I&C TECHNOLOGY, established in 1996, is a company aiming to localize and lead the global market in wired and wireless communication semiconductors. It successfully developed the world's first T-DMB SoC and subsequently developed and mass-produced Wi-Fi, PLC, and LTE semiconductor chips. More recently, the company has expanded its business into advanced electrical safety solutions and smart grid sectors, leveraging its proprietary technologies to prevent electrical fires and enhance energy efficiency.I&CTECHNOLOGY,establishedin1996,isacompanyaimingtolocalizeandleadtheglobalmarketinwiredandwirelesscommunicationsemiconductors.Itsuccessfullydevelopedtheworld'sfirstT-DMBSoCandsubsequentlydevelopedandmass-producedWi-Fi,PLC,andLTEsemiconductorchips.Morerecently,thecompanyhasexpandeditsbusinessintoadvancedelectricalsafetysolutionsandsmartgridsectors,leveragingitsproprietarytechnologiestopreventelectricalfiresandenhanceenergyefficiency.
Key Products/TechnologiesKeyProducts/Technologies
T-DMB SoC: World's first to develop an ultra-compact DMB chip integrating RF and Baseband, including T-DMB 2.0 supporting SoC (T3720) and 4th generation terrestrial DMB SoC (T39F1) for mass production.T-DMBSoC:World'sfirsttodevelopanultra-compactDMBchipintegratingRFandBaseband,includingT-DMB2.0supportingSoC(T3720)and4thgenerationterrestrialDMBSoC(T39F1)formassproduction.
Wi-Fi SoC/Module: First in Korea to mass-produce, featuring an embedded MCU, supporting various Wi-Fi protocols, and offering compact Wi-Fi modules (WFM50-SFC201) and WF6000 chips.Wi-FiSoC/Module:FirstinKoreatomass-produce,featuringanembeddedMCU,supportingvariousWi-Fiprotocols,andofferingcompactWi-Fimodules(WFM50-SFC201)andWF6000chips.
PLC SoC/Modem: Developed high-speed Power Line Communication (PLC) SoC, a core technology for smart grids, passed international standard (ISO/IEC12139-1) conformity tests, and includes an Analog Front-End block for easy integration into AMI systems.PLCSoC/Modem:Developedhigh-speedPowerLineCommunication(PLC)SoC,acoretechnologyforsmartgrids,passedinternationalstandard(ISO/IEC12139-1)conformitytests,andincludesanAnalogFront-EndblockforeasyintegrationintoAMIsystems.
NB-IoT Chip/Module: Launched NB5000 communication chips and modules to address the IoT communication market.NB-IoTChip/Module:LaunchedNB5000communicationchipsandmodulestoaddresstheIoTcommunicationmarket.
DAB Chip: Developed and supplies digital radio reception chips for automotive and home appliance applications.DABChip:Developedandsuppliesdigitalradioreceptionchipsforautomotiveandhomeapplianceapplications.
Arc Fault Circuit Interrupter (AFCI/AFDD): Ultra-compact AFCI, 1:1 compatible with existing earth leakage circuit breakers, eliminating the need for distribution board modifications, featuring patented ARC detection and diagnostic devices, STAR ARC PLUG, ARC IoT distribution boards, and ARC Detection SOC (A3000).ArcFaultCircuitInterrupter(AFCI/AFDD):Ultra-compactAFCI,1:1compatiblewithexistingearthleakagecircuitbreakers,eliminatingtheneedfordistributionboardmodifications,featuringpatentedARCdetectionanddiagnosticdevices,STARARCPLUG,ARCIoTdistributionboards,andARCDetectionSOC(A3000).
Smart Grid Solutions: Provides AMI system construction for Korea Electric Power Corporation and LED lighting control solutions (road lighting dimming control systems).SmartGridSolutions:ProvidesAMIsystemconstructionforKoreaElectricPowerCorporationandLEDlightingcontrolsolutions(roadlightingdimmingcontrolsystems).
Core AdvantagesCoreAdvantages
Leading Technology and Localization Capability: Pioneering development of the world's first T-DMB SoC, Korea's first mass-produced Wi-Fi chip, and successful development of PLC chips, demonstrating strong capability in localizing core wired and wireless communication semiconductor technologies [DB, 3, 9, 16, 25, 28, 32, 35, 37].LeadingTechnologyandLocalizationCapability:Pioneeringdevelopmentoftheworld'sfirstT-DMBSoC,Korea'sfirstmass-producedWi-Fichip,andsuccessfuldevelopmentofPLCchips,demonstratingstrongcapabilityinlocalizingcorewiredandwirelesscommunicationsemiconductortechnologies[DB,3,9,16,25,28,32,35,37].
Integrated Solutions in Communication Semiconductors and Electrical Safety: Possessing expertise from RF transceivers to baseband software for communication chip implementation, combined with electrical safety-related technologies such as arc detection, power measurement sensors, PLC, Wi-Fi communication, KEPCO AMI, and lighting control systems, enabling a comprehensive technology fusion.IntegratedSolutionsinCommunicationSemiconductorsandElectricalSafety:PossessingexpertisefromRFtransceiverstobasebandsoftwareforcommunicationchipimplementation,combinedwithelectricalsafety-relatedtechnologiessuchasarcdetection,powermeasurementsensors,PLC,Wi-Ficommunication,KEPCOAMI,andlightingcontrolsystems,enablingacomprehensivetechnologyfusion.
Differentiated Electrical Fire Prevention Solutions: Real-time monitoring of harmful arcs through current waveform and frequency change detection technology, pre-emptive power cut-off before ignition, and the development of ultra-compact AFCI 1:1 compatible with existing circuit breakers, ensuring ease of installation and cost-effectiveness.DifferentiatedElectricalFirePreventionSolutions:Real-timemonitoringofharmfularcsthroughcurrentwaveformandfrequencychangedetectiontechnology,pre-emptivepowercut-offbeforeignition,andthedevelopmentofultra-compactAFCI1:1compatiblewithexistingcircuitbreakers,ensuringeaseofinstallationandcost-effectiveness.
Customized Multi-Product Small-Volume Production System: Leveraging RF design technology for in-house design of digital, backend, and software communication semiconductor chips, offering cost-competitive and customized chip solutions tailored to customer needs.CustomizedMulti-ProductSmall-VolumeProductionSystem:LeveragingRFdesigntechnologyforin-housedesignofdigital,backend,andsoftwarecommunicationsemiconductorchips,offeringcost-competitiveandcustomizedchipsolutionstailoredtocustomerneeds.
Entry and Expansion into Public Procurement Market: Securing NEP (New Excellent Product) and disaster safety certifications for its ultra-compact AFCI, enabling full-scale entry into the public procurement market and potential supply to public institutions, facilities, traditional markets, and logistics warehouses vulnerable to electrical fires.EntryandExpansionintoPublicProcurementMarket:SecuringNEP(NewExcellentProduct)anddisastersafetycertificationsforitsultra-compactAFCI,enablingfull-scaleentryintothepublicprocurementmarketandpotentialsupplytopublicinstitutions,facilities,traditionalmarkets,andlogisticswarehousesvulnerabletoelectricalfires.
Global Market Entry Experience and Expansion Strategy: Experience in exporting mobile TV chips to Japan and South America, presence in the Greater China market, and preparations for expanding electrical safety solutions into European and US markets through partnerships and core technology supply.GlobalMarketEntryExperienceandExpansionStrategy:ExperienceinexportingmobileTVchipstoJapanandSouthAmerica,presenceintheGreaterChinamarket,andpreparationsforexpandingelectricalsafetysolutionsintoEuropeanandUSmarketsthroughpartnershipsandcoretechnologysupply.
Target IndustrieTargetIndustrie
Mobile and Smartphone Industry (DMB chips)MobileandSmartphoneIndustry(DMBchips)
Smart Home Appliance Industry (Wi-Fi chips: dehumidifiers, boilers, air purifiers, HEMS, mobile printers, etc.)SmartHomeApplianceIndustry(Wi-Fichips:dehumidifiers,boilers,airpurifiers,HEMS,mobileprinters,etc.)
Smart Grid and Energy Management Industry (AMI systems, power efficiency control: streetlights, tunnel lights)SmartGridandEnergyManagementIndustry(AMIsystems,powerefficiencycontrol:streetlights,tunnellights)
Electrical Safety Solutions Industry (residential buildings, commercial facilities, industrial sites, public institutions, logistics warehouses, traditional markets, poultry/livestock farms, renewable energy sectors: solar cells, fuel cells, EV chargers)ElectricalSafetySolutionsIndustry(residentialbuildings,commercialfacilities,industrialsites,publicinstitutions,logisticswarehouses,traditionalmarkets,poultry/livestockfarms,renewableenergysectors:solarcells,fuelcells,EVchargers)
Automotive Infotainment Industry (DAB modules)AutomotiveInfotainmentIndustry(DABmodules)
Intelligent Transportation Systems (DSRC SoC for Hi-Pass)IntelligentTransportationSystems(DSRCSoCforHi-Pass)
Water Meter Management Systems (AMI boards)WaterMeterManagementSystems(AMIboards)
Major MarketsMajorMarkets
South Korea (domestic market), Greater China (China, including major appliance manufacturers like Midea), Japan (mobile TV chip exports, Wi-Fi module TELEC certification)SouthKorea(domesticmarket),GreaterChina(China,includingmajorappliancemanufacturerslikeMidea),Japan(mobileTVchipexports,Wi-FimoduleTELECcertification)
Europe (expanding DAB chip exports, preparing for electrical safety solution market entry, Wi-Fi module CE certification)Europe(expandingDABchipexports,preparingforelectricalsafetysolutionmarketentry,Wi-FimoduleCEcertification)
North America (preparing for electrical safety solution market entry, Wi-Fi module FCC/IC certification)NorthAmerica(preparingforelectricalsafetysolutionmarketentry,Wi-FimoduleFCC/ICcertification)
South America (mobile TV chip exports)SouthAmerica(mobileTVchipexports)
Certifications/PatentsCertifications/Patents
Patents: Holds over 25 patents. Patents for down-conversion and up-conversion frequency converters. Patents for narrow-band multi-band low-noise amplifiers using common source structures. Patents for miniaturization technology of mobile TV receiver chips. Patented field-adaptive algorithm to minimize AFCI malfunction rates. Patent technology related to arc detection chips.Patents:Holdsover25patents.Patentsfordown-conversionandup-conversionfrequencyconverters.Patentsfornarrow-bandmulti-bandlow-noiseamplifiersusingcommonsourcestructures.PatentsforminiaturizationtechnologyofmobileTVreceiverchips.Patentedfield-adaptivealgorithmtominimizeAFCImalfunctionrates.Patenttechnologyrelatedtoarcdetectionchips.
Certifications: Acquired NEP (New Excellent Product) and disaster safety certifications for its ultra-compact AFCI. Passed PLC international standard (ISO/IEC12139-1) conformity tests (KOEMA standard test). Obtained wireless certifications for Wi-Fi modules including KC (Korea), CE (Europe), TELEC (Japan), and FCC/IC (North America). Holds EU Declaration of Conformity and EU Type Examination Certificate.Certifications:AcquiredNEP(NewExcellentProduct)anddisastersafetycertificationsforitsultra-compactAFCI.PassedPLCinternationalstandard(ISO/IEC12139-1)conformitytests(KOEMAstandardtest).ObtainedwirelesscertificationsforWi-FimodulesincludingKC(Korea),CE(Europe),TELEC(Japan),andFCC/IC(NorthAmerica).HoldsEUDeclarationofConformityandEUTypeExaminationCertificate.
Awards: Awarded the 'Iron Tower Industrial Medal' on the 50th Invention Day (CEO Park Chang-il). Received the 'Minister of Trade, Industry and Energy Award' at the 16th Korea Small and Medium-sized Enterprises Innovation Awards in 2024. Awarded the 'Chairman of Korea SMEs and Startups Agency Award' at the 2022 Korea Small and Medium-sized Enterprises Innovation Awards. Selected as a '3 Million Dollar Export Tower' company in 2021.Awards:Awardedthe'IronTowerIndustrialMedal'onthe50thInventionDay(CEOParkChang-il).Receivedthe'MinisterofTrade,IndustryandEnergyAward'atthe16thKoreaSmallandMedium-sizedEnterprisesInnovationAwardsin2024.Awardedthe'ChairmanofKoreaSMEsandStartupsAgencyAward'atthe2022KoreaSmallandMedium-sizedEnterprisesInnovationAwards.Selectedasa'3MillionDollarExportTower'companyin2021.
Introduction
Location
24 Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea
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Information
24 Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea