
- 5G Communication Infrastructure and Communication Power Transistors5G Communication Infrastructure and Communication Power Transistors
- Electric Vehicles (EV) and Automotive SemiconductorsElectric Vehicles (EV) and Automotive Semiconductors
- Radar SystemsRadar Systems
- Robotics IndustryRobotics Industry
- Aerospace and Defense IndustryAerospace and Defense Industry
- AI Data Centers and High-Performance Computing (GPU)AI Data Centers and High-Performance Computing (GPU)
- Industrial Power Systems and RailwaysIndustrial Power Systems and Railways
- Wind Power Generation SystemsWind Power Generation Systems
- Medical Sensors and Optical ComputingMedical Sensors and Optical Computing
- Laser Modules and Optical CommunicationLaser Modules and Optical Communication
- General Semiconductors and Electronic ComponentsGeneral Semiconductors and Electronic Components
- Major Markets
- China, Hong Kong, Japan, Singapore, Taiwan, IndiaChina, Hong Kong, Japan, Singapore, Taiwan, India
- Germany, Europe-wideGermany, Europe-wide
- USA, North America-wideUSA, North America-wide
- Certifications/Patents
- ISO 45001 (Occupational Health and Safety Management System) certificationISO 45001 (Occupational Health and Safety Management System) certification
- ISO 14001 (Environmental Management System) certificationISO 14001 (Environmental Management System) certification
- IATF 16949 (Automotive Quality Management System) certificationIATF 16949 (Automotive Quality Management System) certification
- RoHS (Restriction of Hazardous Substances) complianceRoHS (Restriction of Hazardous Substances) compliance
- Possession of multiple registered and published patents (including national R&D achievements related to power semiconductors, laser diodes, and shunt resistors)Possession of multiple registered and published patents (including national R&D achievements related to power semiconductors, laser diodes, and shunt resistors)
- Technological capability in developing and mass-producing localized KCMC® low thermal expansion, high heat dissipation new materialsTechnological capability in developing and mass-producing localized KCMC® low thermal expansion, high heat dissipation new materials
- Advanced power semiconductor packaging technology without wire bonding (spacers, via spacers)Advanced power semiconductor packaging technology without wire bonding (spacers, via spacers)
- Next-generation thermal simulation and reliability prediction technologyNext-generation thermal simulation and reliability prediction technology
Introduction
Location
261 Namdongseo-ro, Namdong-gu, Incheon, South Korea
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