Information
1-1 Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, South Korea
+82 31-227-7474
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Overview
- Summary
- HPSP is a global leading company manufacturing and supplying high-pressure annealing and oxidation equipment, critical for the semiconductor industry. The company pioneered the world's first high-pressure hydrogen annealing technology, securing a unique market position. Almost all advanced application processors (APs) are produced using HPSP's technology, highlighting its essential role in enhancing the performance of advanced semiconductor processes. It provides solutions that effectively remove interface defects in semiconductor devices, thereby improving transistor performance and reliability.HPSP is a global leading company manufacturing and supplying high-pressure annealing and oxidation equipment, critical for the semiconductor industry. The company pioneered the world's first high-pressure hydrogen annealing technology, securing a unique market position. Almost all advanced application processors (APs) are produced using HPSP's technology, highlighting its essential role in enhancing the performance of advanced semiconductor processes. It provides solutions that effectively remove interface defects in semiconductor devices, thereby improving transistor performance and reliability.
- Key Products/Technologies
- **High-Pressure Hydrogen Annealing (HPA) Equipment (GENI-SYS)**: HPSP's flagship product, a vertical furnace system applicable to 200mm and 300mm wafers. It enables annealing at low temperatures below 450°C with 100% hydrogen concentration in a high-pressure environment up to 25 ATM. This technology is crucial for advanced node devices (14nm and beyond, including sub-2nm), improving the performance of various semiconductor devices such as logic, memory (3D NAND), and CIS. It is a key technology contributing to the improvement of CMOS devices, including high-k, metal gate, and metal silicides.**High-Pressure Hydrogen Annealing (HPA) Equipment (GENI-SYS)**: HPSP's flagship product, a vertical furnace system applicable to 200mm and 300mm wafers. It enables annealing at low temperatures below 450°C with 100% hydrogen concentration in a high-pressure environment up to 25 ATM. This technology is crucial for advanced node devices (14nm and beyond, including sub-2nm), improving the performance of various semiconductor devices such as logic, memory (3D NAND), and CIS. It is a key technology contributing to the improvement of CMOS devices, including high-k, metal gate, and metal silicides.
- **High-Pressure Oxidation (HPO) Process**: An extended technology based on high-pressure hydrogen annealing, involving the formation of various oxide films and improvement of advanced film quality using different gases. It offers solutions for applying thick oxide layers in diverse devices such as MEMS, Solar Cells, Optoelectronics, and FPDs.**High-Pressure Oxidation (HPO) Process**: An extended technology based on high-pressure hydrogen annealing, involving the formation of various oxide films and improvement of advanced film quality using different gases. It offers solutions for applying thick oxide layers in diverse devices such as MEMS, Solar Cells, Optoelectronics, and FPDs.
- **Annealing Equipment for Hybrid Bonding**: The company is developing new equipment targeting the next-generation memory market. This involves developing annealing systems that enhance the uniformity of copper surfaces, which become uneven during the hybrid bonding process.**Annealing Equipment for Hybrid Bonding**: The company is developing new equipment targeting the next-generation memory market. This involves developing annealing systems that enhance the uniformity of copper surfaces, which become uneven during the hybrid bonding process.
- Core Advantages
- **World's Only Exclusive Technology Platform**: HPSP holds a virtually exclusive position in the high-pressure hydrogen annealing equipment sector, being the sole commercial supplier. Its unique technology has seen no equivalent competitive equipment emerge in the past 15 years.**World's Only Exclusive Technology Platform**: HPSP holds a virtually exclusive position in the high-pressure hydrogen annealing equipment sector, being the sole commercial supplier. Its unique technology has seen no equivalent competitive equipment emerge in the past 15 years.
- **Innovative Low-Temperature, High-Pressure Process Technology**: Possession of technology capable of achieving 100% hydrogen concentration at low temperatures below 450°C, minimizing wafer damage. This differentiated solution overcomes the limitations of conventional high-temperature annealing, making it applicable to ultra-fine processes (sub-2nm).**Innovative Low-Temperature, High-Pressure Process Technology**: Possession of technology capable of achieving 100% hydrogen concentration at low temperatures below 450°C, minimizing wafer damage. This differentiated solution overcomes the limitations of conventional high-temperature annealing, making it applicable to ultra-fine processes (sub-2nm).
- **Securing Global Top-tier Customers and High Trust**: Establishment of major global semiconductor manufacturers such as Samsung Electronics, SK Hynix, TSMC, Micron, and Intel as key clients. Its deep integration into customer production lines makes it difficult for latecomers to replace its equipment in the short term.**Securing Global Top-tier Customers and High Trust**: Establishment of major global semiconductor manufacturers such as Samsung Electronics, SK Hynix, TSMC, Micron, and Intel as key clients. Its deep integration into customer production lines makes it difficult for latecomers to replace its equipment in the short term.
- **Continuous R&D Investment and Global Collaboration**: Engagement in joint research and development projects with imec to expand high-pressure annealing and oxidation process technologies and conduct advanced research. Pursuit of new process technology development to extend HPA and HPO technologies beyond traditional processes through the opening of a new R&D center in Korea.**Continuous R&D Investment and Global Collaboration**: Engagement in joint research and development projects with imec to expand high-pressure annealing and oxidation process technologies and conduct advanced research. Pursuit of new process technology development to extend HPA and HPO technologies beyond traditional processes through the opening of a new R&D center in Korea.
- **Patent Strategy for Strengthening Exclusive Position**: Proven track record of winning patent disputes against competitors, reaffirming its technological superiority and exclusive status. Establishment of high entry barriers based on patents, resulting in a business structure with low price competition pressure and reduced risks of low-price orders.**Patent Strategy for Strengthening Exclusive Position**: Proven track record of winning patent disputes against competitors, reaffirming its technological superiority and exclusive status. Establishment of high entry barriers based on patents, resulting in a business structure with low price competition pressure and reduced risks of low-price orders.
- **High Profitability Driven by High-Value-Added Products**: Achievement of high operating profit margins (over 50%) through a business model focused on exclusive technology and high-value-added products. Expanding proportion of recurring revenue from maintenance, upgrades, and parts supply after equipment delivery.**High Profitability Driven by High-Value-Added Products**: Achievement of high operating profit margins (over 50%) through a business model focused on exclusive technology and high-value-added products. Expanding proportion of recurring revenue from maintenance, upgrades, and parts supply after equipment delivery.
- Target Industrie
- Semiconductor Front-End Process IndustrySemiconductor Front-End Process Industry
- Advanced Logic Semiconductor Manufacturing IndustryAdvanced Logic Semiconductor Manufacturing Industry
- Memory Semiconductor (DRAM, 3D NAND) Manufacturing IndustryMemory Semiconductor (DRAM, 3D NAND) Manufacturing Industry
- Foundry IndustryFoundry Industry
- System Semiconductor Manufacturing IndustrySystem Semiconductor Manufacturing Industry
- CMOS Device Manufacturing Industry (including High-K, Metal Gate, Metal Silicides)CMOS Device Manufacturing Industry (including High-K, Metal Gate, Metal Silicides)
- Special Device Manufacturing Industry (e.g., MEMS, Solar Cells, Optoelectronics, FPDs for high-pressure oxidation films)Special Device Manufacturing Industry (e.g., MEMS, Solar Cells, Optoelectronics, FPDs for high-pressure oxidation films)
- AI Semiconductor and High Bandwidth Memory (HBM) Manufacturing IndustryAI Semiconductor and High Bandwidth Memory (HBM) Manufacturing Industry
- Major Markets
- South Korea, Taiwan, ChinaSouth Korea, Taiwan, China
- BelgiumBelgium
- United StatesUnited States
- Certifications/Patents
- Possession of numerous exclusive patents related to high-pressure hydrogen annealing technology.Possession of numerous exclusive patents related to high-pressure hydrogen annealing technology.
- Demonstrated technological superiority and exclusive status through victories in patent disputes against competitors.Demonstrated technological superiority and exclusive status through victories in patent disputes against competitors.
- Acquisition of global semiconductor process safety and quality certifications.Acquisition of global semiconductor process safety and quality certifications.
- Expertise in research, development, and manufacturing of technology for improving interface characteristics of transistors using High-K dielectric films.Expertise in research, development, and manufacturing of technology for improving interface characteristics of transistors using High-K dielectric films.
Introduction
Location
1-1 Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, South Korea
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