Information
16 Gangnam-daero 84-gil, Gangnam District, Seoul, South Korea
+82 2-569-0112
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Overview
- Summary
- ICTK Co., Ltd. is a fabless company providing security semiconductors and solutions based on PUF (Physical Unclonable Function) technology. The Global Semiconductor Alliance (GSA) recognized it as a leading company in PUF-based Root-of-Trust (RoT) technology. It specializes in designing secure chips that integrate Post-Quantum Cryptography (PQC) standards.ICTK Co., Ltd. is a fabless company providing security semiconductors and solutions based on PUF (Physical Unclonable Function) technology. The Global Semiconductor Alliance (GSA) recognized it as a leading company in PUF-based Root-of-Trust (RoT) technology. It specializes in designing secure chips that integrate Post-Quantum Cryptography (PQC) standards.
- Key Products/Technologies
- PUF (Physical Unclonable Function) Semiconductor: A technology leveraging minute physical variations from the semiconductor manufacturing process to generate unique, unclonable IDs. This acts as a semiconductor fingerprint, fundamentally preventing hacking and duplication.PUF (Physical Unclonable Function) Semiconductor: A technology leveraging minute physical variations from the semiconductor manufacturing process to generate unique, unclonable IDs. This acts as a semiconductor fingerprint, fundamentally preventing hacking and duplication.
- VIA PUF Technology: A proprietary PUF technology that utilizes variations in VIA hole sizes during semiconductor manufacturing, ensuring stable and unique ID generation insensitive to environmental changes. It overcomes technical limitations of conventional PUF and eliminates the need for error correction.VIA PUF Technology: A proprietary PUF technology that utilizes variations in VIA hole sizes during semiconductor manufacturing, ensuring stable and unique ID generation insensitive to environmental changes. It overcomes technical limitations of conventional PUF and eliminates the need for error correction.
- Security Solutions: Security solutions linked with PUF chips, offering various security functions such as IoT device authentication, secure boot, and data integrity verification. Features include Firmware Over-The-Air (FOTA) updates, Zero-Touch Provisioning (ZTP), multi-factor authentication, and encryption/certificate processing.Security Solutions: Security solutions linked with PUF chips, offering various security functions such as IoT device authentication, secure boot, and data integrity verification. Features include Firmware Over-The-Air (FOTA) updates, Zero-Touch Provisioning (ZTP), multi-factor authentication, and encryption/certificate processing.
- PQC-PUF Security Chip: A next-generation security chip that integrates Post-Quantum Cryptography (PQC) with VIA PUF to counter quantum computing threats. It provides high security reliability and is applicable across finance, digital identity, IoT, defense, and critical infrastructure.PQC-PUF Security Chip: A next-generation security chip that integrates Post-Quantum Cryptography (PQC) with VIA PUF to counter quantum computing threats. It provides high security reliability and is applicable across finance, digital identity, IoT, defense, and critical infrastructure.
- QCIM (Quantum Compute in Memory) Chip: A quantum-secure Secure Element chip under development in collaboration with BTQ Technologies, integrating PQC at the silicon layer for maximized cryptographic performance. It targets up to 5x faster AES throughput and approximately 1 million digital signatures per second.QCIM (Quantum Compute in Memory) Chip: A quantum-secure Secure Element chip under development in collaboration with BTQ Technologies, integrating PQC at the silicon layer for maximized cryptographic performance. It targets up to 5x faster AES throughput and approximately 1 million digital signatures per second.
- Core Advantages
- Unrivaled PUF Core Technology: The world's first company to mass-produce VIA PUF technology, possessing unique ID generation capabilities based on minute physical variations in semiconductor processes. This offers a competitive edge in security and manufacturing processes compared to other PUF methods.Unrivaled PUF Core Technology: The world's first company to mass-produce VIA PUF technology, possessing unique ID generation capabilities based on minute physical variations in semiconductor processes. This offers a competitive edge in security and manufacturing processes compared to other PUF methods.
- Integration of Post-Quantum Cryptography (PQC): Development of security chips combining VIA PUF with PQC, proactively addressing security threats in the quantum computing era. This ensures a strong competitive position in the future security market.Integration of Post-Quantum Cryptography (PQC): Development of security chips combining VIA PUF with PQC, proactively addressing security threats in the quantum computing era. This ensures a strong competitive position in the future security market.
- Acquisition of Top-Tier International Security Certifications: Attainment of Common Criteria (CC) EAL6 development environment security certification, ensuring international reliability across the entire product lifecycle from planning to delivery. It is the second such case in Korea after Samsung Electronics, qualifying for military and national critical infrastructure applications.Acquisition of Top-Tier International Security Certifications: Attainment of Common Criteria (CC) EAL6 development environment security certification, ensuring international reliability across the entire product lifecycle from planning to delivery. It is the second such case in Korea after Samsung Electronics, qualifying for military and national critical infrastructure applications.
- Global Partnerships and Market Expansion Strategy: Joint development and investment agreement for quantum-secure chips with BTQ Technologies. Plans for product supply to global big tech companies and laptop manufacturers. Recognition by GSA (Global Semiconductor Alliance) as a leader in PUF-based RoT technology.Global Partnerships and Market Expansion Strategy: Joint development and investment agreement for quantum-secure chips with BTQ Technologies. Plans for product supply to global big tech companies and laptop manufacturers. Recognition by GSA (Global Semiconductor Alliance) as a leader in PUF-based RoT technology.
- Diverse Industry Applications and Customer Acquisition: A portfolio of solutions applicable across a wide range of industries including telecommunications, home appliances, IoT, finance, digital identity, and defense. Securing major domestic clients such as LG U+, Korea Electric Power Corporation, NH Nonghyup Bank, and Samsung Electronics.Diverse Industry Applications and Customer Acquisition: A portfolio of solutions applicable across a wide range of industries including telecommunications, home appliances, IoT, finance, digital identity, and defense. Securing major domestic clients such as LG U+, Korea Electric Power Corporation, NH Nonghyup Bank, and Samsung Electronics.
- Target Industrie
- Information and Communication & Telecommunication Equipment: Supply of products related to wireless routers, repeater authentication modules, eSIM/USIM, and VPN authentication. Provision of security chips and solutions to mobile carriers like LG U+.Information and Communication & Telecommunication Equipment: Supply of products related to wireless routers, repeater authentication modules, eSIM/USIM, and VPN authentication. Provision of security chips and solutions to mobile carriers like LG U+.
- Internet of Things (IoT) Devices: Enhanced security for various IoT devices including smart meters, digital door locks, IP cameras, smart IoT sensors, industrial IoT, and FIDO applications. AWS IoT connectivity certification, ensuring data confidentiality for smart home products.Internet of Things (IoT) Devices: Enhanced security for various IoT devices including smart meters, digital door locks, IP cameras, smart IoT sensors, industrial IoT, and FIDO applications. AWS IoT connectivity certification, ensuring data confidentiality for smart home products.
- Finance and Digital Identity: Strengthening security for financial infrastructure, including mobile authentication, fintech security, cold/hardware wallets for digital assets, and payment gateways.Finance and Digital Identity: Strengthening security for financial infrastructure, including mobile authentication, fintech security, cold/hardware wallets for digital assets, and payment gateways.
- Defense and Public Institutions: Possession of high-assurance security technology applicable to military facilities, national critical infrastructure, defense systems, and critical infrastructure. Supply of authentication chips for smart meter modems to Korea Electric Power Corporation.Defense and Public Institutions: Possession of high-assurance security technology applicable to military facilities, national critical infrastructure, defense systems, and critical infrastructure. Supply of authentication chips for smart meter modems to Korea Electric Power Corporation.
- Automotive and Autonomous Driving: Potential application of Via PUF technology in the automotive sector. Entry into autonomous driving and image sensor fields through licensing with Pixelplus.Automotive and Autonomous Driving: Potential application of Via PUF technology in the automotive sector. Entry into autonomous driving and image sensor fields through licensing with Pixelplus.
- Major Markets
- South Korea, Japan, Taiwan, VietnamSouth Korea, Japan, Taiwan, Vietnam
- United StatesUnited States
- Certifications/Patents
- CC (Common Criteria) EAL6 Development Environment Security Certification: Achieved international reliability for security and production environment across the entire product lifecycle, from planning to delivery, in accordance with information security international standards ISO/IEC 15408 and 18045. This is the second such case in Korea, qualifying for military and national critical infrastructure applications.CC (Common Criteria) EAL6 Development Environment Security Certification: Achieved international reliability for security and production environment across the entire product lifecycle, from planning to delivery, in accordance with information security international standards ISO/IEC 15408 and 18045. This is the second such case in Korea, qualifying for military and national critical infrastructure applications.
- WIPO Global Awards Top 30 Finalist Selection: Recognized for innovative solutions, strong IP strategy, and contributions to economic, social, and environmental sustainability.WIPO Global Awards Top 30 Finalist Selection: Recognized for innovative solutions, strong IP strategy, and contributions to economic, social, and environmental sustainability.
- iENA 2024 Gold Award: Acknowledged for technical excellence and innovation.iENA 2024 Gold Award: Acknowledged for technical excellence and innovation.
- EBISION 2025 Industry Leading Company Award: Recognized for innovation in VIA PUF and quantum security chip technologies and contributions to the next-generation ICT industry.EBISION 2025 Industry Leading Company Award: Recognized for innovation in VIA PUF and quantum security chip technologies and contributions to the next-generation ICT industry.
- US Patents Granted: 'Security device and substrate' (Patent number: 12536343, Date of Patent: January 27, 2026). 'IC chip for preventing identification key leak and authorization method thereof' (Patent number: 9996836, Date of Patent: June 12, 2018). 'Method of calculating cipher and electronic device performing the method' (Patent number: 12549349, Date of Patent: February 10, 2026). 'Apparatus and method for processing authentication information' (Patent number: 10848328B2, Publication of US10848328B2: November 24, 2020).US Patents Granted: 'Security device and substrate' (Patent number: 12536343, Date of Patent: January 27, 2026). 'IC chip for preventing identification key leak and authorization method thereof' (Patent number: 9996836, Date of Patent: June 12, 2018). 'Method of calculating cipher and electronic device performing the method' (Patent number: 12549349, Date of Patent: February 10, 2026). 'Apparatus and method for processing authentication information' (Patent number: 10848328B2, Publication of US10848328B2: November 24, 2020).
- AWS IoT Connectivity Official Certification: The Wi-Fi security module 'Trust-Fi' obtained the world's first official IoT connectivity certification from Amazon Web Services (AWS).AWS IoT Connectivity Official Certification: The Wi-Fi security module 'Trust-Fi' obtained the world's first official IoT connectivity certification from Amazon Web Services (AWS).
- KCMVP (Cryptographic Module Validation Program) Certification: Acquisition of cryptographic module validation certification from the National Intelligence Service.KCMVP (Cryptographic Module Validation Program) Certification: Acquisition of cryptographic module validation certification from the National Intelligence Service.
Introduction
Location
16 Gangnam-daero 84-gil, Gangnam District, Seoul, South Korea
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