Information
14 Gajwa-ro 30beon-gil, Seo-gu, Incheon, South Korea
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Overview
- Summary
- HANMI Semiconductor, established in 1980, is a global leader in advanced semiconductor packaging equipment, specializing in the development and supply of semiconductor manufacturing equipment. The company holds the world's top market share in TC bonders, essential for High Bandwidth Memory (HBM) production, and Micro SAW & Vision Placement (MSVP) equipment, which performs semiconductor package cutting, cleaning, inspection, sorting, and stacking. Driven by the rapid growth of the AI semiconductor market, demand for HBM and MSVP equipment has surged, leading to record-breaking sales and strong growth.HANMI Semiconductor, established in 1980, is a global leader in advanced semiconductor packaging equipment, specializing in the development and supply of semiconductor manufacturing equipment. The company holds the world's top market share in TC bonders, essential for High Bandwidth Memory (HBM) production, and Micro SAW & Vision Placement (MSVP) equipment, which performs semiconductor package cutting, cleaning, inspection, sorting, and stacking. Driven by the rapid growth of the AI semiconductor market, demand for HBM and MSVP equipment has surged, leading to record-breaking sales and strong growth.
- Key Products/Technologies
- TC Bonder (Thermocompression Bonder): Essential equipment for HBM production, utilizing high temperature and pressure to precisely bond semiconductor chips to substrates. The company dominates the HBM3E 12-stack TC bonder market with over 90% market share. It has launched the 'TC Bonder 4' for HBM4 production and plans to release the 'Wide TC Bonder' for HBM5 and HBM6 production in the second half of 2026. The company is also investing 100 billion KRW in next-generation hybrid bonder technology, with a dedicated factory under construction in Incheon targeting a 2027 year-end launch.TC Bonder (Thermocompression Bonder): Essential equipment for HBM production, utilizing high temperature and pressure to precisely bond semiconductor chips to substrates. The company dominates the HBM3E 12-stack TC bonder market with over 90% market share. It has launched the 'TC Bonder 4' for HBM4 production and plans to release the 'Wide TC Bonder' for HBM5 and HBM6 production in the second half of 2026. The company is also investing 100 billion KRW in next-generation hybrid bonder technology, with a dedicated factory under construction in Incheon targeting a 2027 year-end launch.
- Micro SAW & Vision Placement (MSVP): Critical equipment for semiconductor manufacturing processes, integrating all steps from precise cutting of semiconductor packages to cleaning, drying, high-resolution 2D/3D vision inspection, quality sorting, and automatic stacking. Since the launch of its first-generation equipment in 1998, it has maintained its undisputed global market leadership for 23 consecutive years since 2004. The latest model, '7th Generation MSVP 6.0 Griffin,' incorporates over 207 patents. It features unmanned automation technologies such as Blade Change Master, Auto Kit Change, and the patented Full Self Device Setup (FSD) function, enhancing productivity and reducing maintenance costs.Micro SAW & Vision Placement (MSVP): Critical equipment for semiconductor manufacturing processes, integrating all steps from precise cutting of semiconductor packages to cleaning, drying, high-resolution 2D/3D vision inspection, quality sorting, and automatic stacking. Since the launch of its first-generation equipment in 1998, it has maintained its undisputed global market leadership for 23 consecutive years since 2004. The latest model, '7th Generation MSVP 6.0 Griffin,' incorporates over 207 patents. It features unmanned automation technologies such as Blade Change Master, Auto Kit Change, and the patented Full Self Device Setup (FSD) function, enhancing productivity and reducing maintenance costs.
- EMI Shield: Essential process equipment that prevents malfunctions in other semiconductors or components caused by specific electromagnetic waves emitted from semiconductors. This technology is crucial in aerospace, Low Earth Orbit (LEO) satellite communication, and defense drone markets. Since its initial launch in 2016, the company has maintained its number one market share and has exclusively supplied EMI Shield equipment lines to global aerospace companies for four consecutive years. In January 2026, it launched the 'EMI Shield 2.0 X' series (5 models) to meet the growing demand in the aerospace and LEO satellite communication markets.EMI Shield: Essential process equipment that prevents malfunctions in other semiconductors or components caused by specific electromagnetic waves emitted from semiconductors. This technology is crucial in aerospace, Low Earth Orbit (LEO) satellite communication, and defense drone markets. Since its initial launch in 2016, the company has maintained its number one market share and has exclusively supplied EMI Shield equipment lines to global aerospace companies for four consecutive years. In January 2026, it launched the 'EMI Shield 2.0 X' series (5 models) to meet the growing demand in the aerospace and LEO satellite communication markets.
- 6-SIDE INSPECTION: Equipment that supports minimizing defect rates and improving yield through vision inspection of HBM chips before and after stacking.6-SIDE INSPECTION: Equipment that supports minimizing defect rates and improving yield through vision inspection of HBM chips before and after stacking.
- FLIP CHIP BONDER: Bonding equipment with anticipated increasing demand in various industrial sectors, including automotive semiconductors.FLIP CHIP BONDER: Bonding equipment with anticipated increasing demand in various industrial sectors, including automotive semiconductors.
- Core Advantages
- Undisputed Global Market Leadership: Holding the top global market share of 71.2% in the HBM TC bonder market and maintaining the number one position in the MSVP market for 23 consecutive years, demonstrating dominant market presence in critical equipment sectors.Undisputed Global Market Leadership: Holding the top global market share of 71.2% in the HBM TC bonder market and maintaining the number one position in the MSVP market for 23 consecutive years, demonstrating dominant market presence in critical equipment sectors.
- Proactive Next-Generation Technology Development and Investment: Launching the TC Bonder 4 for HBM4, developing the Wide TC Bonder for HBM5 and HBM6, and investing 100 billion KRW in next-generation hybrid bonder technology with a dedicated factory under construction to secure a leading position in the future semiconductor packaging market.Proactive Next-Generation Technology Development and Investment: Launching the TC Bonder 4 for HBM4, developing the Wide TC Bonder for HBM5 and HBM6, and investing 100 billion KRW in next-generation hybrid bonder technology with a dedicated factory under construction to secure a leading position in the future semiconductor packaging market.
- Diversified Global Customer Base and Export Competitiveness: Possessing over 320 global customers and strong cooperative relationships with key international clients, notably receiving the 'Top Supplier' award from Micron Technology. Maintaining high global competitiveness with an average overseas sales proportion of approximately 70% over the past decade. In 2025, the export proportion significantly expanded to 80.7% compared to domestic sales of 19.3%.Diversified Global Customer Base and Export Competitiveness: Possessing over 320 global customers and strong cooperative relationships with key international clients, notably receiving the 'Top Supplier' award from Micron Technology. Maintaining high global competitiveness with an average overseas sales proportion of approximately 70% over the past decade. In 2025, the export proportion significantly expanded to 80.7% compared to domestic sales of 19.3%.
- High Profitability and Financial Soundness: Achieving record-high sales of 576.7 billion KRW and operating profit of 251.4 billion KRW in 2025, with an operating profit margin of 43.6%, surpassing even ASML's profitability. This performance is attributed to the surging demand for HBM equipment and a strategy of in-house component production.High Profitability and Financial Soundness: Achieving record-high sales of 576.7 billion KRW and operating profit of 251.4 billion KRW in 2025, with an operating profit margin of 43.6%, surpassing even ASML's profitability. This performance is attributed to the surging demand for HBM equipment and a strategy of in-house component production.
- Continuous Strengthening of Intellectual Property Rights: Concentrating on intellectual property rights since 2002, with 130 patents filed related to HBM equipment, continuously expanding technological competitiveness. The MSVP 6.0 Griffin equipment incorporates over 207 patents.Continuous Strengthening of Intellectual Property Rights: Concentrating on intellectual property rights since 2002, with 130 patents filed related to HBM equipment, continuously expanding technological competitiveness. The MSVP 6.0 Griffin equipment incorporates over 207 patents.
- Business Expansion into AI System Semiconductor Sector: Launching new equipment such as Big Die TC Bonder, Big Die FC Bonder, and Die Bonder, utilized in AI semiconductor packages integrating HBM core dies, base dies, and GPU/CPU, as well as Co-Packaged Optics (CPO) packaging, to target the AI system semiconductor market.Business Expansion into AI System Semiconductor Sector: Launching new equipment such as Big Die TC Bonder, Big Die FC Bonder, and Die Bonder, utilized in AI semiconductor packages integrating HBM core dies, base dies, and GPU/CPU, as well as Co-Packaged Optics (CPO) packaging, to target the AI system semiconductor market.
- Target Industrie
- Semiconductor Manufacturing Industry (Memory Semiconductors: DRAM, NAND Flash, High Bandwidth Memory (HBM))Semiconductor Manufacturing Industry (Memory Semiconductors: DRAM, NAND Flash, High Bandwidth Memory (HBM))
- System Semiconductor Manufacturing Industry (AI Semiconductors, CPU, GPU, Non-memory Semiconductors)System Semiconductor Manufacturing Industry (AI Semiconductors, CPU, GPU, Non-memory Semiconductors)
- Aerospace Industry (Space exploration rockets, Low Earth Orbit (LEO) satellite communication)Aerospace Industry (Space exploration rockets, Low Earth Orbit (LEO) satellite communication)
- Defense Industry (Defense drones)Defense Industry (Defense drones)
- Smartphone, Wearable, and Internet of Things (IoT) Device Manufacturing IndustrySmartphone, Wearable, and Internet of Things (IoT) Device Manufacturing Industry
- Automotive Semiconductor IndustryAutomotive Semiconductor Industry
- Major Markets
- South Korea, Taiwan, China, Singapore, JapanSouth Korea, Taiwan, China, Singapore, Japan
- GermanyGermany
- United StatesUnited States
- Certifications/Patents
- 130 patents filed related to HBM equipment.130 patents filed related to HBM equipment.
- Over 207 patents integrated into the MSVP 6.0 Griffin equipment.Over 207 patents integrated into the MSVP 6.0 Griffin equipment.
- Application of unmanned automation technologies including Blade Change Master, Auto Kit Change, and the patented Full Self Device Setup (FSD) function.Application of unmanned automation technologies including Blade Change Master, Auto Kit Change, and the patented Full Self Device Setup (FSD) function.
- Acquisition of international standards (SEMI, CE, ISO 9001).Acquisition of international standards (SEMI, CE, ISO 9001).
- Awarded the '300 Million Dollar Export Tower' in 2025 (following '100 Million Dollar' in 2011 and '200 Million Dollar' in 2021).Awarded the '300 Million Dollar Export Tower' in 2025 (following '100 Million Dollar' in 2011 and '200 Million Dollar' in 2021).
- Selected as a 'World Class Product' for 'HBM TC BONDER' in 2025.Selected as a 'World Class Product' for 'HBM TC BONDER' in 2025.
- Recognized as one of the 'World's Top 10 Best Semiconductor Equipment Companies' by TechInsights for three consecutive years from 2022 to 2024.Recognized as one of the 'World's Top 10 Best Semiconductor Equipment Companies' by TechInsights for three consecutive years from 2022 to 2024.
- Received the 'Top Supplier' award from Micron Technology in 2025.Received the 'Top Supplier' award from Micron Technology in 2025.
- Awarded the micro SAW 'IR52 Jang Young-shil Award' in 2022.Awarded the micro SAW 'IR52 Jang Young-shil Award' in 2022.
- Awarded the TSV DUAL STACKING TC BONDER 'iR52 Jang Young-shil Award' in 2017.Awarded the TSV DUAL STACKING TC BONDER 'iR52 Jang Young-shil Award' in 2017.
- Selected as a 'World Class Product' for Cam Press Trim/Form/Singulation in 2010.Selected as a 'World Class Product' for Cam Press Trim/Form/Singulation in 2010.
- Selected as a 'World Class Product' for 'VISION PLACEMENT' in 2005.Selected as a 'World Class Product' for 'VISION PLACEMENT' in 2005.
- Selected for 'World Class 300' in 2011.Selected for 'World Class 300' in 2011.
- Selected as one of 'Asia Pacific's 200 Best Small and Medium-sized Enterprises' by Forbes Asia in 2007.Selected as one of 'Asia Pacific's 200 Best Small and Medium-sized Enterprises' by Forbes Asia in 2007.
Introduction
Location
14 Gajwa-ro 30beon-gil, Seo-gu, Incheon, South Korea
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