Information
280-3 Saneop-ro 155beon-gil, Gwonseon-gu, Suwon, Gyeonggi-do, South Korea
+82 31-309-1089
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Overview
- Summary
- Glint Materials, established in 2014, is a pioneering company in the development and manufacturing of anti-slip dry adhesive pads for the semiconductor industry. The company possesses unique technology for precise substrate handling. It provides solutions that address chronic issues such as sliding, misalignment, contamination, and damage in conventional substrate handling methods.Glint Materials, established in 2014, is a pioneering company in the development and manufacturing of anti-slip dry adhesive pads for the semiconductor industry. The company possesses unique technology for precise substrate handling. It provides solutions that address chronic issues such as sliding, misalignment, contamination, and damage in conventional substrate handling methods.
- Key Products/Technologies
- SurfCon®: An innovative dry adhesive high-friction pad solution based on precision polymer engineering and micro-patterning technology. Features strong horizontal adhesion with easy vertical separation, no stickiness, contamination-free, ESD-free, usable in high-temperature (up to 300°C) and high-vacuum environments, with electrically conductive options available. Applies bio-inspired technology, micro-scale structuring, and precise surface modification for wafer sliding prevention.SurfCon®: An innovative dry adhesive high-friction pad solution based on precision polymer engineering and micro-patterning technology. Features strong horizontal adhesion with easy vertical separation, no stickiness, contamination-free, ESD-free, usable in high-temperature (up to 300°C) and high-vacuum environments, with electrically conductive options available. Applies bio-inspired technology, micro-scale structuring, and precise surface modification for wafer sliding prevention.
- POLMA®: Glint Materials' self-developed raw material. Suitable for applications requiring ESD-free properties.POLMA®: Glint Materials' self-developed raw material. Suitable for applications requiring ESD-free properties.
- CONEPOL®: A semiconductor-compliant material that is ESD-free, chemically inert, and contamination-free. Meets semiconductor industry requirements.CONEPOL®: A semiconductor-compliant material that is ESD-free, chemically inert, and contamination-free. Meets semiconductor industry requirements.
- CONY 18: A product developed to meet specific customer requirements.CONY 18: A product developed to meet specific customer requirements.
- MUTAL: A product designed for customers seeking to minimize horizontal slip.MUTAL: A product designed for customers seeking to minimize horizontal slip.
- Core Advantages
- The first pioneering company in Korea to develop and manufacture anti-slip dry adhesive pads for precise substrate handling in the semiconductor industry.The first pioneering company in Korea to develop and manufacture anti-slip dry adhesive pads for precise substrate handling in the semiconductor industry.
- Biomimicry technology inspired by the selective adhesion mechanism of gecko feet, combined with precision material synthesis technology.Biomimicry technology inspired by the selective adhesion mechanism of gecko feet, combined with precision material synthesis technology.
- Controllability of directional adhesion force, providing strong horizontal adhesion while allowing substrates to pop free when separated from the pad.Controllability of directional adhesion force, providing strong horizontal adhesion while allowing substrates to pop free when separated from the pad.
- Superior recovery force, approximately three times better than conventional pads (e.g., NBR, FFKM), and high-temperature resistance for use up to 300°C.Superior recovery force, approximately three times better than conventional pads (e.g., NBR, FFKM), and high-temperature resistance for use up to 300°C.
- Highly educated and semiconductor industry-oriented human resources capable of providing diverse material solutions tailored to customer technical requirements.Highly educated and semiconductor industry-oriented human resources capable of providing diverse material solutions tailored to customer technical requirements.
- Possession of a Class 10 cleanroom production facility, enabling the manufacture of materials suitable for the semiconductor and display industries.Possession of a Class 10 cleanroom production facility, enabling the manufacture of materials suitable for the semiconductor and display industries.
- Competitive pricing similar to FFKM, reducing replacement cost burdens for existing FFKM users.Competitive pricing similar to FFKM, reducing replacement cost burdens for existing FFKM users.
- Global market responsiveness, collaborating with over 150 customers worldwide and mass-producing for major global semiconductor equipment manufacturers.Global market responsiveness, collaborating with over 150 customers worldwide and mass-producing for major global semiconductor equipment manufacturers.
- Target Industrie
- Semiconductor Industry: Precise substrate handling, wafer handling, components for semiconductor transfer robots.Semiconductor Industry: Precise substrate handling, wafer handling, components for semiconductor transfer robots.
- Display Industry: Glass substrate handling, precise substrate processing.Display Industry: Glass substrate handling, precise substrate processing.
- Major Markets
- South Korea, JapanSouth Korea, Japan
- Certifications/Patents
- Technical Achievement certification from Korea Technology Finance Corporation.Technical Achievement certification from Korea Technology Finance Corporation.
- Recognition of Social Contribution and Medal of Social Contribution from the Red Cross.Recognition of Social Contribution and Medal of Social Contribution from the Red Cross.
- Successful achievement of SEMI industry requirements and adherence to SEMI Compliance.Successful achievement of SEMI industry requirements and adherence to SEMI Compliance.
- Continuous technological development efforts through R&D collaboration, industry-university institute collaboration, and university partnerships.Continuous technological development efforts through R&D collaboration, industry-university institute collaboration, and university partnerships.
- Patent applications and ongoing patent processes.Patent applications and ongoing patent processes.
Introduction
Location
280-3 Saneop-ro 155beon-gil, Gwonseon-gu, Suwon, Gyeonggi-do, South Korea
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