Information
62 Saneop-ro, Bucheon, Gyeonggi-do, South Korea
+82 32-662-2214
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Overview
- Summary
- KOSES is a specialized company in semiconductor and display equipment, focusing on the development and manufacturing of semiconductor post-process equipment and laser application equipment. The company is expanding its business into 2nd battery manufacturing equipment and AI server electrode cell automation equipment markets, leveraging its core technological capabilities. Its continuous efforts in new technology development and management innovation aim for global leadership in equipment manufacturing. KOSES's technology is validated by leading domestic and international players in the global semiconductor market.KOSES is a specialized company in semiconductor and display equipment, focusing on the development and manufacturing of semiconductor post-process equipment and laser application equipment. The company is expanding its business into 2nd battery manufacturing equipment and AI server electrode cell automation equipment markets, leveraging its core technological capabilities. Its continuous efforts in new technology development and management innovation aim for global leadership in equipment manufacturing. KOSES's technology is validated by leading domestic and international players in the global semiconductor market.
- Key Products/Technologies
- Semiconductor Post-process Equipment: A diverse lineup including Solder Ball Attach System, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Off-loader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System, and Conversion Kit. Notably, the commercialization and development of Flip Chip Bonder and TSV TC Bonder (thermo-compression bonding) essential for 3D TSV-based stacking, such as HBM (High Bandwidth Memory).Semiconductor Post-process Equipment: A diverse lineup including Solder Ball Attach System, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Off-loader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System, and Conversion Kit. Notably, the commercialization and development of Flip Chip Bonder and TSV TC Bonder (thermo-compression bonding) essential for 3D TSV-based stacking, such as HBM (High Bandwidth Memory).
- Laser Application Equipment: Advanced laser processing equipment technology for laser cutting, laser ablation/trench cut, laser marking, and laser deflash. Development and supply of LLO (Laser Lift-Off) equipment for OLED manufacturing processes and flexible OLEDs, as well as reinforced glass laser cutting equipment.Laser Application Equipment: Advanced laser processing equipment technology for laser cutting, laser ablation/trench cut, laser marking, and laser deflash. Development and supply of LLO (Laser Lift-Off) equipment for OLED manufacturing processes and flexible OLEDs, as well as reinforced glass laser cutting equipment.
- Next-generation Display Repair Equipment: Successful development and mass production of laser repair equipment to improve the production yield of Mini/Micro LEDs. This technology is crucial for Extended Reality (XR) devices, including Augmented Reality (AR), Virtual Reality (VR), and Mixed Reality (MR).Next-generation Display Repair Equipment: Successful development and mass production of laser repair equipment to improve the production yield of Mini/Micro LEDs. This technology is crucial for Extended Reality (XR) devices, including Augmented Reality (AR), Virtual Reality (VR), and Mixed Reality (MR).
- 2nd Battery Manufacturing Equipment: Application of high-speed, high-precision control technology, acquired during semiconductor equipment manufacturing, to supply automation equipment for battery production processes.2nd Battery Manufacturing Equipment: Application of high-speed, high-precision control technology, acquired during semiconductor equipment manufacturing, to supply automation equipment for battery production processes.
- AI Server Equipment: Development and supply of Solid Oxide Fuel Cell (SOFC) electrode cell automation equipment to address the surging power demand from AI data centers. This represents a proprietary technology supplied to major clients like Bloom Energy.AI Server Equipment: Development and supply of Solid Oxide Fuel Cell (SOFC) electrode cell automation equipment to address the surging power demand from AI data centers. This represents a proprietary technology supplied to major clients like Bloom Energy.
- Core Underlying Technologies: Key capabilities include precision control and laser application technology, ultra-precision stacking and bonding automation solutions, vision technology, and laser software control technology.Core Underlying Technologies: Key capabilities include precision control and laser application technology, ultra-precision stacking and bonding automation solutions, vision technology, and laser software control technology.
- Core Advantages
- Unique Technology and Talent: A strong capability in developing new technologies, built upon accumulated technical knowledge and excellent human resources. Possessing proprietary technology in semiconductor post-process equipment and laser application equipment.Unique Technology and Talent: A strong capability in developing new technologies, built upon accumulated technical knowledge and excellent human resources. Possessing proprietary technology in semiconductor post-process equipment and laser application equipment.
- Global Client Validation and Reliability: Proven reliability through continuous business relationships with leading domestic semiconductor companies like Samsung Electronics and SK Hynix, validating its technological prowess. Securing global OSAT companies and integrated semiconductor manufacturers as clients, further confirming its technical credibility.Global Client Validation and Reliability: Proven reliability through continuous business relationships with leading domestic semiconductor companies like Samsung Electronics and SK Hynix, validating its technological prowess. Securing global OSAT companies and integrated semiconductor manufacturers as clients, further confirming its technical credibility.
- Next-Generation Technology Leadership: The ability to lead the XR market by being the first in the world to develop Mini/Micro LED repair equipment. This provides a differentiated competitive edge by enabling high production yields in the next-generation display market.Next-Generation Technology Leadership: The ability to lead the XR market by being the first in the world to develop Mini/Micro LED repair equipment. This provides a differentiated competitive edge by enabling high production yields in the next-generation display market.
- Business Diversification and Scalability: Successful business diversification into 2nd battery manufacturing equipment and AI server electrode cell automation equipment markets, leveraging existing semiconductor equipment technology. Strategic flexibility in applying high-speed, high-precision control technology to various advanced manufacturing sectors.Business Diversification and Scalability: Successful business diversification into 2nd battery manufacturing equipment and AI server electrode cell automation equipment markets, leveraging existing semiconductor equipment technology. Strategic flexibility in applying high-speed, high-precision control technology to various advanced manufacturing sectors.
- Total Solution Provider Capability: Maintaining a leading position in the market by offering total solutions that cover the entire process of semiconductor packaging equipment. Its advanced technology in laser cutting and processing is recognized as top-tier in the industry.Total Solution Provider Capability: Maintaining a leading position in the market by offering total solutions that cover the entire process of semiconductor packaging equipment. Its advanced technology in laser cutting and processing is recognized as top-tier in the industry.
- Global Market Expansion: Strong global business capabilities, with over 70 clients in approximately 10 countries, actively pioneering overseas markets.Global Market Expansion: Strong global business capabilities, with over 70 clients in approximately 10 countries, actively pioneering overseas markets.
- Target Industrie
- Semiconductor Manufacturing Industry (post-process, packaging)Semiconductor Manufacturing Industry (post-process, packaging)
- Display Manufacturing Industry (OLED, Mini/Micro LED, Flexible Display, FPD, Touch Panel)Display Manufacturing Industry (OLED, Mini/Micro LED, Flexible Display, FPD, Touch Panel)
- 2nd Battery Manufacturing Industry2nd Battery Manufacturing Industry
- AI Server Infrastructure (Solid Oxide Fuel Cell electrode cell manufacturing)AI Server Infrastructure (Solid Oxide Fuel Cell electrode cell manufacturing)
- XR (Extended Reality) Device Manufacturing IndustryXR (Extended Reality) Device Manufacturing Industry
- LED, Solar, PCB, and General IndustriesLED, Solar, PCB, and General Industries
- Major Markets
- China, Taiwan, Vietnam, Japan, Philippines, Thailand, MalaysiaChina, Taiwan, Vietnam, Japan, Philippines, Thailand, Malaysia
- USA (including Bloom Energy, Enovix)USA (including Bloom Energy, Enovix)
- Certifications/Patents
- ISO 9001 Certification (2001, 2004)ISO 9001 Certification (2001, 2004)
- Venture Company Certification (New Technology Development) (2002)Venture Company Certification (New Technology Development) (2002)
- Selected as a Superior Technology Company (Korea Technology Credit Guarantee Fund) (2001)Selected as a Superior Technology Company (Korea Technology Credit Guarantee Fund) (2001)
- Laser Dicing Saw Equipment Safety Certification (Korea Occupational Safety & Health Agency) (2005)Laser Dicing Saw Equipment Safety Certification (Korea Occupational Safety & Health Agency) (2005)
- ISO 14001/2009 Certification (2011)ISO 14001/2009 Certification (2011)
- OHSAS 18001 Certification (2011)OHSAS 18001 Certification (2011)
- ISO 27001:2005 (Information Security Management System) Certification (2013)ISO 27001:2005 (Information Security Management System) Certification (2013)
- Designated as an 'Innovative Business Company' by the Small and Medium Business AdministrationDesignated as an 'Innovative Business Company' by the Small and Medium Business Administration
- Acquisition of Government Venture Startup Company CertificationAcquisition of Government Venture Startup Company Certification
- Patent registrations related to display repair equipment technologyPatent registrations related to display repair equipment technology
- Securing multiple technological competencies, including high-speed, high-precision control technology and laser application technologySecuring multiple technological competencies, including high-speed, high-precision control technology and laser application technology
Introduction
Location
62 Saneop-ro, Bucheon, Gyeonggi-do, South Korea
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