Information
263 Techno 2-ro, Yuseong District, Daejeon, South Korea
+82 42-930-9999
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Overview
- Summary
- INTEKPLUS is a specialized company providing appearance inspection solutions based on machine vision technology for semiconductor packages, semiconductor substrates, displays, automotive secondary batteries, and smart factory industries.INTEKPLUS is a specialized company providing appearance inspection solutions based on machine vision technology for semiconductor packages, semiconductor substrates, displays, automotive secondary batteries, and smart factory industries.
- Key Products/Technologies
- Semiconductor Back-end Visual Inspection Equipment: iPIS-HX Series (6-sided inspection, Advanced Package inspection, Real Total Height, Top Side Dent, Side LFF Stitching, Multi Picker, Deep Learning support), iPIS-XTR Series (3-rail based 6-sided inspection and integrated Tape & Reel solution, extended equipment lifespan and scalability support), iPIS-IN Series (In-tray handling method, 5-rail based, high productivity, minimized handling damage, stable handling of large packages, high stitching precision)Semiconductor Back-end Visual Inspection Equipment: iPIS-HX Series (6-sided inspection, Advanced Package inspection, Real Total Height, Top Side Dent, Side LFF Stitching, Multi Picker, Deep Learning support), iPIS-XTR Series (3-rail based 6-sided inspection and integrated Tape & Reel solution, extended equipment lifespan and scalability support), iPIS-IN Series (In-tray handling method, 5-rail based, high productivity, minimized handling damage, stable handling of large packages, high stitching precision)
- Semiconductor Mid-end Visual Inspection Equipment: Package Substrate Bump, Wafer / PLP Bump inspection equipmentSemiconductor Mid-end Visual Inspection Equipment: Package Substrate Bump, Wafer / PLP Bump inspection equipment
- Display Visual Inspection Equipment: OLED Rigid/Flexible Cell visual inspection machine (detects tens of micrometers of defects on front/rear of cells, 2D/3D composite technology, easy one-touch stage job conversion), Optical ModuleDisplay Visual Inspection Equipment: OLED Rigid/Flexible Cell visual inspection machine (detects tens of micrometers of defects on front/rear of cells, 2D/3D composite technology, easy one-touch stage job conversion), Optical Module
- Automotive Secondary Battery Inspection Equipment: Secondary battery cell tester, Secondary battery optical moduleAutomotive Secondary Battery Inspection Equipment: Secondary battery cell tester, Secondary battery optical module
- Smart Factory & Vision Component: Surface quality inspection machine combining 3D sensors and automated robots, Vision ComponentsSmart Factory & Vision Component: Surface quality inspection machine combining 3D sensors and automated robots, Vision Components
- Core Technologies: 3D Technology (LWSI, patented Dual Slit Beam Metrology, Phase Measuring Profilometry, Stereo Camera Triangulation Metrology), Handler Automation (Multi-Picker & Loader, Top & Bottom Flipping, Auto Reel Change, 6-sided inspection handler), Software Technology (Deep Learning, 2D & 3D Stitching, Self Diagnosis Algorithm, Recipe Portability), High-Speed Image Acquisition TechnologyCore Technologies: 3D Technology (LWSI, patented Dual Slit Beam Metrology, Phase Measuring Profilometry, Stereo Camera Triangulation Metrology), Handler Automation (Multi-Picker & Loader, Top & Bottom Flipping, Auto Reel Change, 6-sided inspection handler), Software Technology (Deep Learning, 2D & 3D Stitching, Self Diagnosis Algorithm, Recipe Portability), High-Speed Image Acquisition Technology
- Core Advantages
- Proprietary 3D/2D Measurement and Inspection Technology: Development capabilities for 3D/2D automated visual inspection equipment and modules using machine vision technology, possessing unique 3D technologies such as LWSI optical system, patented Dual Slit Beam Metrology, powerful algorithm-based Phase Measurement Profilometry, and Real Time image Processing-based Stereo Camera Triangulation MetrologyProprietary 3D/2D Measurement and Inspection Technology: Development capabilities for 3D/2D automated visual inspection equipment and modules using machine vision technology, possessing unique 3D technologies such as LWSI optical system, patented Dual Slit Beam Metrology, powerful algorithm-based Phase Measurement Profilometry, and Real Time image Processing-based Stereo Camera Triangulation Metrology
- Diversified Business Portfolio and Market Expansion: Providing visual inspection solutions across various advanced industries including semiconductor back-end, semiconductor mid-end, display, secondary batteries, and smart factories, continuously expanding business areasDiversified Business Portfolio and Market Expansion: Providing visual inspection solutions across various advanced industries including semiconductor back-end, semiconductor mid-end, display, secondary batteries, and smart factories, continuously expanding business areas
- Securing Global Top Tier Customers and Increasing References: Signing a supply contract for FC-BGA substrate inspection equipment with the world's No. 1 foundry, commencing quality evaluation of TSMC CoWoS visual inspection equipment, and supplying flexible OLED inspection equipment to China's BOE, demonstrating a track record with major global customersSecuring Global Top Tier Customers and Increasing References: Signing a supply contract for FC-BGA substrate inspection equipment with the world's No. 1 foundry, commencing quality evaluation of TSMC CoWoS visual inspection equipment, and supplying flexible OLED inspection equipment to China's BOE, demonstrating a track record with major global customers
- Leading Position in Advanced Packaging Inspection Equipment: Leading the market by supplying advanced packaging inspection equipment for CoWoS and FC-BGA in line with the proliferation of advanced packaging technologies in the semiconductor industry, uniquely securing proprietary 3D measurement technology in KoreaLeading Position in Advanced Packaging Inspection Equipment: Leading the market by supplying advanced packaging inspection equipment for CoWoS and FC-BGA in line with the proliferation of advanced packaging technologies in the semiconductor industry, uniquely securing proprietary 3D measurement technology in Korea
- Ability to Provide Customized Solutions: Offering optimal inspection solutions to ensure the perfect and safe implementation of customers' advanced technologies, flexibly responding to customer requirements through equipment scalability and customized inspection supportAbility to Provide Customized Solutions: Offering optimal inspection solutions to ensure the perfect and safe implementation of customers' advanced technologies, flexibly responding to customer requirements through equipment scalability and customized inspection support
- Target Industrie
- Semiconductor Industry (semiconductor packages, semiconductor substrates, memory modules, SSD, flip-chip, CoWoS, FC-BGA)Semiconductor Industry (semiconductor packages, semiconductor substrates, memory modules, SSD, flip-chip, CoWoS, FC-BGA)
- Display Industry (OLED Rigid/Flexible Cell, LCD)Display Industry (OLED Rigid/Flexible Cell, LCD)
- Automotive Industry (automotive secondary battery cells, automotive components)Automotive Industry (automotive secondary battery cells, automotive components)
- Solar Industry (solar cells, solar wafers)Solar Industry (solar cells, solar wafers)
- Smart FactorySmart Factory
- Major Markets
- South Korea, Taiwan, ChinaSouth Korea, Taiwan, China
- Certifications/Patents
- US Patent: Flat Panel Inspection Method (obtained July 6, 2016)US Patent: Flat Panel Inspection Method (obtained July 6, 2016)
- Patented: Dual Slit Beam Metrology (True 3D measurement technology for all inspection areas without hidden regions)Patented: Dual Slit Beam Metrology (True 3D measurement technology for all inspection areas without hidden regions)
- Patent Acquired: Optical Image Measurement System and Measurement Method Using It (optimizing camera exposure waveform for efficient measurement)Patent Acquired: Optical Image Measurement System and Measurement Method Using It (optimizing camera exposure waveform for efficient measurement)
- Patent Rights Transfer: Patent rights related to tissue resection devices and tissue resection systems (held by Korea University Research and Business Foundation, Osong Medical Innovation Foundation)Patent Rights Transfer: Patent rights related to tissue resection devices and tissue resection systems (held by Korea University Research and Business Foundation, Osong Medical Innovation Foundation)
- ISO 9001 Certification (2001)ISO 9001 Certification (2001)
- ISO 14001 Certification (2007)ISO 14001 Certification (2007)
- IR52 Jang Young-sil Award: Moire 3D Shape Measurement System (2000)IR52 Jang Young-sil Award: Moire 3D Shape Measurement System (2000)
- IR52 Jang Young-sil Award: Semiconductor Package Final Inspection System (2005)IR52 Jang Young-sil Award: Semiconductor Package Final Inspection System (2005)
- Designated as a Technologically Excellent Company (1999, Small and Medium Business Administration)Designated as a Technologically Excellent Company (1999, Small and Medium Business Administration)
- 2022 Daejeon Metropolitan City Sales Tower Award (100 Billion Won Tower, based on 2021 sales)2022 Daejeon Metropolitan City Sales Tower Award (100 Billion Won Tower, based on 2021 sales)
- 2023 Korea IR Awards Grand Prize (based on institutional investor recommendations, evaluations, and expert review)2023 Korea IR Awards Grand Prize (based on institutional investor recommendations, evaluations, and expert review)
- Holds over 231 patentsHolds over 231 patents
Introduction
Location
263 Techno 2-ro, Yuseong District, Daejeon, South Korea
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