HPSP is the world's sole supplier of high-pressure annealing and oxidation equipment crucial for advanced semiconductor manufacturing processes. The company provides solutions that significantly enhance semiconductor device performance and reliability through its proprietary high-pressure hydrogen annealing technology. HPSP serves as a key partner in the semiconductor roadmap, supplying essential equipment for the production of cutting-edge chips by leading global semiconductor manufacturers.HPSPistheworld'ssolesupplierofhigh-pressureannealingandoxidationequipmentcrucialforadvancedsemiconductormanufacturingprocesses.Thecompanyprovidessolutionsthatsignificantlyenhancesemiconductordeviceperformanceandreliabilitythroughitsproprietaryhigh-pressurehydrogenannealingtechnology.HPSPservesasakeypartnerinthesemiconductorroadmap,supplyingessentialequipmentfortheproductionofcutting-edgechipsbyleadingglobalsemiconductormanufacturers.
Key Products/TechnologiesKeyProducts/Technologies
The main product lines include high-pressure hydrogen annealing (HPA) equipment and high-pressure oxidation (HPO) equipment for semiconductor front-end processes. A representative high-pressure hydrogen annealing equipment is the 'GENI-SYS' series.Themainproductlinesincludehigh-pressurehydrogenannealing(HPA)equipmentandhigh-pressureoxidation(HPO)equipmentforsemiconductorfront-endprocesses.Arepresentativehigh-pressurehydrogenannealingequipmentisthe'GENI-SYS'series.
This equipment utilizes a technology that maintains 100% pure hydrogen concentration in an ultra-high pressure (up to 25 atm) environment for wafer heat treatment processes.Thisequipmentutilizesatechnologythatmaintains100%purehydrogenconcentrationinanultra-highpressure(upto25atm)environmentforwaferheattreatmentprocesses.
Compared to conventional high-temperature methods, it enables low-temperature processes (below 250-450°C), reducing wafer damage risk and thermal budget constraints.Comparedtoconventionalhigh-temperaturemethods,itenableslow-temperatureprocesses(below250-450°C),reducingwaferdamageriskandthermalbudgetconstraints.
It effectively removes interface defects, improving transistor drive current by up to 10-15% and contributing to reduced leakage current and enhanced charge carrier mobility.Iteffectivelyremovesinterfacedefects,improvingtransistordrivecurrentbyupto10-15%andcontributingtoreducedleakagecurrentandenhancedchargecarriermobility.
This solution is essential for sub-2-nanometer advanced processes and the proliferation of Gate-All-Around (GAA) structures.Thissolutionisessentialforsub-2-nanometeradvancedprocessesandtheproliferationofGate-All-Around(GAA)structures.
Core AdvantagesCoreAdvantages
A monopolistic market position as the world's first and only commercial producer of high-pressure hydrogen annealing equipment.Amonopolisticmarketpositionastheworld'sfirstandonlycommercialproducerofhigh-pressurehydrogenannealingequipment.
The sole equipment company responsible for the 'final process that completes performance' in semiconductor microfabrication.Thesoleequipmentcompanyresponsibleforthe'finalprocessthatcompletesperformance'insemiconductormicrofabrication.
High entry barriers due to extensive device and process patents, including those for high-pressure resistant chambers, pressure and temperature control devices, and High-K dielectric manufacturing processes.Highentrybarriersduetoextensivedeviceandprocesspatents,includingthoseforhigh-pressureresistantchambers,pressureandtemperaturecontroldevices,andHigh-Kdielectricmanufacturingprocesses.
Deep integration into the mass production lines of major global semiconductor manufacturers, securing a process-internal position that is difficult for latecomers to replace.Deepintegrationintothemassproductionlinesofmajorglobalsemiconductormanufacturers,securingaprocess-internalpositionthatisdifficultforlatecomerstoreplace.
Customization capabilities and design know-how to meet diverse technical requirements of customers.Customizationcapabilitiesanddesignknow-howtomeetdiversetechnicalrequirementsofcustomers.
A track record of maintaining high profitability, with an operating profit margin of 52% in 2023.Atrackrecordofmaintaininghighprofitability,withanoperatingprofitmarginof52%in2023.
Establishment of a collaborative research system with IMEC in Belgium, providing a foundation for next-generation node technology verification and pilot order expansion.EstablishmentofacollaborativeresearchsystemwithIMECinBelgium,providingafoundationfornext-generationnodetechnologyverificationandpilotorderexpansion.
Recognition of its technology and growth potential through awards such as the 70 Million Dollar Export Tower in 2022 and the Next-Generation Enterprise Award at the 2023 Korea KOSDAQ Awards.Recognitionofitstechnologyandgrowthpotentialthroughawardssuchasthe70MillionDollarExportTowerin2022andtheNext-GenerationEnterpriseAwardatthe2023KoreaKOSDAQAwards.
Target IndustriesTargetIndustries
Broad application across the entire semiconductor manufacturing industry.Broadapplicationacrosstheentiresemiconductormanufacturingindustry.
Specifically, logic and foundry processes in the system semiconductor sector.Specifically,logicandfoundryprocessesinthesystemsemiconductorsector.
Production processes for memory semiconductors, including DRAM and NAND flash.Productionprocessesformemorysemiconductors,includingDRAMandNANDflash.
Solutions for interface defect healing in response to increasing stacking layers in 3D NAND.Solutionsforinterfacedefecthealinginresponsetoincreasingstackinglayersin3DNAND.
Manufacturing processes for HBM4 (6th generation) memory used in AI accelerators.ManufacturingprocessesforHBM4(6thgeneration)memoryusedinAIaccelerators.
Major MarketsMajorMarkets
South Korea, Taiwan, Japan, ChinaSouthKorea,Taiwan,Japan,China
United StatesUnitedStates
Certifications/PatentsCertifications/Patents
Possession of over 30 patents related to high-pressure hydrogen annealing technology.Possessionofover30patentsrelatedtohigh-pressurehydrogenannealingtechnology.
Recognition of the originality, inventiveness, and validity of its core technology through victory in patent disputes with competitors at the Intellectual Property Tribunal.Recognitionoftheoriginality,inventiveness,andvalidityofitscoretechnologythroughvictoryinpatentdisputeswithcompetitorsattheIntellectualPropertyTribunal.
Recipient of the Next-Generation Enterprise Award at the 15th Korea KOSDAQ Awards in 2023.RecipientoftheNext-GenerationEnterpriseAwardatthe15thKoreaKOSDAQAwardsin2023.
Awarded the 70 Million Dollar Export Tower at the 59th Trade Day in 2022.Awardedthe70MillionDollarExportToweratthe59thTradeDayin2022.
Acquisition of global semiconductor process safety and quality certifications.Acquisitionofglobalsemiconductorprocesssafetyandqualitycertifications.
Introduction
Location
1-1 Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, South Korea
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Information
1-1 Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, South Korea