Information
57 Tapsil-ro 35beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, South Korea
+82 31-8077-9650
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Overview
- Summary
- Justem, a specialized company in semiconductor humidity and environmental control systems. A global technology leader vision for yield improvement in advanced industries. Development and supply of proprietary humidity control solutions, including 1st generation N2 Purge systems and 2nd generation JFS. Business expansion into various advanced industrial sectors such as semiconductors, displays, secondary batteries, and solar cells.Justem, a specialized company in semiconductor humidity and environmental control systems. A global technology leader vision for yield improvement in advanced industries. Development and supply of proprietary humidity control solutions, including 1st generation N2 Purge systems and 2nd generation JFS. Business expansion into various advanced industrial sectors such as semiconductors, displays, secondary batteries, and solar cells.
- Key Products/Technologies
- The 1st generation humidity control solution, N2 Purge System, includes product lines such as LPM (Load Port Module), BIP (Built in Purge), and CFB (Contamination Free Buffer).The 1st generation humidity control solution, N2 Purge System, includes product lines such as LPM (Load Port Module), BIP (Built in Purge), and CFB (Contamination Free Buffer).
- LPM technology for reducing FOUP (Front Opening Unified Pod) internal humidity to below 5%, improving wafer quality and reliability.LPM technology for reducing FOUP (Front Opening Unified Pod) internal humidity to below 5%, improving wafer quality and reliability.
- BIP, a system specifically for batch-type deposition processes, installed inside the EFEM (Equipment Front End Module).BIP, a system specifically for batch-type deposition processes, installed inside the EFEM (Equipment Front End Module).
- CFB, equipment for removing foreign substances and residual gases from the wafer surface before and after the etching process.CFB, equipment for removing foreign substances and residual gases from the wafer surface before and after the etching process.
- The 2nd generation humidity control solution, JFS (Jet Flow Straightener), a world-first technology controlling EFEM internal airflow to reduce FOUP internal humidity to a maximum of 1%.The 2nd generation humidity control solution, JFS (Jet Flow Straightener), a world-first technology controlling EFEM internal airflow to reduce FOUP internal humidity to a maximum of 1%.
- JFS creates a strong airflow when the LPM opens the FOUP door, preventing humid air ingress, suppressing natural oxide film formation on the wafer surface, and preventing yield degradation.JFS creates a strong airflow when the LPM opens the FOUP door, preventing humid air ingress, suppressing natural oxide film formation on the wafer surface, and preventing yield degradation.
- AIP-JFS (AI Powered-JFS), an AI-based precision control system, optimizing JFS humidity control performance for specific production line environments and analyzing airflow with AI to control speed and intensity, maximizing production line stability.AIP-JFS (AI Powered-JFS), an AI-based precision control system, optimizing JFS humidity control performance for specific production line environments and analyzing airflow with AI to control speed and intensity, maximizing production line stability.
- The 3rd generation humidity control solution, JDM (Justem Dry Module), a dehumidification module targeting overall EFEM internal humidity reduction, aiming for FOUP humidity below 1% and EFEM humidity below 5%, currently under development.The 3rd generation humidity control solution, JDM (Justem Dry Module), a dehumidification module targeting overall EFEM internal humidity reduction, aiming for FOUP humidity below 1% and EFEM humidity below 5%, currently under development.
- JDS (Justem Dry System), a total solution combining JDM and JFS functions for EFEM dehumidification and FOUP internal airflow stabilization.JDS (Justem Dry System), a total solution combining JDM and JFS functions for EFEM dehumidification and FOUP internal airflow stabilization.
- STB (Stocker Nitrogen Purge), a new product line enabling N2 Purge even during OHT (Overhead Hoist Transport) movement in atmospheric sections.STB (Stocker Nitrogen Purge), a new product line enabling N2 Purge even during OHT (Overhead Hoist Transport) movement in atmospheric sections.
- Through its subsidiary Flamme, possession of Cold Plasma technology capable of plasma treatment at low temperatures (60-80℃), minimizing thermal issues in OLED material cleaning and maximizing surface modification effects.Through its subsidiary Flamme, possession of Cold Plasma technology capable of plasma treatment at low temperatures (60-80℃), minimizing thermal issues in OLED material cleaning and maximizing surface modification effects.
- Core Advantages
- Market leadership in semiconductor humidity control, with proprietary original technology, from 1st generation N2 Purge systems to 3rd generation products.Market leadership in semiconductor humidity control, with proprietary original technology, from 1st generation N2 Purge systems to 3rd generation products.
- High market share of approximately 85% in the semiconductor humidity control solution market, supplying all three global IDM companies (Samsung Electronics, SK Hynix, Micron).High market share of approximately 85% in the semiconductor humidity control solution market, supplying all three global IDM companies (Samsung Electronics, SK Hynix, Micron).
- Ability to provide customized solutions as the only company capable of responding to all 110 models from 11 global LPM manufacturers, with over 100 types of customized LPMs developed and supplied.Ability to provide customized solutions as the only company capable of responding to all 110 models from 11 global LPM manufacturers, with over 100 types of customized LPMs developed and supplied.
- Key technology for solving yield degradation issues due to semiconductor process miniaturization, including suppression of natural oxide film formation on wafer surfaces and prevention of particles and copper corrosion, resulting in 2-3% yield improvement.Key technology for solving yield degradation issues due to semiconductor process miniaturization, including suppression of natural oxide film formation on wafer surfaces and prevention of particles and copper corrosion, resulting in 2-3% yield improvement.
- Strong technological moat established through approximately 330-340 filed and registered patents, protecting intellectual property and deterring competitors' market entry.Strong technological moat established through approximately 330-340 filed and registered patents, protecting intellectual property and deterring competitors' market entry.
- Successful business diversification and securing new growth engines in various advanced industrial sectors beyond semiconductors, including displays, secondary batteries, solar cells, bio, and plasma.Successful business diversification and securing new growth engines in various advanced industrial sectors beyond semiconductors, including displays, secondary batteries, solar cells, bio, and plasma.
- Continuous technological innovation efforts, with over 25% of all employees dedicated to R&D and an annual investment of approximately 15% of sales in R&D.Continuous technological innovation efforts, with over 25% of all employees dedicated to R&D and an annual investment of approximately 15% of sales in R&D.
- Target Industrie
- Semiconductor industrySemiconductor industry
- Display industryDisplay industry
- Secondary battery industrySecondary battery industry
- Solar cell industrySolar cell industry
- Bio industryBio industry
- Major Markets
- Taiwan, Singapore, Japan, ChinaTaiwan, Singapore, Japan, China
- United States (preparation for local subsidiary to support Samsung Taylor plant)United States (preparation for local subsidiary to support Samsung Taylor plant)
- Certifications/Patents
- Acquisition of AA grade Innobiz certification as a technology innovation-type small and medium-sized enterprise in 2019.Acquisition of AA grade Innobiz certification as a technology innovation-type small and medium-sized enterprise in 2019.
- Recognition of technological prowess through selection as a Strong Small Company and KOSDAQ listing in 2022.Recognition of technological prowess through selection as a Strong Small Company and KOSDAQ listing in 2022.
- Selection as the Best Corporate Research Institute by the Ministry of Science and ICT in 2023 (first among SMEs).Selection as the Best Corporate Research Institute by the Ministry of Science and ICT in 2023 (first among SMEs).
- Awarding of the Jang Young-shil Award, the highest authority in R&D, in 2024.Awarding of the Jang Young-shil Award, the highest authority in R&D, in 2024.
- Selection of the 1st generation semiconductor process humidity control product 'N2 LPM' as a 'World-Class Product' by the Ministry of Trade, Industry and Energy and KOTRA in 2025.Selection of the 1st generation semiconductor process humidity control product 'N2 LPM' as a 'World-Class Product' by the Ministry of Trade, Industry and Energy and KOTRA in 2025.
- Possession of approximately 330-340 filed and registered patents.Possession of approximately 330-340 filed and registered patents.
- Securing industrial property rights in various fields, including humidity solutions (72 cases), vacuum static eliminators (14 cases), mechanical devices (38 cases), and others (19 cases).Securing industrial property rights in various fields, including humidity solutions (72 cases), vacuum static eliminators (14 cases), mechanical devices (38 cases), and others (19 cases).
- Subsidiary Flamme's possession of 31 patents related to its proprietary plasma technology.Subsidiary Flamme's possession of 31 patents related to its proprietary plasma technology.
Introduction
Location
57 Tapsil-ro 35beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, South Korea
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