Information
114 Gwahaksaneop 1-ro, Oksan-myeon, Heungdeok-gu, Cheongju, Chungcheongbuk-do, South Korea
+82 43-218-7869
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Overview
- Summary
- A specialized company providing CSP (Chip Scale Package) packaging services for image sensors, focusing on the development and supply of high-resolution image sensor and Quantum Random Number Generator (QRNG) chip packaging solutions for mobile and automotive electronic components, based on its patented NeoPAC® core technologyA specialized company providing CSP (Chip Scale Package) packaging services for image sensors, focusing on the development and supply of high-resolution image sensor and Quantum Random Number Generator (QRNG) chip packaging solutions for mobile and automotive electronic components, based on its patented NeoPAC® core technology
- Key Products/Technologies
- NeoPAC® Series: A product line of image sensor packaging technologies with over 50 registered patentsNeoPAC® Series: A product line of image sensor packaging technologies with over 50 registered patents
- NeoPAC® I (Launched 2006): Initial image sensor CSP packaging solutionNeoPAC® I (Launched 2006): Initial image sensor CSP packaging solution
- NeoPAC® II (Launched 2016~2017): Product with improved packaging technologyNeoPAC® II (Launched 2016~2017): Product with improved packaging technology
- NeoPAC® Encap (Launched 2017): Package applying Epoxy Encapsulation technologyNeoPAC® Encap (Launched 2017): Package applying Epoxy Encapsulation technology
- NeoPAC® 3D (Launched 2017): Technology that innovatively reduces the X, Y size of camera modules, enabling surface mounting of passive components (Capacitor, Drive IC, EEPROM, etc.) on the PCB and lens holder attachment, satisfying automotive semiconductor reliability standards, and applied to the world's smallest Quantum Random Number Generator (QRNG) chip packagingNeoPAC® 3D (Launched 2017): Technology that innovatively reduces the X, Y size of camera modules, enabling surface mounting of passive components (Capacitor, Drive IC, EEPROM, etc.) on the PCB and lens holder attachment, satisfying automotive semiconductor reliability standards, and applied to the world's smallest Quantum Random Number Generator (QRNG) chip packaging
- NeoPAC® MCP (Multi Chip Package) (Launched 2022): A solution integrating multiple semiconductor devices such as image sensors and ISP (Image Sensor Processor) into a single package, featuring heat dissipation functions and meeting AEC-Q100 reliability standards, representing the domestic first stacked multi-chip image sensor package structureNeoPAC® MCP (Multi Chip Package) (Launched 2022): A solution integrating multiple semiconductor devices such as image sensors and ISP (Image Sensor Processor) into a single package, featuring heat dissipation functions and meeting AEC-Q100 reliability standards, representing the domestic first stacked multi-chip image sensor package structure
- NeoPAC® nBGA (Launched 2023): A new form of packaging solutionNeoPAC® nBGA (Launched 2023): A new form of packaging solution
- Fluxless soldering flip chip bonding, TLP bonding-based Closed loop sealing, SBL (Stress Buffer Layer), and Extended SBL structure: Core patented technologies used in NeoPAC® manufacturingFluxless soldering flip chip bonding, TLP bonding-based Closed loop sealing, SBL (Stress Buffer Layer), and Extended SBL structure: Core patented technologies used in NeoPAC® manufacturing
- Heat Dissipation Packaging Technology: A unique package structure applying TIM (Thermal Interface Material) with high thermal conductivity (20W/m.k) to efficiently dissipate heat generated from image sensors and ISP sensors to the outsideHeat Dissipation Packaging Technology: A unique package structure applying TIM (Thermal Interface Material) with high thermal conductivity (20W/m.k) to efficiently dissipate heat generated from image sensors and ISP sensors to the outside
- IT·Robot Automation Systems: Providing customized solutions and increasing efficiency linked to image sensor packaging production processesIT·Robot Automation Systems: Providing customized solutions and increasing efficiency linked to image sensor packaging production processes
- Automotive air conditioning parts consignment processing and mobile camera module component painting services: Diversification of business portfolioAutomotive air conditioning parts consignment processing and mobile camera module component painting services: Diversification of business portfolio
- Core Advantages
- Unique technological prowess based on NeoPAC® core technology: Securing strong intellectual property rights in the image sensor packaging field through over 50 patent registrationsUnique technological prowess based on NeoPAC® core technology: Securing strong intellectual property rights in the image sensor packaging field through over 50 patent registrations
- World-class slimness, small size, reliability, and quality: NeoPAC® technology providing superior competitive advantages compared to rival technologiesWorld-class slimness, small size, reliability, and quality: NeoPAC® technology providing superior competitive advantages compared to rival technologies
- Excellent price competitiveness achieved by utilizing Wafer-Level Packaging (WLP) technology suitable for mass productionExcellent price competitiveness achieved by utilizing Wafer-Level Packaging (WLP) technology suitable for mass production
- Differentiated Multi-Chip Package (MCP) solutions: Possessing technology to integrate multiple semiconductor sensors besides image sensors into a single package and solve heat dissipation issuesDifferentiated Multi-Chip Package (MCP) solutions: Possessing technology to integrate multiple semiconductor sensors besides image sensors into a single package and solve heat dissipation issues
- Possession of product lines meeting automotive electronic component semiconductor reliability standards (AEC-Q100) and mass production experiencePossession of product lines meeting automotive electronic component semiconductor reliability standards (AEC-Q100) and mass production experience
- Ultra-small packaging technology for Quantum Random Number Generator (QRNG) chips: Enabling the world's smallest quantum chip packaging through NeoPAC® 3D technologyUltra-small packaging technology for Quantum Random Number Generator (QRNG) chips: Enabling the world's smallest quantum chip packaging through NeoPAC® 3D technology
- Continuous technology development and product line-up expansion: Steadily improving packaging precision and production efficiency from NeoPAC® I to NeoPAC® 3D and MCPContinuous technology development and product line-up expansion: Steadily improving packaging precision and production efficiency from NeoPAC® I to NeoPAC® 3D and MCP
- Establishment of a stable revenue base through a diversified business portfolio, including automotive air conditioning parts processing, mobile camera module painting, and IT/robot automation systems, in addition to image sensor packagingEstablishment of a stable revenue base through a diversified business portfolio, including automotive air conditioning parts processing, mobile camera module painting, and IT/robot automation systems, in addition to image sensor packaging
- Target Industrie
- Mobile devices (smartphones, laptops, etc.)Mobile devices (smartphones, laptops, etc.)
- Automotive electronics (ADAS, autonomous driving systems, vehicle cameras, air conditioning components, etc.)Automotive electronics (ADAS, autonomous driving systems, vehicle cameras, air conditioning components, etc.)
- IT·Robot automation systemsIT·Robot automation systems
- Quantum information technology (security systems utilizing Quantum Random Number Generators (QRNG), financial security systems, etc.)Quantum information technology (security systems utilizing Quantum Random Number Generators (QRNG), financial security systems, etc.)
- Major Markets
- South Korea, Japan, ChinaSouth Korea, Japan, China
- GermanyGermany
- USAUSA
- Certifications/Patents
- NeoPAC® trademark registration and over 50 patents related to image sensor packagingNeoPAC® trademark registration and over 50 patents related to image sensor packaging
- Core patented technologies including Fluxless soldering flip chip bonding, TLP bonding-based Closed loop sealing, SBL (Stress Buffer Layer), and Extended SBL structureCore patented technologies including Fluxless soldering flip chip bonding, TLP bonding-based Closed loop sealing, SBL (Stress Buffer Layer), and Extended SBL structure
- Possession of 'NeoPAC 3D Shrink module' patent for ultra-small QRNG chip packagingPossession of 'NeoPAC 3D Shrink module' patent for ultra-small QRNG chip packaging
- Domestic and international patent applications underway for heat dissipation MCP technologyDomestic and international patent applications underway for heat dissipation MCP technology
- Compliance with customer-specific quality management systems such as ISO14001, IATF169949, and AEC-Q100Compliance with customer-specific quality management systems such as ISO14001, IATF169949, and AEC-Q100
Introduction
Location
114 Gwahaksaneop 1-ro, Oksan-myeon, Heungdeok-gu, Cheongju, Chungcheongbuk-do, South Korea
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