HUTEM, The Republic of Korea - Komachine Supplier Profile and Product List

- Hutem is a technology innovation company specializing in the development and manufacturing of semiconductor manufacturing process equipment and automated prefilled syringe filling systems for the pharmaceutical and bio industries. Its main product lines include semiconductor equipment such as wafer bonders, bonding aligners, and nanoimprint systems, as well as pharmaceutical equipment like prefilled syringe fillers, vial filling lines, and ampoule filling lines. The company also provides smart factory solutions, focusing on delivering optimized technologies for efficient customer production. Hutem's corporate philosophy centers on creating the highest value based on human-centered technology.Hutem is a technology innovation company specializing in the development and manufacturing of semiconductor manufacturing process equipment and automated prefilled syringe filling systems for the pharmaceutical and bio industries. Its main product lines include semiconductor equipment such as wafer bonders, bonding aligners, and nanoimprint systems, as well as pharmaceutical equipment like prefilled syringe fillers, vial filling lines, and ampoule filling lines. The company also provides smart factory solutions, focusing on delivering optimized technologies for efficient customer production. Hutem's corporate philosophy centers on creating the highest value based on human-centered technology.
- Prefilled syringe filling equipment, including models HFS-200, HFS-4000, HFS-5000, and HFS-6000, capable of handling various liquid properties from low to high viscosity. The HFS-6000 model offers a capacity of up to 9,000 syringes per hour and can incorporate up to 10 nozzles. It holds patents for void-free filling methods, ensuring a sterile and stable automated packaging system for liquid medications. Other pharmaceutical packaging and production line equipment includes vial filling lines (RVM-Series), ampoule filling lines (RAW-Series), foreign object inspection machines, prefilled syringe assembly machines (HAS-4000, HAS-6000), labeling machines (A-Series), tray formers/inserters, blister packaging machines (600ppm), cartoners, and water treatment systems.Prefilled syringe filling equipment, including models HFS-200, HFS-4000, HFS-5000, and HFS-6000, capable of handling various liquid properties from low to high viscosity. The HFS-6000 model offers a capacity of up to 9,000 syringes per hour and can incorporate up to 10 nozzles. It holds patents for void-free filling methods, ensuring a sterile and stable automated packaging system for liquid medications. Other pharmaceutical packaging and production line equipment includes vial filling lines (RVM-Series), ampoule filling lines (RAW-Series), foreign object inspection machines, prefilled syringe assembly machines (HAS-4000, HAS-6000), labeling machines (A-Series), tray formers/inserters, blister packaging machines (600ppm), cartoners, and water treatment systems.
- Semiconductor manufacturing process equipment includes wafer bonders, bonding aligners, laser lift-off systems, laser scribing systems, and nano-imprint equipment. Models such as MWB-8000 and the HBS series (HBS-800A, HBS-400A, HBS-800S, HBS-600M, HBS-400M) are part of its offerings. The HBS-400A Series is optimized for mass production, capable of eutectic, adhesive, epoxy, and polymer bonding for 4-inch wafers (with a 6.2-inch option) between heterogeneous or homogeneous materials. The company possesses multiple patents related to wafer bonders, imprint devices, electromagnetic heating wafer bonders, dual-cooling wafer bonders and bonding methods, wafer alignment devices, and wafer bonder jigs.Semiconductor manufacturing process equipment includes wafer bonders, bonding aligners, laser lift-off systems, laser scribing systems, and nano-imprint equipment. Models such as MWB-8000 and the HBS series (HBS-800A, HBS-400A, HBS-800S, HBS-600M, HBS-400M) are part of its offerings. The HBS-400A Series is optimized for mass production, capable of eutectic, adhesive, epoxy, and polymer bonding for 4-inch wafers (with a 6.2-inch option) between heterogeneous or homogeneous materials. The company possesses multiple patents related to wafer bonders, imprint devices, electromagnetic heating wafer bonders, dual-cooling wafer bonders and bonding methods, wafer alignment devices, and wafer bonder jigs.
- Smart factory solutions encompass FMMS (Filler Manufacturing Management System), UDI (Automated Supply Reporting), MTS (Monitoring System), RMS (Recipe Management System), and RAM (Automated Robots). These solutions provide customized MES solutions tailored to various industries like molding, injection, processing, pharmaceuticals, and medical devices. Capabilities include real-time integrated monitoring, LOT traceability, and a comprehensive system for managing work orders to business reports.Smart factory solutions encompass FMMS (Filler Manufacturing Management System), UDI (Automated Supply Reporting), MTS (Monitoring System), RMS (Recipe Management System), and RAM (Automated Robots). These solutions provide customized MES solutions tailored to various industries like molding, injection, processing, pharmaceuticals, and medical devices. Capabilities include real-time integrated monitoring, LOT traceability, and a comprehensive system for managing work orders to business reports.
- Unique technological competitiveness derived from successfully applying precision control technology accumulated in the semiconductor equipment sector to the pharmaceutical equipment market. This includes complex integration of vacuum, pressure, and fluid control technologies to ensure consistent, void-free filling processes.Unique technological competitiveness derived from successfully applying precision control technology accumulated in the semiconductor equipment sector to the pharmaceutical equipment market. This includes complex integration of vacuum, pressure, and fluid control technologies to ensure consistent, void-free filling processes.
- Capability to develop prefilled syringe filling equipment that accommodates a wide range of liquid viscosities, from low to high. Flexible response capabilities in providing customized equipment and solutions tailored to diverse customer requirements.Capability to develop prefilled syringe filling equipment that accommodates a wide range of liquid viscosities, from low to high. Flexible response capabilities in providing customized equipment and solutions tailored to diverse customer requirements.
- Strong innovation capacity evidenced by patents for prefilled syringe filling methods and numerous patents related to wafer bonder and imprint devices. Continuous commitment to technological development through ongoing R&D investments.Strong innovation capacity evidenced by patents for prefilled syringe filling methods and numerous patents related to wafer bonder and imprint devices. Continuous commitment to technological development through ongoing R&D investments.
- Diversified business capabilities by supplying core equipment to both the pharmaceutical/bio industry and the semiconductor industry. Provision of integrated solutions, including smart factory solutions, to support optimal production efficiency for customers.Diversified business capabilities by supplying core equipment to both the pharmaceutical/bio industry and the semiconductor industry. Provision of integrated solutions, including smart factory solutions, to support optimal production efficiency for customers.
- Market expansion capability, building on strong trust in the domestic market and actively pursuing global market entry through the establishment of a worldwide partner network.Market expansion capability, building on strong trust in the domestic market and actively pursuing global market entry through the establishment of a worldwide partner network.
- Pharmaceutical and Bio Industry: Filling and packaging processes for injectables and external preparations such as prefilled syringes, vials, and ampoules.Pharmaceutical and Bio Industry: Filling and packaging processes for injectables and external preparations such as prefilled syringes, vials, and ampoules.
- Semiconductor Industry: Wafer bonding, nanoimprint, laser lift-off, and laser scribing in semiconductor manufacturing processes.Semiconductor Industry: Wafer bonding, nanoimprint, laser lift-off, and laser scribing in semiconductor manufacturing processes.
- Display Industry: Application of high-precision wafer bonders and nanoimprint equipment.Display Industry: Application of high-precision wafer bonders and nanoimprint equipment.
- Smart Factory Solutions: Implementation of production management and automation systems for various manufacturing sectors including molding, injection, processing, pharmaceuticals, and medical devices.Smart Factory Solutions: Implementation of production management and automation systems for various manufacturing sectors including molding, injection, processing, pharmaceuticals, and medical devices.
- Medical Device and Aesthetic Market: Manufacturing equipment for medical devices and aesthetic products.Medical Device and Aesthetic Market: Manufacturing equipment for medical devices and aesthetic products.
- Taiwan, IndiaTaiwan, India
- RussiaRussia
- ISO 9001 certificationISO 9001 certification
- Certified Corporate R&D CenterCertified Corporate R&D Center
- Venture Business certificationVenture Business certification
- Specialized Materials, Parts, and Equipment Company certificationSpecialized Materials, Parts, and Equipment Company certification
- Patent for void-free filling method for prefilled syringesPatent for void-free filling method for prefilled syringes
- Patent registration for wafer bonder and imprint devicePatent registration for wafer bonder and imprint device
- Patent registration for wafer bonder using electromagnetic heatingPatent registration for wafer bonder using electromagnetic heating
- Patent registration for wafer bonder and wafer bonding method using dual coolingPatent registration for wafer bonder and wafer bonding method using dual cooling
- Patent registration for wafer alignment device, wafer bonder, and wafer bonder jigPatent registration for wafer alignment device, wafer bonder, and wafer bonder jig
- Patent registration for replica stamp manufacturing device and method using pressure memberPatent registration for replica stamp manufacturing device and method using pressure member
- Development of a dedicated filling volume monitoring system for prefilled syringe fillers and 3 related patent applicationsDevelopment of a dedicated filling volume monitoring system for prefilled syringe fillers and 3 related patent applications