Information
50 3gongdan 3-ro, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
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Overview
- Summary
- HANA Materials is an advanced material and component manufacturer specializing in Silicon (Si) and Silicon Carbide (SiC) electrodes and rings for the critical Dry etching process in semiconductor manufacturing. The company possesses core capabilities in developing the world's largest diameter single crystal ingots and has established an integrated production system to supply essential components to global semiconductor equipment companies.HANA Materials is an advanced material and component manufacturer specializing in Silicon (Si) and Silicon Carbide (SiC) electrodes and rings for the critical Dry etching process in semiconductor manufacturing. The company possesses core capabilities in developing the world's largest diameter single crystal ingots and has established an integrated production system to supply essential components to global semiconductor equipment companies.
- Key Products/Technologies
- Silicon (Si) Electrodes and Rings for Semiconductor Dry Etching Process: Essential consumable components for uniformly dispersing gases and fixing wafers during wafer etching. Product specifications include outer diameters from 240mm to 550mm, low resistivity (<0.02 Ω·cm), RRG < 5%, gas hole diameters of 0.2-0.8mm with roundness <0.02mm, surface flatness and machining precision <10㎛, and defect-free quality (chipping, scratching, cracking).Silicon (Si) Electrodes and Rings for Semiconductor Dry Etching Process: Essential consumable components for uniformly dispersing gases and fixing wafers during wafer etching. Product specifications include outer diameters from 240mm to 550mm, low resistivity (<0.02 Ω·cm), RRG < 5%, gas hole diameters of 0.2-0.8mm with roundness <0.02mm, surface flatness and machining precision <10㎛, and defect-free quality (chipping, scratching, cracking).
- Silicon Carbide (SiC) Rings for Semiconductor Dry Etching Process: Consumable components offering superior durability in high-temperature and high-density plasma environments, crucial for advanced semiconductor processes like 3D NAND. The company is actively pursuing the development of CVD SiC deposition technology and new graphite (GR) SiC products.Silicon Carbide (SiC) Rings for Semiconductor Dry Etching Process: Consumable components offering superior durability in high-temperature and high-density plasma environments, crucial for advanced semiconductor processes like 3D NAND. The company is actively pursuing the development of CVD SiC deposition technology and new graphite (GR) SiC products.
- Single Crystal Ingot Growth Technology: Possessing core technological capabilities, including the successful development of the world's largest diameter 600mm silicon ingots. Establishment of an integrated production system from polycrystalline silicon ingot growth to component processing for silicon parts manufacturing.Single Crystal Ingot Growth Technology: Possessing core technological capabilities, including the successful development of the world's largest diameter 600mm silicon ingots. Establishment of an integrated production system from polycrystalline silicon ingot growth to component processing for silicon parts manufacturing.
- Fine Ceramics Components: Including Aluminum Nitride (AlN) and Aluminum Oxide (Al2O3), these materials offer high thermal conductivity, insulation, corrosion resistance, and high hardness. Applications include semiconductor dry etchers and CVD processes, as well as LED substrates and heat sinks.Fine Ceramics Components: Including Aluminum Nitride (AlN) and Aluminum Oxide (Al2O3), these materials offer high thermal conductivity, insulation, corrosion resistance, and high hardness. Applications include semiconductor dry etchers and CVD processes, as well as LED substrates and heat sinks.
- Core Advantages
- World-leading Large-Diameter Ingot Growth Technology: Pioneering technological capability with successful development of 600mm silicon ingots, surpassing 450mm wafer process requirements, preparing for next-generation semiconductor processes. This capability is crucial for enhancing semiconductor circuit integration and economic efficiency.World-leading Large-Diameter Ingot Growth Technology: Pioneering technological capability with successful development of 600mm silicon ingots, surpassing 450mm wafer process requirements, preparing for next-generation semiconductor processes. This capability is crucial for enhancing semiconductor circuit integration and economic efficiency.
- Integrated Production System from Material to Processing and Cleaning: Internalizing the entire process from direct growth of polycrystalline silicon ingots to component processing and cleaning, ensuring a stable supply chain and quality competitiveness. This system enables quick and flexible responses to global customer demands.Integrated Production System from Material to Processing and Cleaning: Internalizing the entire process from direct growth of polycrystalline silicon ingots to component processing and cleaning, ensuring a stable supply chain and quality competitiveness. This system enables quick and flexible responses to global customer demands.
- Strong Partnerships with Global Semiconductor Equipment Companies: Supplying critical components to leading semiconductor equipment and manufacturing companies such as Tokyo Electron (TEL), SEMES, Samsung Electronics, and AMAT, establishing a dominant position and robust collaborative relationships. Anticipated benefits from TEL's increasing market share in etching equipment.Strong Partnerships with Global Semiconductor Equipment Companies: Supplying critical components to leading semiconductor equipment and manufacturing companies such as Tokyo Electron (TEL), SEMES, Samsung Electronics, and AMAT, establishing a dominant position and robust collaborative relationships. Anticipated benefits from TEL's increasing market share in etching equipment.
- Diversification into High-Value SiC Component Business: Expanding business scope from silicon-centric components to SiC rings, which offer high resistance to temperature and plasma, thereby strengthening competitiveness in response to semiconductor process miniaturization and multi-layering trends. Continuous technological innovation through new material development, including CVD SiC deposition technology and silicon anode materials.Diversification into High-Value SiC Component Business: Expanding business scope from silicon-centric components to SiC rings, which offer high resistance to temperature and plasma, thereby strengthening competitiveness in response to semiconductor process miniaturization and multi-layering trends. Continuous technological innovation through new material development, including CVD SiC deposition technology and silicon anode materials.
- Continuous R&D and Patent Acquisition Efforts: Persistent investment in developing advanced material technologies for semiconductor material localization, such as ingot growth technology, CVD SiC deposition technology, and ultra-precision component processing technology. Securing technological superiority through patents related to silicon material manufacturing and surface treatment.Continuous R&D and Patent Acquisition Efforts: Persistent investment in developing advanced material technologies for semiconductor material localization, such as ingot growth technology, CVD SiC deposition technology, and ultra-precision component processing technology. Securing technological superiority through patents related to silicon material manufacturing and surface treatment.
- Target Industrie
- Semiconductor Manufacturing Industry: Supplying essential consumable components for critical semiconductor manufacturing processes, including Dry etching, thin-film deposition (CVD), cleaning, wafer processing, and assembly. Particularly relevant for high-integration memory semiconductor production processes like 3D NAND.Semiconductor Manufacturing Industry: Supplying essential consumable components for critical semiconductor manufacturing processes, including Dry etching, thin-film deposition (CVD), cleaning, wafer processing, and assembly. Particularly relevant for high-integration memory semiconductor production processes like 3D NAND.
- Display Industry: Historical contribution to display processes through its specialty gas business.Display Industry: Historical contribution to display processes through its specialty gas business.
- LED Industry: Aluminum Nitride (AlN), a fine ceramic component, is applied in LED substrates and heat sinks.LED Industry: Aluminum Nitride (AlN), a fine ceramic component, is applied in LED substrates and heat sinks.
- Secondary Battery Material Industry: Possesses business areas for the development, manufacturing, and sales of integrated system solutions for other secondary battery materials.Secondary Battery Material Industry: Possesses business areas for the development, manufacturing, and sales of integrated system solutions for other secondary battery materials.
- Major Markets
- South Korea, JapanSouth Korea, Japan
- United StatesUnited States
- Certifications/Patents
- Holds patents related to silicon material manufacturing and surface treatment, including Registered Patents No. 0918076 and No. 0922620. These technologies improve surface flatness, reduce internal damage, and prevent particle generation during plasma processing of silicon plates and electrodes.Holds patents related to silicon material manufacturing and surface treatment, including Registered Patents No. 0918076 and No. 0922620. These technologies improve surface flatness, reduce internal damage, and prevent particle generation during plasma processing of silicon plates and electrodes.
- Recipient of the 'Best Next-Generation Company Award' at the 11th Korea KOSDAQ Awards (2019).Recipient of the 'Best Next-Generation Company Award' at the 11th Korea KOSDAQ Awards (2019).
- Awarded the Presidential Commendation at the National Productivity Competition (2021).Awarded the Presidential Commendation at the National Productivity Competition (2021).
- Designated as a 'Korea Job-Creating Excellent Enterprise' (2020, 2023).Designated as a 'Korea Job-Creating Excellent Enterprise' (2020, 2023).
- Achieved 'A' grade in 'Work Innovation Excellent Enterprise' (2023) and certified as an 'Excellent Employer for Disabled Persons' (2022).Achieved 'A' grade in 'Work Innovation Excellent Enterprise' (2023) and certified as an 'Excellent Employer for Disabled Persons' (2022).
- Certified as an 'Excellent Labor-Management Culture Enterprise' (2017) and received the '20 Million Dollar Export Tower' award (2017).Certified as an 'Excellent Labor-Management Culture Enterprise' (2017) and received the '20 Million Dollar Export Tower' award (2017).
Introduction
Location
50 3gongdan 3-ro, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
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