GO Element Co., Ltd. is a specialized semiconductor parts and materials company established in 2005, providing high-quality components and materials essential for the thin-film deposition processes critical in electronic material mass production. The company primarily manufactures precursor vaporization and transfer devices for Atomic Layer Deposition (ALD) processes and sputtering targets for Physical Vapor Deposition (PVD) processes. It leads the localization of foreign semiconductor equipment parts, contributing to the technological independence of both domestic and international semiconductor industries. Listed on the KOSDAQ market in 2021, the company secures continuous growth momentum.GOElementCo.,Ltd.isaspecializedsemiconductorpartsandmaterialscompanyestablishedin2005,providinghigh-qualitycomponentsandmaterialsessentialforthethin-filmdepositionprocessescriticalinelectronicmaterialmassproduction.ThecompanyprimarilymanufacturesprecursorvaporizationandtransferdevicesforAtomicLayerDeposition(ALD)processesandsputteringtargetsforPhysicalVaporDeposition(PVD)processes.Itleadsthelocalizationofforeignsemiconductorequipmentparts,contributingtothetechnologicalindependenceofbothdomesticandinternationalsemiconductorindustries.ListedontheKOSDAQmarketin2021,thecompanysecurescontinuousgrowthmomentum.
Key Products/TechnologiesKeyProducts/Technologies
ALD Precursor Vaporization and Transfer Devices: Canisters for storing and transferring high-purity chemicals, ultrasonic level sensors for precise measurement of precursor liquid levels, vaporizers, and integrated PEB (Precursor Evaporation Box) modules. The company developed the world's first insertion-continuous ultrasonic level sensor and holds over 90% market share in the domestic market.ALDPrecursorVaporizationandTransferDevices:Canistersforstoringandtransferringhigh-puritychemicals,ultrasoniclevelsensorsforprecisemeasurementofprecursorliquidlevels,vaporizers,andintegratedPEB(PrecursorEvaporationBox)modules.Thecompanydevelopedtheworld'sfirstinsertion-continuousultrasoniclevelsensorandholdsover90%marketshareinthedomesticmarket.
PVD Sputtering Targets: High-purity metal plate sputtering targets, such as Aluminum (Al), Titanium (Ti), and Copper (Cu), used in the mass production of electronic devices. It is the first Korean company to localize and supply Al, Ti, and Cu-based targets for 300mm semiconductor mass production processes.PVDSputteringTargets:High-puritymetalplatesputteringtargets,suchasAluminum(Al),Titanium(Ti),andCopper(Cu),usedinthemassproductionofelectronicdevices.ItisthefirstKoreancompanytolocalizeandsupplyAl,Ti,andCu-basedtargetsfor300mmsemiconductormassproductionprocesses.
Solid Canisters: Devices for stable vaporization and transfer of next-generation solid precursors, essential for high-integration semiconductor processes, requiring high-performance heating systems and precise control technology. Mass production is expected to commence in 2026, anticipating higher Average Selling Price (ASP) and shorter replacement cycles compared to liquid precursors.SolidCanisters:Devicesforstablevaporizationandtransferofnext-generationsolidprecursors,essentialforhigh-integrationsemiconductorprocesses,requiringhigh-performanceheatingsystemsandprecisecontroltechnology.Massproductionisexpectedtocommencein2026,anticipatinghigherAverageSellingPrice(ASP)andshorterreplacementcyclescomparedtoliquidprecursors.
Large-Capacity Liquid Precursor Vaporization and Supply Devices: Localized semiconductor equipment parts previously 100% reliant on Japan, capable of heating up to 150℃, thereby improving vaporization speed and wafer process speed. The device offers increased precursor capacity within a similar volume to existing units and real-time gas supply control.Large-CapacityLiquidPrecursorVaporizationandSupplyDevices:Localizedsemiconductorequipmentpartspreviously100%reliantonJapan,capableofheatingupto150℃,therebyimprovingvaporizationspeedandwaferprocessspeed.Thedeviceoffersincreasedprecursorcapacitywithinasimilarvolumetoexistingunitsandreal-timegassupplycontrol.
Bake Heaters: Devices for uniform heating across the entire wafer surface before and after semiconductor photolithography processes, currently under development through its subsidiary Geo Appliance, targeting customer supply in the first half of 2025.BakeHeaters:Devicesforuniformheatingacrosstheentirewafersurfacebeforeandaftersemiconductorphotolithographyprocesses,currentlyunderdevelopmentthroughitssubsidiaryGeoAppliance,targetingcustomersupplyinthefirsthalfof2025.
Core AdvantagesCoreAdvantages
Unrivaled Localization Technology: Successful localization of liquid precursor vaporization and supply devices (previously 100% dependent on Japan) and 300mm semiconductor sputtering targets (Al, Ti, Cu). This significantly contributes to the stabilization of the domestic semiconductor industry's supply chain and technological self-reliance.UnrivaledLocalizationTechnology:Successfullocalizationofliquidprecursorvaporizationandsupplydevices(previously100%dependentonJapan)and300mmsemiconductorsputteringtargets(Al,Ti,Cu).Thissignificantlycontributestothestabilizationofthedomesticsemiconductorindustry'ssupplychainandtechnologicalself-reliance.
Leading ALD/PVD Core Component Technology: Development of the world's first insertion-continuous ultrasonic level sensor and capability to produce customized canisters using MER (Mass Evaporation Rate) technology. The company holds a differentiated position as the sole domestic supplier of integrated PEB modules (canister + level sensor).LeadingALD/PVDCoreComponentTechnology:Developmentoftheworld'sfirstinsertion-continuousultrasoniclevelsensorandcapabilitytoproducecustomizedcanistersusingMER(MassEvaporationRate)technology.ThecompanyholdsadifferentiatedpositionasthesoledomesticsupplierofintegratedPEBmodules(canister+levelsensor).
High Domestic Market Share and Technical Reliability: Dominant market share of over 90% in the domestic ALD canister and ultrasonic level sensor market. Its quality competitiveness is validated by global competitors (NSI) adopting its sensors in their canisters.HighDomesticMarketShareandTechnicalReliability:Dominantmarketshareofover90%inthedomesticALDcanisterandultrasoniclevelsensormarket.Itsqualitycompetitivenessisvalidatedbyglobalcompetitors(NSI)adoptingitssensorsintheircanisters.
Establishment of Vertical Deposition Process Portfolio and Business Diversification: Building a vertical portfolio across ALD, PVD, sensor, and heating technologies, evolving into a rare integrated deposition ecosystem player in Korea. This represents a structural turning point leading to expanded customer specifications, diversified revenue streams, and an enlarged total addressable market (TAM) in the mid-to-long term.EstablishmentofVerticalDepositionProcessPortfolioandBusinessDiversification:BuildingaverticalportfolioacrossALD,PVD,sensor,andheatingtechnologies,evolvingintoarareintegrateddepositionecosystemplayerinKorea.Thisrepresentsastructuralturningpointleadingtoexpandedcustomerspecifications,diversifiedrevenuestreams,andanenlargedtotaladdressablemarket(TAM)inthemid-to-longterm.
High R&D Investment and Patent Competitiveness: The company pursues continuous technological innovation through a high proportion of R&D expenditure relative to sales (14.0% in 2020, 9.6% in 2021). Key patents related to ultrasonic level sensors are valid until 2041, securing technological entry barriers.HighR&DInvestmentandPatentCompetitiveness:ThecompanypursuescontinuoustechnologicalinnovationthroughahighproportionofR&Dexpenditurerelativetosales(14.0%in2020,9.6%in2021).Keypatentsrelatedtoultrasoniclevelsensorsarevaliduntil2041,securingtechnologicalentrybarriers.
Target IndustrieTargetIndustrie
Semiconductor Industry: Application in ALD and PVD thin-film deposition processes and bake heaters for pre/post-photolithography stages. Supply of essential components and materials for high-value products like HBM and 3D NAND, and advanced processes below 2nm.SemiconductorIndustry:ApplicationinALDandPVDthin-filmdepositionprocessesandbakeheatersforpre/post-photolithographystages.Supplyofessentialcomponentsandmaterialsforhigh-valueproductslikeHBMand3DNAND,andadvancedprocessesbelow2nm.
Display Industry: Supply of raw materials and components used in thin-film deposition processes.DisplayIndustry:Supplyofrawmaterialsandcomponentsusedinthin-filmdepositionprocesses.
Solar Cell Industry: Supply of raw materials and components used in thin-film deposition processes.SolarCellIndustry:Supplyofrawmaterialsandcomponentsusedinthin-filmdepositionprocesses.
Battery Industry: Potential for expansion of thin-film deposition technology applications.BatteryIndustry:Potentialforexpansionofthin-filmdepositiontechnologyapplications.
Major MarketsMajorMarkets
South Korea, Japan, Taiwan, ChinaSouthKorea,Japan,Taiwan,China
NetherlandsNetherlands
USAUSA
Certifications/PatentsCertifications/Patents
Establishment of a corporate research institute (March 2006) and recognition as a new technology venture (June 2006).Establishmentofacorporateresearchinstitute(March2006)andrecognitionasanewtechnologyventure(June2006).
Awarded the 'Million Dollar Export Tower' (November 2008).Awardedthe'MillionDollarExportTower'(November2008).
Recipient of the '2017 Korea Small and Medium-sized Enterprise Award' (December 2017).Recipientofthe'2017KoreaSmallandMedium-sizedEnterpriseAward'(December2017).
Awarded the 'Industrial Service Merit' at the 2018 Korea Small Businessmen's Convention (May 2018).Awardedthe'IndustrialServiceMerit'atthe2018KoreaSmallBusinessmen'sConvention(May2018).
Received a commendation from the Ministry of SMEs and Startups (December 2020).ReceivedacommendationfromtheMinistryofSMEsandStartups(December2020).
Holds core patents related to ultrasonic level sensors (valid until 2041).Holdscorepatentsrelatedtoultrasoniclevelsensors(validuntil2041).
Proprietary development and patent ownership of solid canisters.Proprietarydevelopmentandpatentownershipofsolidcanisters.
Introduction
Location
30 Geumseok 3-gil, Anseong-si, Gyeonggi-do, South Korea
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Information
30 Geumseok 3-gil, Anseong-si, Gyeonggi-do, South Korea