Information
24 Songdogwahak-ro 84beon-gil, Yeonsu-gu, Incheon, South Korea
+82 32-810-8401
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Overview
- Summary
- Genesem Inc. is a specialized semiconductor back-end process automation equipment manufacturer established in 2000, leveraging proprietary laser technology to develop and produce various semiconductor equipment including EMI Shield, Saw Singulation, Laser Application, and Pick and Place solutions. The company holds a leading position in EMI Shield solutions and Laser Marking, being the first in Korea to develop PCB Laser products. Genesem is actively focusing on developing next-generation technologies like HBM, 2.5D CoWoS, and hybrid bonding equipment to meet the increasing demand for high-performance memory and advanced packaging, aiming for global market expansion.Genesem Inc. is a specialized semiconductor back-end process automation equipment manufacturer established in 2000, leveraging proprietary laser technology to develop and produce various semiconductor equipment including EMI Shield, Saw Singulation, Laser Application, and Pick and Place solutions. The company holds a leading position in EMI Shield solutions and Laser Marking, being the first in Korea to develop PCB Laser products. Genesem is actively focusing on developing next-generation technologies like HBM, 2.5D CoWoS, and hybrid bonding equipment to meet the increasing demand for high-performance memory and advanced packaging, aiming for global market expansion.
- Key Products/Technologies
- HBM (High Bandwidth Memory) Process Equipment: Genesem offers solutions for HBM wafer mounters (vacuum mounter, roll mounter), HBM film removers, HBM PKG sorters (ring-to-reel, ring-to-tray), and HBM die sorters (KGD sorter). The vacuum mounter is anticipated for future multi-layered HBM chips, and the die recon equipment precisely realigns HBM chip dies cut from wafers.HBM (High Bandwidth Memory) Process Equipment: Genesem offers solutions for HBM wafer mounters (vacuum mounter, roll mounter), HBM film removers, HBM PKG sorters (ring-to-reel, ring-to-tray), and HBM die sorters (KGD sorter). The vacuum mounter is anticipated for future multi-layered HBM chips, and the die recon equipment precisely realigns HBM chip dies cut from wafers.
- 2.5D CoWoS (Chip-on-Wafer-on-Substrate) Packaging Equipment: The company develops and supplies equipment for 2.5D packaging technology, which aligns GPUs (AI accelerators) and HBMs on silicon interposers. Its loading equipment, which precisely places bare substrates onto metal boats or jig carriers, offers a precision level of 30 micrometers and includes a 3D scanner for substrate alignment measurement. Tray-to-boat equipment transfers completed modules from trays to containers.2.5D CoWoS (Chip-on-Wafer-on-Substrate) Packaging Equipment: The company develops and supplies equipment for 2.5D packaging technology, which aligns GPUs (AI accelerators) and HBMs on silicon interposers. Its loading equipment, which precisely places bare substrates onto metal boats or jig carriers, offers a precision level of 30 micrometers and includes a 3D scanner for substrate alignment measurement. Tray-to-boat equipment transfers completed modules from trays to containers.
- EMI Shield Equipment: Equipment for attaching packages to ring frames for EMI shielding and detaching them after the shielding process. The company demonstrated leading technological capabilities by achieving the top domestic sales in EMI Shield solutions in 2022.EMI Shield Equipment: Equipment for attaching packages to ring frames for EMI shielding and detaching them after the shielding process. The company demonstrated leading technological capabilities by achieving the top domestic sales in EMI Shield solutions in 2022.
- Laser Application Equipment: Development and supply of various laser application equipment, including laser marking, laser cutting, laser drilling, and PCB laser products. Genesem achieved the top sales in laser marking in 2014 and provides precise laser marking equipment capable of setting marking locations within 50-micrometer parameters.Laser Application Equipment: Development and supply of various laser application equipment, including laser marking, laser cutting, laser drilling, and PCB laser products. Genesem achieved the top sales in laser marking in 2014 and provides precise laser marking equipment capable of setting marking locations within 50-micrometer parameters.
- Saw Singulation Equipment: Equipment for sawing strips into PKG units and then sorting them into trays. Through the development of FC-BGA (Flip Chip-Ball Grid Array) substrate cutting equipment, the company is responding to the trend of larger package substrates and expanding its market share.Saw Singulation Equipment: Equipment for sawing strips into PKG units and then sorting them into trays. Through the development of FC-BGA (Flip Chip-Ball Grid Array) substrate cutting equipment, the company is responding to the trend of larger package substrates and expanding its market share.
- Hybrid Bonding Equipment: Participation in a government project to develop next-generation hybrid bonding equipment, a chip packaging technology that directly interconnects embedded metal (copper) and oxide layers instead of using bumps. The development targets a bonding accuracy of ±100 nanometers, a throughput of over 2,000 units per hour, stacking of more than 20 layers, and ISO3 cleanliness levels.Hybrid Bonding Equipment: Participation in a government project to develop next-generation hybrid bonding equipment, a chip packaging technology that directly interconnects embedded metal (copper) and oxide layers instead of using bumps. The development targets a bonding accuracy of ±100 nanometers, a throughput of over 2,000 units per hour, stacking of more than 20 layers, and ISO3 cleanliness levels.
- Core Advantages
- Core Technology Convergence based on Laser Original Technology: Genesem provides differentiated solutions in semiconductor back-end process equipment by integrating various core technologies based on its original laser technology. This is a key competitive advantage applied across a wide range of products including EMI Shield, Laser Marking/Cutting, and Saw Singulation.Core Technology Convergence based on Laser Original Technology: Genesem provides differentiated solutions in semiconductor back-end process equipment by integrating various core technologies based on its original laser technology. This is a key competitive advantage applied across a wide range of products including EMI Shield, Laser Marking/Cutting, and Saw Singulation.
- Diversity of Semiconductor Back-end Equipment Portfolio and References: The company possesses over 50 different semiconductor back-end equipment references, developing and supplying a broad range of products such as EMI Attach/Detach, Saw Singulation, Laser Application, Pick and Place, and HBM Process equipment. This ensures flexibility in responding to diverse customer demands.Diversity of Semiconductor Back-end Equipment Portfolio and References: The company possesses over 50 different semiconductor back-end equipment references, developing and supplying a broad range of products such as EMI Attach/Detach, Saw Singulation, Laser Application, Pick and Place, and HBM Process equipment. This ensures flexibility in responding to diverse customer demands.
- Leadership in Advanced Packaging Technology and R&D Investment: Genesem actively invests in the development of high-performance memory and advanced packaging technologies like HBM, 2.5D CoWoS, and hybrid bonding, participating in government projects to lead future technologies. Approximately 32% of its workforce consists of R&D specialists, and about 7% of its revenue is invested in research and development, emphasizing technological innovation.Leadership in Advanced Packaging Technology and R&D Investment: Genesem actively invests in the development of high-performance memory and advanced packaging technologies like HBM, 2.5D CoWoS, and hybrid bonding, participating in government projects to lead future technologies. Approximately 32% of its workforce consists of R&D specialists, and about 7% of its revenue is invested in research and development, emphasizing technological innovation.
- Global Market Supply Chain and Expansion Strategy: The company supplies semiconductor back-end process equipment not only domestically but also to global markets including the United States, China, Mexico, the Philippines, Vietnam, and India, establishing a stable global revenue base. Efforts to explore new markets include expanding into the EV semiconductor market through orders for EV power module production automation equipment.Global Market Supply Chain and Expansion Strategy: The company supplies semiconductor back-end process equipment not only domestically but also to global markets including the United States, China, Mexico, the Philippines, Vietnam, and India, establishing a stable global revenue base. Efforts to explore new markets include expanding into the EV semiconductor market through orders for EV power module production automation equipment.
- Precision Control and Automation Technology: Genesem possesses high-precision control and automation technologies, such as loading equipment with 30-micrometer precision and laser marking equipment capable of setting parameters within 50 micrometers. These are crucial factors contributing to the efficiency and quality improvement of semiconductor manufacturing processes.Precision Control and Automation Technology: Genesem possesses high-precision control and automation technologies, such as loading equipment with 30-micrometer precision and laser marking equipment capable of setting parameters within 50 micrometers. These are crucial factors contributing to the efficiency and quality improvement of semiconductor manufacturing processes.
- Vertical Integration and Total Solution Provision Capability: The company aims to become a total solution provider in advanced packaging by supplying various equipment used in back-end processes, including wafer cutters, tapers, vacuum mounters, and die sorters.Vertical Integration and Total Solution Provision Capability: The company aims to become a total solution provider in advanced packaging by supplying various equipment used in back-end processes, including wafer cutters, tapers, vacuum mounters, and die sorters.
- Target Industrie
- Semiconductor Industry: Supply of equipment for the entire semiconductor back-end process, including HBM, 2.5D CoWoS, EMI Shielding, Saw Singulation, Laser Marking/Cutting, and Pick and Place.Semiconductor Industry: Supply of equipment for the entire semiconductor back-end process, including HBM, 2.5D CoWoS, EMI Shielding, Saw Singulation, Laser Marking/Cutting, and Pick and Place.
- Electric Vehicle (EV) Power Module Manufacturing Industry: Expansion of business into the EV semiconductor market through the supply of automation equipment for EV power module production.Electric Vehicle (EV) Power Module Manufacturing Industry: Expansion of business into the EV semiconductor market through the supply of automation equipment for EV power module production.
- PCB (Printed Circuit Board) Manufacturing Industry: Development of the first PCB laser products in Korea and provision of PCB assembly and manufacturing solutions.PCB (Printed Circuit Board) Manufacturing Industry: Development of the first PCB laser products in Korea and provision of PCB assembly and manufacturing solutions.
- Digital Wireless Communication Device Industry: Contribution to solving electromagnetic interference issues in digital wireless communication devices through EMI Shield technology.Digital Wireless Communication Device Industry: Contribution to solving electromagnetic interference issues in digital wireless communication devices through EMI Shield technology.
- Solar Panel Industry: Participation in a joint research project related to stringer systems that use laser cutting to halve solar cell bars, segment them with an automatic breaking device, and then attach electric wires.Solar Panel Industry: Participation in a joint research project related to stringer systems that use laser cutting to halve solar cell bars, segment them with an automatic breaking device, and then attach electric wires.
- Major Markets
- South Korea, China, Philippines, Vietnam, India, SingaporeSouth Korea, China, Philippines, Vietnam, India, Singapore
- United States, MexicoUnited States, Mexico
- Certifications/Patents
- Possession of approximately 100 patents and utility models.Possession of approximately 100 patents and utility models.
- Technological capabilities related to package substrate vision inspection systems (2013).Technological capabilities related to package substrate vision inspection systems (2013).
- Technological capabilities related to vision inspection and marking systems for semiconductor packages (2014).Technological capabilities related to vision inspection and marking systems for semiconductor packages (2014).
- Technological capabilities related to EMI shield processing methods for semiconductor packages (2014).Technological capabilities related to EMI shield processing methods for semiconductor packages (2014).
- Technological capabilities related to singulators (2016).Technological capabilities related to singulators (2016).
- Technological capabilities related to automatic exchange devices for table modules and conversion kits (2019).Technological capabilities related to automatic exchange devices for table modules and conversion kits (2019).
- Participation in a government project for hybrid bonding equipment development, targeting ±100 nanometer bonding accuracy, 2,000 units per hour throughput, over 20-layer stacking, and ISO3 cleanliness.Participation in a government project for hybrid bonding equipment development, targeting ±100 nanometer bonding accuracy, 2,000 units per hour throughput, over 20-layer stacking, and ISO3 cleanliness.
Introduction
Location
24 Songdogwahak-ro 84beon-gil, Yeonsu-gu, Incheon, South Korea
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