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Meister
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Koh Young Technology

3D measurement & inspection equipment manufacturer, Solution, Solder paste inspection machine, SMT, 3D SPI equipment and more

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Manufacturer
Koh Young Technology
Product Type
Machine
Brand
-
SKU
34685
Product Name
Meister
Model Name
-
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Weight
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Product Details

World-Best Advanced IC Packaging Inspection

· The world's most advanced IC packaging process optimization solution
- Industry leading measurement accuracy and inspection reliability
- Provides high-resolution review
- Applicable packaging: SiP, 2.5D, 3D, 3D WLP, WL CSP, FO WLP, FC BGA, MCM
- Handling media: Laminate Substrate, Metal Carrier, Strip on Boat, Mylar Frame

· Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Real-time process optimization through powerful SPC analytics
- Efficient process management through convenient software

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Koh Young Technology
Koh Young Technology
3D measurement & inspection equipment manufacturer, Solution, Solder paste inspection machine, SMT, 3D SPI equipment and more
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