Information
105 Gwanggyo-ro, Yeongtong-gu, Suwon, Gyeonggi-do, South Korea
+82 31-888-5270
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Overview
- Summary
- IMAGIS Technology is a fabless semiconductor company specializing in Touch & Haptic solutions and related semiconductors. The company primarily develops and supplies touch ICs and haptic driver ICs for mobile and IT devices such as smartphones and laptops. Recently, the company is expanding its business into automotive semiconductors and physical AI robotics markets.IMAGIS Technology is a fabless semiconductor company specializing in Touch & Haptic solutions and related semiconductors. The company primarily develops and supplies touch ICs and haptic driver ICs for mobile and IT devices such as smartphones and laptops. Recently, the company is expanding its business into automotive semiconductors and physical AI robotics markets.
- Key Products/Technologies
- Touch Controller IC: Capacitive touch controller IC solutions characterized by high noise immunity and high performance. This core technology is applied to various mobile devices including smartphones, tablets, and wearables. Models include IST3026, IST3032, IST3038, IST3044, and IST3048.Touch Controller IC: Capacitive touch controller IC solutions characterized by high noise immunity and high performance. This core technology is applied to various mobile devices including smartphones, tablets, and wearables. Models include IST3026, IST3032, IST3038, IST3044, and IST3048.
- Haptic Driver IC: Haptic driver ICs providing enhanced communication experience, greater functionality, and productivity. This technology precisely implements user haptic feedback, with models such as ISA1000, ISA1200, and ISA1400 available. It is utilized in mobile devices, as well as automotive, robotics, wearables, and medical fields.Haptic Driver IC: Haptic driver ICs providing enhanced communication experience, greater functionality, and productivity. This technology precisely implements user haptic feedback, with models such as ISA1000, ISA1200, and ISA1400 available. It is utilized in mobile devices, as well as automotive, robotics, wearables, and medical fields.
- MST (Magnetic Secure Transmission) IC: ICs implementing Magnetic Secure Transmission technology. This technology enables high-speed data transmission, utilized in various applications such as display expansion and VR/AR devices.MST (Magnetic Secure Transmission) IC: ICs implementing Magnetic Secure Transmission technology. This technology enables high-speed data transmission, utilized in various applications such as display expansion and VR/AR devices.
- SAR (Grip) Sensor IC: Proximity sensor ICs specialized for smartphones, featuring grip sensing technology.SAR (Grip) Sensor IC: Proximity sensor ICs specialized for smartphones, featuring grip sensing technology.
- Power IC: Power management ICs used across various power devices and consumer electronics businesses. This includes models like Motor IC and TR Array, PWM and LED, IPS9200, and IPS9300.Power IC: Power management ICs used across various power devices and consumer electronics businesses. This includes models like Motor IC and TR Array, PWM and LED, IPS9200, and IPS9300.
- Video Encoder (ISE2110, ISE2200, ISE2010, ISE5100): Video encoders suitable for mobile devices, requiring minimal engineering effort.Video Encoder (ISE2110, ISE2200, ISE2010, ISE5100): Video encoders suitable for mobile devices, requiring minimal engineering effort.
- Graphic & Display (ISM2300, ISM2400): Technologies for image quality enhancement, interface conversion, and frame rate conversion.Graphic & Display (ISM2300, ISM2400): Technologies for image quality enhancement, interface conversion, and frame rate conversion.
- Key Encoder (ISG4100): Key encoders supporting keypad matrices of up to 8x8 keys and providing multiple-key detection capabilities.Key Encoder (ISG4100): Key encoders supporting keypad matrices of up to 8x8 keys and providing multiple-key detection capabilities.
- Fingerprint Sensor: Technology holding patents related to fingerprint recognition integrated capacitive touchscreens.Fingerprint Sensor: Technology holding patents related to fingerprint recognition integrated capacitive touchscreens.
- Core Advantages
- Fabless Business Model: A fabless model focusing on semiconductor design technology without owning production lines, resulting in low initial investment costs and rapid technological innovation. This offers flexibility to respond quickly to market demand changes and enable customized semiconductor designs.Fabless Business Model: A fabless model focusing on semiconductor design technology without owning production lines, resulting in low initial investment costs and rapid technological innovation. This offers flexibility to respond quickly to market demand changes and enable customized semiconductor designs.
- Accumulated Technology and Patents: Expertise in sensing and control algorithms accumulated since 2005 through the development of smartphone semiconductor products. Over 100 patents in haptic technology, protecting its technological competitiveness through intellectual property rights.Accumulated Technology and Patents: Expertise in sensing and control algorithms accumulated since 2005 through the development of smartphone semiconductor products. Over 100 patents in haptic technology, protecting its technological competitiveness through intellectual property rights.
- Diversified Product Portfolio and Application Expansion: Expansion of business areas from smartphones and laptops to automotive semiconductors, home appliances, and robotics. Automotive semiconductors include 1-Channel Linear LED Drivers and LDO products pursuing AEC-Q100 certification.Diversified Product Portfolio and Application Expansion: Expansion of business areas from smartphones and laptops to automotive semiconductors, home appliances, and robotics. Automotive semiconductors include 1-Channel Linear LED Drivers and LDO products pursuing AEC-Q100 certification.
- Global Partnerships and Market Responsiveness: Supply agreements for automotive semiconductors with overseas semiconductor companies. Strategic partnership with SiMa.ai to target the physical AI robotics market and lead global technology standards.Global Partnerships and Market Responsiveness: Supply agreements for automotive semiconductors with overseas semiconductor companies. Strategic partnership with SiMa.ai to target the physical AI robotics market and lead global technology standards.
- Provision of Customer-Specific Solutions: Discovery of potential customer needs and provision of efficient, market-leading, and competitive solutions to enhance customer product competitiveness. Stable product manufacturing and quality assurance through collaboration with domestic and international foundries.Provision of Customer-Specific Solutions: Discovery of potential customer needs and provision of efficient, market-leading, and competitive solutions to enhance customer product competitiveness. Stable product manufacturing and quality assurance through collaboration with domestic and international foundries.
- Target Industrie
- Mobile Device Industry: Supply of core components such as touch controller ICs, haptic driver ICs, and SAR sensor ICs for smartphones, tablets, and wearable devices.Mobile Device Industry: Supply of core components such as touch controller ICs, haptic driver ICs, and SAR sensor ICs for smartphones, tablets, and wearable devices.
- Laptop Industry: Supply of touch ICs and related solutions for laptops. Proven mass production supply to global laptop manufacturers including Dell and Lenovo.Laptop Industry: Supply of touch ICs and related solutions for laptops. Proven mass production supply to global laptop manufacturers including Dell and Lenovo.
- Automotive Industry: Supply of automotive semiconductors (1-Channel Linear LED Driver, LDO) and development of automotive electronic solutions. Application in various automotive systems such as infotainment, ADAS, and powertrain.Automotive Industry: Supply of automotive semiconductors (1-Channel Linear LED Driver, LDO) and development of automotive electronic solutions. Application in various automotive systems such as infotainment, ADAS, and powertrain.
- Home Appliance Industry: Adoption in home appliances such as washing machines, induction cooktops, and air conditioners.Home Appliance Industry: Adoption in home appliances such as washing machines, induction cooktops, and air conditioners.
- Robotics and Industrial AI: Provision of solutions based on ultra-precision sensing and actuation technology for humanoid robots and industrial physical AI markets through collaboration with SiMa.ai.Robotics and Industrial AI: Provision of solutions based on ultra-precision sensing and actuation technology for humanoid robots and industrial physical AI markets through collaboration with SiMa.ai.
- Major Markets
- South Korea (domestic market and robotics hub), Taiwan (laptop market), Japan (telecom bundle products)South Korea (domestic market and robotics hub), Taiwan (laptop market), Japan (telecom bundle products)
- Germany (IFA participation and automotive solution marketing), Europe (automotive HMI solution market)Germany (IFA participation and automotive solution marketing), Europe (automotive HMI solution market)
- United States (Dell and other laptop markets)United States (Dell and other laptop markets)
- Certifications/Patents
- Acquisition of Corporate Research Institute certification (December 2005).Acquisition of Corporate Research Institute certification (December 2005).
- Acquisition of INNOBIZ certification (July 2007).Acquisition of INNOBIZ certification (July 2007).
- Acquisition of patent rights related to fingerprint recognition integrated capacitive touchscreens (August 2014).Acquisition of patent rights related to fingerprint recognition integrated capacitive touchscreens (August 2014).
- Possession of over 100 patents related to Haptic technology.Possession of over 100 patents related to Haptic technology.
- Patent for implementing haptic functions using Serial Interface (I2C, SPI, etc.) (filed 2007, registered in US, China).Patent for implementing haptic functions using Serial Interface (I2C, SPI, etc.) (filed 2007, registered in US, China).
- Patent for direct haptic implementation from touch input (filed 2008).Patent for direct haptic implementation from touch input (filed 2008).
- Sound haptic patent for implementing haptics from audio signals (filed 2011).Sound haptic patent for implementing haptics from audio signals (filed 2011).
- Automotive semiconductor products currently pursuing AEC-Q100 automotive reliability certification.Automotive semiconductor products currently pursuing AEC-Q100 automotive reliability certification.
Introduction
Location
105 Gwanggyo-ro, Yeongtong-gu, Suwon, Gyeonggi-do, South Korea
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