Information
6 Pangyo-ro 319beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea
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Overview
- Summary
- Hanwha Semitech Co., Ltd. is an advanced technology-focused next-generation manufacturing equipment solution company, starting with the SMT chip mounter business in 1989 and expanding into semiconductor front-end and back-end equipment, machine tools, and dental milling equipment. The company aims to transform into a global manufacturing solution specialist by developing smart factory solutions and AI-based integrated manufacturing operation platforms.Hanwha Semitech Co., Ltd. is an advanced technology-focused next-generation manufacturing equipment solution company, starting with the SMT chip mounter business in 1989 and expanding into semiconductor front-end and back-end equipment, machine tools, and dental milling equipment. The company aims to transform into a global manufacturing solution specialist by developing smart factory solutions and AI-based integrated manufacturing operation platforms.
- Key Products/Technologies
- SMT Chip Mounters: Offering various models such as HM520W, XM520, HM520, and DECAN S1. Development of high-speed SMT equipment like SM481, capable of placing approximately 39,000 components per hour, and high-precision SM482, boasting 0.03mm accuracy.SMT Chip Mounters: Offering various models such as HM520W, XM520, HM520, and DECAN S1. Development of high-speed SMT equipment like SM481, capable of placing approximately 39,000 components per hour, and high-precision SM482, boasting 0.03mm accuracy.
- Semiconductor Equipment: Supplying front-end (deposition) and back-end (packaging) equipment including TC bonders, die bonders, flip chip bonders, hybrid bonders (SHB2 Nano), PE-CVD, and ALD. Possessing core technologies for TC bonders essential for HBM (High Bandwidth Memory) manufacturing and next-generation hybrid bonders.Semiconductor Equipment: Supplying front-end (deposition) and back-end (packaging) equipment including TC bonders, die bonders, flip chip bonders, hybrid bonders (SHB2 Nano), PE-CVD, and ALD. Possessing core technologies for TC bonders essential for HBM (High Bandwidth Memory) manufacturing and next-generation hybrid bonders.
- Machine Tools: Developing and producing ultra-precision component processing equipment such as CNC automatic lathes (XD10II, XD26III, XD38III, XE20/26, XD42), centerless grinders, and dental milling equipment (H Denfit, XM20). Achieving the number one position in the domestic CNC automatic lathe sector.Machine Tools: Developing and producing ultra-precision component processing equipment such as CNC automatic lathes (XD10II, XD26III, XD38III, XE20/26, XD42), centerless grinders, and dental milling equipment (H Denfit, XM20). Achieving the number one position in the domestic CNC automatic lathe sector.
- Smart Factory Solutions: T-Solution provides a wide range of software solutions covering the entire production process, from material input to production planning, preparation, production, and maintenance. Supporting intelligent and automated factory management functions linked with higher-level MES.Smart Factory Solutions: T-Solution provides a wide range of software solutions covering the entire production process, from material input to production planning, preparation, production, and maintenance. Supporting intelligent and automated factory management functions linked with higher-level MES.
- Core Advantages
- Pioneering Technology Development History: Starting with Korea's first SMT chip mounter business in 1989, followed by the development of the first semiconductor back-end equipment in 1993, acquisition of the machine tool business in 2019, and the semiconductor front-end business in January 2024, evolving into a technology-driven solution provider across various manufacturing equipment.Pioneering Technology Development History: Starting with Korea's first SMT chip mounter business in 1989, followed by the development of the first semiconductor back-end equipment in 1993, acquisition of the machine tool business in 2019, and the semiconductor front-end business in January 2024, evolving into a technology-driven solution provider across various manufacturing equipment.
- Core Technology in HBM Market: Possessing essential TC bonder technology for High Bandwidth Memory (HBM) production and next-generation hybrid bonders. Notably, the introduction of the 2nd generation hybrid bonder 'SHB2 Nano' demonstrates ultra-precision alignment technology at a 0.1 micrometer level.Core Technology in HBM Market: Possessing essential TC bonder technology for High Bandwidth Memory (HBM) production and next-generation hybrid bonders. Notably, the introduction of the 2nd generation hybrid bonder 'SHB2 Nano' demonstrates ultra-precision alignment technology at a 0.1 micrometer level.
- Integrated Smart Factory Solutions: Offering diverse software solutions for the entire production process through T-Solution, enabling high-efficiency, high-quality, and low-cost production through intelligent automation linked with higher-level MES.Integrated Smart Factory Solutions: Offering diverse software solutions for the entire production process through T-Solution, enabling high-efficiency, high-quality, and low-cost production through intelligent automation linked with higher-level MES.
- Global Market Expansion and Customer Diversification: Expanding SMT equipment supply contracts in the North American market and actively targeting overseas markets by showcasing the latest automatic lathes and dental solutions at EMO, Europe's largest machine tool exhibition.Global Market Expansion and Customer Diversification: Expanding SMT equipment supply contracts in the North American market and actively targeting overseas markets by showcasing the latest automatic lathes and dental solutions at EMO, Europe's largest machine tool exhibition.
- Ultra-precision Processing and Control Technology: High technological competitiveness in areas requiring precision and control, including ultra-precision surface mounting technology for SMT equipment, the world's first compensation technology and high-speed pick-up device for semiconductor equipment, and the leading position in CNC automatic lathes in the machine tool sector.Ultra-precision Processing and Control Technology: High technological competitiveness in areas requiring precision and control, including ultra-precision surface mounting technology for SMT equipment, the world's first compensation technology and high-speed pick-up device for semiconductor equipment, and the leading position in CNC automatic lathes in the machine tool sector.
- Target Industrie
- Electronics Manufacturing Industry: Automated PCB (Printed Circuit Board) assembly processes using SMT chip mounters.Electronics Manufacturing Industry: Automated PCB (Printed Circuit Board) assembly processes using SMT chip mounters.
- Semiconductor Manufacturing Industry: Production of advanced semiconductors like HBM using front-end (deposition) and back-end (packaging) equipment.Semiconductor Manufacturing Industry: Production of advanced semiconductors like HBM using front-end (deposition) and back-end (packaging) equipment.
- Automotive and Precision Parts Manufacturing Industry: Ultra-precision component processing using CNC automatic lathes.Automotive and Precision Parts Manufacturing Industry: Ultra-precision component processing using CNC automatic lathes.
- Medical and Dental Industry: Manufacturing artificial tooth roots and teeth using medical component manufacturing equipment and dental milling machines.Medical and Dental Industry: Manufacturing artificial tooth roots and teeth using medical component manufacturing equipment and dental milling machines.
- Major Markets
- South Korea, China, TaiwanSouth Korea, China, Taiwan
- GermanyGermany
- United StatesUnited States
- Certifications/Patents
- ISO 9001 Quality Management System Certification (November 5, 2020).ISO 9001 Quality Management System Certification (November 5, 2020).
- ISO 14001 Environmental Management System Certification (August 19, 2019).ISO 14001 Environmental Management System Certification (August 19, 2019).
- ISO 45001 Occupational Health and Safety Management System Certification (May 30, 2019).ISO 45001 Occupational Health and Safety Management System Certification (May 30, 2019).
- SZU KOREA certificate of evaluation (August 12, 2019).SZU KOREA certificate of evaluation (August 12, 2019).
- Minister of Trade, Industry and Energy Commendation (Machine Tools, December 8, 2023).Minister of Trade, Industry and Energy Commendation (Machine Tools, December 8, 2023).
- Minister of Trade, Industry and Energy Commendation (Patents, May 12, 2023).Minister of Trade, Industry and Energy Commendation (Patents, May 12, 2023).
- Minister of Trade, Industry and Energy Commendation (Intellectual Property, October 20, 2022).Minister of Trade, Industry and Energy Commendation (Intellectual Property, October 20, 2022).
- Presidential Commendation (Die Bonder, October 18, 2022).Presidential Commendation (Die Bonder, October 18, 2022).
- IR52 Jang Young-shil Award (Die Bonder, December 30, 2020).IR52 Jang Young-shil Award (Die Bonder, December 30, 2020).
- IR52 Jang Young-shil Award (W/B, 2007).IR52 Jang Young-shil Award (W/B, 2007).
- Possession of patent technology related to TC bonders and hybrid bonders, and ongoing patent litigation with competitors.Possession of patent technology related to TC bonders and hybrid bonders, and ongoing patent litigation with competitors.
Introduction
Location
6 Pangyo-ro 319beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea
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