Information
171 Asanvalley-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do, South Korea
-
-
-
Overview
- Summary
- INNOX Advanced Materials is a leading IT material company in Korea, specializing in semiconductor PKG materials and mobile materials, built upon proprietary technology accumulated since 1988. The company develops, manufactures, and sells various advanced electronic materials including OLED, circuit, semiconductor, battery, and mobility materials, positioning itself as a global leader in advanced materials. Through continuous technological development and securing future growth engines, it aims to be a global advanced technology company beyond Korea.INNOX Advanced Materials is a leading IT material company in Korea, specializing in semiconductor PKG materials and mobile materials, built upon proprietary technology accumulated since 1988. The company develops, manufactures, and sells various advanced electronic materials including OLED, circuit, semiconductor, battery, and mobility materials, positioning itself as a global leader in advanced materials. Through continuous technological development and securing future growth engines, it aims to be a global advanced technology company beyond Korea.
- Key Products/Technologies
- OLED Display Materials (INNOLED): Encapsulation Film is a core material that effectively blocks moisture and oxygen, protecting OLED devices and enhancing thermal stability. The product lineup includes Patterned Film, AR Film, Foldable Patterned Film, protective films for OLED processes (upper and lower), OCA, PSPI, Back Plate, and Back Plate protective films. Development and supply of high-performance materials through moisture/oxygen barrier, optical property control, stable adhesion, and surface protection technologies.OLED Display Materials (INNOLED): Encapsulation Film is a core material that effectively blocks moisture and oxygen, protecting OLED devices and enhancing thermal stability. The product lineup includes Patterned Film, AR Film, Foldable Patterned Film, protective films for OLED processes (upper and lower), OCA, PSPI, Back Plate, and Back Plate protective films. Development and supply of high-performance materials through moisture/oxygen barrier, optical property control, stable adhesion, and surface protection technologies.
- Circuit Materials (SMARTFLEX, INNOFLEX): Production and supply of various raw materials used in flexible printed circuit boards (FPCB) manufacturing, such as Coverlay, bonding sheets, thermal dissipation sheets, 2L/3L FCCL, EMI Absorber, EMI Shield, Stiffener, and TPU Film. Establishing self-reliance in IT material technology and leading the global market based on proprietary technology and cost competitiveness. Providing optimized solutions for cutting-edge electronic modules through accumulated compounding technology, precision coating technology, and composite technology.Circuit Materials (SMARTFLEX, INNOFLEX): Production and supply of various raw materials used in flexible printed circuit boards (FPCB) manufacturing, such as Coverlay, bonding sheets, thermal dissipation sheets, 2L/3L FCCL, EMI Absorber, EMI Shield, Stiffener, and TPU Film. Establishing self-reliance in IT material technology and leading the global market based on proprietary technology and cost competitiveness. Providing optimized solutions for cutting-edge electronic modules through accumulated compounding technology, precision coating technology, and composite technology.
- Semiconductor Materials (INNOSEM): Adhesion materials used in semiconductor packaging processes, including QFN TAPE, DAF (Die Attach Film), EMI Carrier Tape, UV-Dicing Tape, LLT, LOC, and Spacer. Technological capability to provide stable performance even in high-temperature and high-density package environments, based on precise adhesion control technology. Development of semiconductor chip adhesion film enhancing Die Attach process efficiency using UV variable adhesion technology. Preparing for the development of build-up films replacing ABF films and low-dielectric materials (CCL, etc.).Semiconductor Materials (INNOSEM): Adhesion materials used in semiconductor packaging processes, including QFN TAPE, DAF (Die Attach Film), EMI Carrier Tape, UV-Dicing Tape, LLT, LOC, and Spacer. Technological capability to provide stable performance even in high-temperature and high-density package environments, based on precise adhesion control technology. Development of semiconductor chip adhesion film enhancing Die Attach process efficiency using UV variable adhesion technology. Preparing for the development of build-up films replacing ABF films and low-dielectric materials (CCL, etc.).
- Battery & Mobility Materials: Development of next-generation electric vehicle battery thermal diffusion prevention materials and electro-sensitive films, currently undergoing verification with global automakers. Through its subsidiary INNOX Lithium, the company is shipping high-purity lithium hydroxide samples and preparing for mass production. The lithium business portfolio includes technology for converting low-purity industrial lithium carbonate into lithium hydroxide and pulverization, equity investment in lithium development projects for raw material securing, and battery recycling business.Battery & Mobility Materials: Development of next-generation electric vehicle battery thermal diffusion prevention materials and electro-sensitive films, currently undergoing verification with global automakers. Through its subsidiary INNOX Lithium, the company is shipping high-purity lithium hydroxide samples and preparing for mass production. The lithium business portfolio includes technology for converting low-purity industrial lithium carbonate into lithium hydroxide and pulverization, equity investment in lithium development projects for raw material securing, and battery recycling business.
- Core Advantages
- Leading in Material Localization based on Proprietary Technology: Grown into a top IT material company in Korea in semiconductor PKG materials and flexible printed circuit board (FPCB) materials, leveraging proprietary technology accumulated since 1988. Notably, it possesses the only full lineup of semiconductor PKG materials in Korea, proving the competitiveness of domestic technology in a global market dominated by Japan. In FPCB materials, it plays a leading role as the No.1 Maker in the global market, based on its unique technology and cost competitiveness.Leading in Material Localization based on Proprietary Technology: Grown into a top IT material company in Korea in semiconductor PKG materials and flexible printed circuit board (FPCB) materials, leveraging proprietary technology accumulated since 1988. Notably, it possesses the only full lineup of semiconductor PKG materials in Korea, proving the competitiveness of domestic technology in a global market dominated by Japan. In FPCB materials, it plays a leading role as the No.1 Maker in the global market, based on its unique technology and cost competitiveness.
- Broad Product Portfolio and Future Application Expansion Capability: Capability to develop and supply various advanced materials including OLED, circuit, semiconductor, battery, and mobility. Expanding the application areas of OLED Display materials across next-generation device markets such as mobile, IT, automotive, and XR. Actively pursuing business expansion into new applications such as robotics, aerospace, HBM and ASIC for AI semiconductors, glass substrate materials for next-generation packaging, and lithium supply for all-solid-state batteries.Broad Product Portfolio and Future Application Expansion Capability: Capability to develop and supply various advanced materials including OLED, circuit, semiconductor, battery, and mobility. Expanding the application areas of OLED Display materials across next-generation device markets such as mobile, IT, automotive, and XR. Actively pursuing business expansion into new applications such as robotics, aerospace, HBM and ASIC for AI semiconductors, glass substrate materials for next-generation packaging, and lithium supply for all-solid-state batteries.
- Global Production Network and Supply Chain Diversification Strategy: Operates production bases and a Sales Network in China (Guangzhou, Suzhou, Dongguan, Kunshan) and Vietnam (Bac Ninh, Hai Phong), in addition to its domestic Asan facility. Securing the world's largest production capacity in semiconductor package materials and FPCB, contributing to global supply chain diversification.Global Production Network and Supply Chain Diversification Strategy: Operates production bases and a Sales Network in China (Guangzhou, Suzhou, Dongguan, Kunshan) and Vietnam (Bac Ninh, Hai Phong), in addition to its domestic Asan facility. Securing the world's largest production capacity in semiconductor package materials and FPCB, contributing to global supply chain diversification.
- Commitment to Eco-friendly Material Development and ESG Management: Development and supply of eco-friendly materials with Halogen-free applied to all products. Enhancing internal environmental management systems through expanding domestic and international environmental certifications and joining the CDP (Carbon Disclosure Project). Recognized as a 'KOSDAQ Excellent Disclosure Corporation' by the Korea Exchange for transparent management and establishing a diligent disclosure culture.Commitment to Eco-friendly Material Development and ESG Management: Development and supply of eco-friendly materials with Halogen-free applied to all products. Enhancing internal environmental management systems through expanding domestic and international environmental certifications and joining the CDP (Carbon Disclosure Project). Recognized as a 'KOSDAQ Excellent Disclosure Corporation' by the Korea Exchange for transparent management and establishing a diligent disclosure culture.
- Continuous R&D Investment and New Business Development: High R&D capability with nearly 20% of its total employees in research positions. Focusing on securing future growth engines by diversifying its business portfolio through new ventures like the lithium business and equity investments in mining projects. Strengthening research infrastructure through the completion of its R&D Center and TX Building (logistics center).Continuous R&D Investment and New Business Development: High R&D capability with nearly 20% of its total employees in research positions. Focusing on securing future growth engines by diversifying its business portfolio through new ventures like the lithium business and equity investments in mining projects. Strengthening research infrastructure through the completion of its R&D Center and TX Building (logistics center).
- Target Industrie
- Semiconductor PKG (Packaging) IndustrySemiconductor PKG (Packaging) Industry
- Mobile Devices (Smartphones, Tablets, Laptops, Foldable Phones, Wearable Devices, etc.)Mobile Devices (Smartphones, Tablets, Laptops, Foldable Phones, Wearable Devices, etc.)
- Display (OLED TVs, Monitors, Next-generation Displays)Display (OLED TVs, Monitors, Next-generation Displays)
- Automotive (Automotive Electronics, EV Batteries)Automotive (Automotive Electronics, EV Batteries)
- General IT Devices (IoT, Smart Devices)General IT Devices (IoT, Smart Devices)
- Robotics IndustryRobotics Industry
- Aerospace and Defense IndustryAerospace and Defense Industry
- AI Semiconductor (HBM, ASIC) IndustryAI Semiconductor (HBM, ASIC) Industry
- Major Markets
- China (Guangzhou, Suzhou, Dongguan, Kunshan), Vietnam (Bac Ninh, Hai Phong), Taiwan, Singapore, MalaysiaChina (Guangzhou, Suzhou, Dongguan, Kunshan), Vietnam (Bac Ninh, Hai Phong), Taiwan, Singapore, Malaysia
- European market (Focus on exports through the completion of its second factory in Hai Phong, Vietnam)European market (Focus on exports through the completion of its second factory in Hai Phong, Vietnam)
- North American market (Focus on exports through the completion of its second factory in Hai Phong, Vietnam)North American market (Focus on exports through the completion of its second factory in Hai Phong, Vietnam)
- Certifications/Patents
- Patents: Acquired patent for 'Dicing Die Attach Film (DAF)'. Holds a patent for display protective films (excellent anti-fouling properties, anti-static function, no bubble generation, no adhesive residue upon peeling). Resolved patent dispute with LG Chem regarding OLED encapsulation material patents through agreement. Resolved patent dispute with Tomoegawa of Japan through agreement and secured sales rights in Japan.Patents: Acquired patent for 'Dicing Die Attach Film (DAF)'. Holds a patent for display protective films (excellent anti-fouling properties, anti-static function, no bubble generation, no adhesive residue upon peeling). Resolved patent dispute with LG Chem regarding OLED encapsulation material patents through agreement. Resolved patent dispute with Tomoegawa of Japan through agreement and secured sales rights in Japan.
- Certifications: Acquired ISO 9001:2000 certification (2002). Acquired ISO 14001:2015/KS I ISO 14001:2015 certification (design, development, production, and sales of semiconductor and electronic information film materials). Selected as a specialized parts and materials company by the Ministry of Trade, Industry and Energy (2004). Acquired INNO BIZ certification from the Small and Medium Business Administration (2002). Acquired KT (New Technology Certification) mark from the Ministry of Science and Technology (2002). Selected as a World Class 300 company (2012). Awarded 'KOSDAQ Excellent Disclosure Corporation' by the Korea Exchange (2026). All products apply Halogen-free eco-friendly materials.Certifications: Acquired ISO 9001:2000 certification (2002). Acquired ISO 14001:2015/KS I ISO 14001:2015 certification (design, development, production, and sales of semiconductor and electronic information film materials). Selected as a specialized parts and materials company by the Ministry of Trade, Industry and Energy (2004). Acquired INNO BIZ certification from the Small and Medium Business Administration (2002). Acquired KT (New Technology Certification) mark from the Ministry of Science and Technology (2002). Selected as a World Class 300 company (2012). Awarded 'KOSDAQ Excellent Disclosure Corporation' by the Korea Exchange (2026). All products apply Halogen-free eco-friendly materials.
Introduction
Location
171 Asanvalley-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do, South Korea
클릭하여 위치 살펴보기
