A fabless company specializing in memory semiconductor design and sales, focusing on the development of mobile memory solutions essential for wireless communication technology.Afablesscompanyspecializinginmemorysemiconductordesignandsales,focusingonthedevelopmentofmobilememorysolutionsessentialforwirelesscommunicationtechnology.
Key Products/TechnologiesKeyProducts/Technologies
The DRAM product line includes diverse mobile DRAM solutions such as Low Power SDRAM, Low Power DDR SDRAM, Low Power DDR2 SDRAM, DDR3 SDRAM, LPDDR4x SDRAM, and Pseudo SRAM. The company also offers specialized DRAM products like RL DRAM (288Mb & 576Mbit, 1-bit parity) specifically for Cisco network servers.TheDRAMproductlineincludesdiversemobileDRAMsolutionssuchasLowPowerSDRAM,LowPowerDDRSDRAM,LowPowerDDR2SDRAM,DDR3SDRAM,LPDDR4xSDRAM,andPseudoSRAM.ThecompanyalsooffersspecializedDRAMproductslikeRLDRAM(288Mb&576Mbit,1-bitparity)specificallyforCisconetworkservers.
A comprehensive flash memory portfolio is established, including NAND Flash, SPI NAND Flash, SPI NOR Flash, and eMMC. NAND Flash supports 1.8V or 3.3V VCC and VCCQ power supply with x8 or x16 I/O interface, providing a cost-effective solution for the solid-state mass storage market. SPI NOR Flash offers a storage solution for systems with limited space, pins, and power.Acomprehensiveflashmemoryportfolioisestablished,includingNANDFlash,SPINANDFlash,SPINORFlash,andeMMC.NANDFlashsupports1.8Vor3.3VVCCandVCCQpowersupplywithx8orx16I/Ointerface,providingacost-effectivesolutionforthesolid-statemassstoragemarket.SPINORFlashoffersastoragesolutionforsystemswithlimitedspace,pins,andpower.
Development of Multi-Chip Package (MCP) products, including NAND-based MCP and NOR-based MCP. Provision of total memory solutions offering advantages in space savings, cost savings, high quality, high performance, and power efficiency.DevelopmentofMulti-ChipPackage(MCP)products,includingNAND-basedMCPandNOR-basedMCP.Provisionoftotalmemorysolutionsofferingadvantagesinspacesavings,costsavings,highquality,highperformance,andpowerefficiency.
Through a Known Good Die (KGD) business model, the capability to supply KGD products with guaranteed wafer-level reliability.ThroughaKnownGoodDie(KGD)businessmodel,thecapabilitytosupplyKGDproductswithguaranteedwafer-levelreliability.
Core AdvantagesCoreAdvantages
A fabless business model focusing on semiconductor design without in-house manufacturing facilities, maintaining strong cooperative relationships with global foundries like Powerchip (PSMC) and China's SMIC, and post-processing specialists such as ChipMos, Winpac, and KYEC. This business structure minimizes capital expenditure on facilities and maximizes production efficiency.Afablessbusinessmodelfocusingonsemiconductordesignwithoutin-housemanufacturingfacilities,maintainingstrongcooperativerelationshipswithglobalfoundrieslikePowerchip(PSMC)andChina'sSMIC,andpost-processingspecialistssuchasChipMos,Winpac,andKYEC.Thisbusinessstructureminimizescapitalexpenditureonfacilitiesandmaximizesproductionefficiency.
Possession of proprietary design technology enabling the design of smaller chip sizes for the same product compared to competitors. This leads to a higher chip count per wafer, reducing production costs and securing a competitive edge in pricing.Possessionofproprietarydesigntechnologyenablingthedesignofsmallerchipsizesforthesameproductcomparedtocompetitors.Thisleadstoahigherchipcountperwafer,reducingproductioncostsandsecuringacompetitiveedgeinpricing.
Leveraging cooperation with foundry companies for advanced processes to minimize design errors and shorten development periods. Accumulated know-how from over 10 years of industry experience enables the timely supply of products meeting customer requirements to the market.Leveragingcooperationwithfoundrycompaniesforadvancedprocessestominimizedesignerrorsandshortendevelopmentperiods.Accumulatedknow-howfromover10yearsofindustryexperienceenablesthetimelysupplyofproductsmeetingcustomerrequirementstothemarket.
Securing a competitive advantage in speed, a crucial factor for buffer memory. Possession of technology to accelerate chip speed through a simplified internal logic circuit design. Expertise in implementing low-power/low-voltage technology for low standby current (ISB), essential for Pseudo SRAM and Low Power DRAM.Securingacompetitiveadvantageinspeed,acrucialfactorforbuffermemory.Possessionoftechnologytoacceleratechipspeedthroughasimplifiedinternallogiccircuitdesign.Expertiseinimplementinglow-power/low-voltagetechnologyforlowstandbycurrent(ISB),essentialforPseudoSRAMandLowPowerDRAM.
A company dedicated to developing customer-specific products in response to the rapidly changing market environment and the demands of the AI era.Acompanydedicatedtodevelopingcustomer-specificproductsinresponsetotherapidlychangingmarketenvironmentandthedemandsoftheAIera.
Target IndustrieTargetIndustrie
Wireless communication device industryWirelesscommunicationdeviceindustry
Mobile communication and point-to-point application sectorsMobilecommunicationandpoint-to-pointapplicationsectors
Automotive electronic components and automotive industryAutomotiveelectroniccomponentsandautomotiveindustry
Industrial and embedded applicationsIndustrialandembeddedapplications
IoT systems, battery-powered devices, and portable electronics sectorsIoTsystems,battery-powereddevices,andportableelectronicssectors
Major MarketsMajorMarkets
South Korea, China, TaiwanSouthKorea,China,Taiwan
EuropeEurope
USAUSA
Certifications/PatentsCertifications/Patents
Establishment of a corporate research institute in June 1993, ensuring continuous technological development capabilities.EstablishmentofacorporateresearchinstituteinJune1993,ensuringcontinuoustechnologicaldevelopmentcapabilities.
Development of high-performance and energy-efficient memory devices compatible with JEDEC standards.Developmentofhigh-performanceandenergy-efficientmemorydevicescompatiblewithJEDECstandards.
Aspiration to become a global memory design specialist company based on proprietary memory design technology and diverse networks.Aspirationtobecomeaglobalmemorydesignspecialistcompanybasedonproprietarymemorydesigntechnologyanddiversenetworks.
Commitment to quality policy, environmental policy, environmental regulatory compliance, and quality certification.Commitmenttoqualitypolicy,environmentalpolicy,environmentalregulatorycompliance,andqualitycertification.
Specific patent numbers are not identified, but the company holds technological strengths through its unique design technology and know-how.Specificpatentnumbersarenotidentified,butthecompanyholdstechnologicalstrengthsthroughitsuniquedesigntechnologyandknow-how.
Introduction
Location
93 Baekhyeon-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea
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Information
93 Baekhyeon-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea