EXICON, established in 2001, is a technology-leading company in the semiconductor test equipment sector, specializing in the development and sales of various semiconductor inspection equipment, including memory, SSD, and SoC testers. The company aims to become a global semiconductor tester leader. Its efforts include the development and provision of top-tier mass production semiconductor equipment to customers. It engages in semiconductor inspection equipment manufacturing and testing service businesses, evaluating the performance and reliability of semiconductors during the manufacturing process.EXICON,establishedin2001,isatechnology-leadingcompanyinthesemiconductortestequipmentsector,specializinginthedevelopmentandsalesofvarioussemiconductorinspectionequipment,includingmemory,SSD,andSoCtesters.Thecompanyaimstobecomeaglobalsemiconductortesterleader.Itseffortsincludethedevelopmentandprovisionoftop-tiermassproductionsemiconductorequipmenttocustomers.Itengagesinsemiconductorinspectionequipmentmanufacturingandtestingservicebusinesses,evaluatingtheperformanceandreliabilityofsemiconductorsduringthemanufacturingprocess.
Key Products/TechnologiesKeyProducts/Technologies
Memory Tester: Equipment performing final inspection of memory DRAM components and modules, such as DDR4 and DDR5. The Chamber Type LF Tester supports low-frequency memory testing, featuring extreme environment settings and high-capacity parallelism (11,520 Para) for significantly increased efficiency. The i1000 Series supports Full Function Test and DC Test for DDR4 and DDR5 modules, offering up to 200MHz TOF Function and Per Site Operation Testing capabilities. The i7000 Series supports Full Function Test and DC Test for DDR4 and DDR5 components, also equipped with up to 200MHz TOF Function and Per Site Operation Testing.MemoryTester:EquipmentperformingfinalinspectionofmemoryDRAMcomponentsandmodules,suchasDDR4andDDR5.TheChamberTypeLFTestersupportslow-frequencymemorytesting,featuringextremeenvironmentsettingsandhigh-capacityparallelism(11,520Para)forsignificantlyincreasedefficiency.Thei1000SeriessupportsFullFunctionTestandDCTestforDDR4andDDR5modules,offeringupto200MHzTOFFunctionandPerSiteOperationTestingcapabilities.Thei7000SeriessupportsFullFunctionTestandDCTestforDDR4andDDR5components,alsoequippedwithupto200MHzTOFFunctionandPerSiteOperationTesting.
SSD Tester (Storage Tester): Equipment conducting final inspection of various SSDs (Enterprise, Client, Automotive), supporting defect determination, performance, and reliability testing. The Gen5 Tester Series supports multi-protocol capabilities including PCIe Gen5 32G and SAS 24G, and various form factors such as EDSFF (E1, E3), M.2, U.2/U.3, and AIC. It offers CXL 2.0 cross-testing support and stable temperature uniformity (±3℃ @No-Load), integrating the iEOS Advanced Tester Solution. The SST 12K/24K series is an aging test equipment for SSD reliability, while the TRIO next-generation inspection system is a high-capacity SSD inspection equipment applying next-generation and high-speed protocols.SSDTester(StorageTester):EquipmentconductingfinalinspectionofvariousSSDs(Enterprise,Client,Automotive),supportingdefectdetermination,performance,andreliabilitytesting.TheGen5TesterSeriessupportsmulti-protocolcapabilitiesincludingPCIeGen532GandSAS24G,andvariousformfactorssuchasEDSFF(E1,E3),M.2,U.2/U.3,andAIC.ItoffersCXL2.0cross-testingsupportandstabletemperatureuniformity(±3℃@No-Load),integratingtheiEOSAdvancedTesterSolution.TheSST12K/24KseriesisanagingtestequipmentforSSDreliability,whiletheTRIOnext-generationinspectionsystemisahigh-capacitySSDinspectionequipmentapplyingnext-generationandhigh-speedprotocols.
Burn-in Tester: Equipment verifying the reliability of devices, deemed good after wafer testing, under extreme conditions (high temperature/high voltage/Cell Stress) for a certain period, playing a role in early detection of semiconductor product defects. The i2154 model features High Power and High Productivity, with a 6-fold increase in capacity compared to existing burn-in testers for enhanced efficiency. It offers NAND Memory Test options and targets various devices including DRAM (DDR, Mobile, Graphic) and Flash (Option). The i2300 model provides High Speed and High Accuracy, incorporating an Embedded memory Tester with Burn-In system.Burn-inTester:Equipmentverifyingthereliabilityofdevices,deemedgoodafterwafertesting,underextremeconditions(hightemperature/highvoltage/CellStress)foracertainperiod,playingaroleinearlydetectionofsemiconductorproductdefects.Thei2154modelfeaturesHighPowerandHighProductivity,witha6-foldincreaseincapacitycomparedtoexistingburn-intestersforenhancedefficiency.ItoffersNANDMemoryTestoptionsandtargetsvariousdevicesincludingDRAM(DDR,Mobile,Graphic)andFlash(Option).Thei2300modelprovidesHighSpeedandHighAccuracy,incorporatinganEmbeddedmemoryTesterwithBurn-Insystem.
SoC Tester (System on Chip Tester): Test equipment applicable to various non-memory products such as DDI (Display Driver IC), AP (Application Processor), CIS (CMOS Image Sensor), LED, and PMIC. The EX9000 Series features a Scalable Platform allowing board configuration and platform setup according to the test product. It offers high performance with High Speed Logic Test support and a Multi-Para System, operating on a Linux operating system.SoCTester(SystemonChipTester):Testequipmentapplicabletovariousnon-memoryproductssuchasDDI(DisplayDriverIC),AP(ApplicationProcessor),CIS(CMOSImageSensor),LED,andPMIC.TheEX9000SeriesfeaturesaScalablePlatformallowingboardconfigurationandplatformsetupaccordingtothetestproduct.ItoffershighperformancewithHighSpeedLogicTestsupportandaMulti-ParaSystem,operatingonaLinuxoperatingsystem.
CXL Tester: The company has secured foundational technology for next-generation CXL (Compute Express Link) testers and is actively developing technologies to lead the CXL 2.0 and CXL 3.1 test equipment markets. This development addresses the expanding Enterprise SSD and CXL markets driven by the growth of AI and big data.CXLTester:Thecompanyhassecuredfoundationaltechnologyfornext-generationCXL(ComputeExpressLink)testersandisactivelydevelopingtechnologiestoleadtheCXL2.0andCXL3.1testequipmentmarkets.ThisdevelopmentaddressestheexpandingEnterpriseSSDandCXLmarketsdrivenbythegrowthofAIandbigdata.
Core AdvantagesCoreAdvantages
Unrivaled Technology and Localization Leadership: A company aiming to be a global technology leader in semiconductor test equipment. It leads the localization of memory testers and has successfully achieved the first domestic localization in the non-memory tester market.UnrivaledTechnologyandLocalizationLeadership:Acompanyaimingtobeaglobaltechnologyleaderinsemiconductortestequipment.Itleadsthelocalizationofmemorytestersandhassuccessfullyachievedthefirstdomesticlocalizationinthenon-memorytestermarket.
Broad Product Portfolio and Next-Generation Technology Preemption: Possessing a diverse lineup of semiconductor test equipment, including memory (DRAM, NAND), SSD, SoC, and burn-in testers. Actively pursuing the development and commercialization of next-generation technologies like CXL testers, Gen6 SSD testers, and CIS testers for future semiconductor markets.BroadProductPortfolioandNext-GenerationTechnologyPreemption:Possessingadiverselineupofsemiconductortestequipment,includingmemory(DRAM,NAND),SSD,SoC,andburn-intesters.Activelypursuingthedevelopmentandcommercializationofnext-generationtechnologieslikeCXLtesters,Gen6SSDtesters,andCIStestersforfuturesemiconductormarkets.
Close Collaboration with Major Clients and Market Share: Securing Samsung Electronics as a key client and holding the number one market share in the domestic SSD tester market. Building strong trust with clients, exemplified by its selection as an excellent partner by Samsung Electronics DS Division.CloseCollaborationwithMajorClientsandMarketShare:SecuringSamsungElectronicsasakeyclientandholdingthenumberonemarketshareinthedomesticSSDtestermarket.Buildingstrongtrustwithclients,exemplifiedbyitsselectionasanexcellentpartnerbySamsungElectronicsDSDivision.
Continuous R&D Investment and Patent Acquisition: A company strengthening its technological competitiveness through annual R&D investments exceeding 20 billion KRW. Possessing technological prowess demonstrated by numerous domestic patents, including those for semiconductor memory module aging inspection devices, SSD BIST devices, semiconductor memory device test systems and methods, and SoC test systems.ContinuousR&DInvestmentandPatentAcquisition:AcompanystrengtheningitstechnologicalcompetitivenessthroughannualR&Dinvestmentsexceeding20billionKRW.Possessingtechnologicalprowessdemonstratedbynumerousdomesticpatents,includingthoseforsemiconductormemorymoduleaginginspectiondevices,SSDBISTdevices,semiconductormemorydevicetestsystemsandmethods,andSoCtestsystems.
Enhanced Productivity and Efficiency Technology: Technological capability to significantly increase efficiency by over 20 times compared to existing equipment, through the adoption of high-capacity parallelism (11,520 Para) in its Chamber Type LF Tester. This innovative solution contributes to reducing space and operating costs in manufacturing lines.EnhancedProductivityandEfficiencyTechnology:Technologicalcapabilitytosignificantlyincreaseefficiencybyover20timescomparedtoexistingequipment,throughtheadoptionofhigh-capacityparallelism(11,520Para)initsChamberTypeLFTester.Thisinnovativesolutioncontributestoreducingspaceandoperatingcostsinmanufacturinglines.
Target IndustrieTargetIndustrie
Semiconductor Manufacturing Industry (post-processing inspection of memory and non-memory semiconductors)SemiconductorManufacturingIndustry(post-processinginspectionofmemoryandnon-memorysemiconductors)
AI and High-Performance Computing (HPC) Industry (AI server semiconductors, CXL memory testing)AIandHigh-PerformanceComputing(HPC)Industry(AIserversemiconductors,CXLmemorytesting)
Mobile and Automotive Electronic Camera Module Production Industry (CIS tester application)MobileandAutomotiveElectronicCameraModuleProductionIndustry(CIStesterapplication)
Major MarketsMajorMarkets
Japan (holds Exicon Japan Corporation as an affiliate)Japan(holdsExiconJapanCorporationasanaffiliate)
Certifications/PatentsCertifications/Patents
Acquisition of domestic patent for semiconductor memory module aging inspection deviceAcquisitionofdomesticpatentforsemiconductormemorymoduleaginginspectiondevice
Acquisition of patent for SSD Built-In Self Test (BIST) deviceAcquisitionofpatentforSSDBuilt-InSelfTest(BIST)device
Acquisition of domestic patent for semiconductor memory device test system and methodAcquisitionofdomesticpatentforsemiconductormemorydevicetestsystemandmethod
Acquisition of patent for System on Chip (SoC) test systemAcquisitionofpatentforSystemonChip(SoC)testsystem
ISO 9001/14001 Certification (2004)ISO9001/14001Certification(2004)
Samsung Electronics Technology Innovation Award (2005)SamsungElectronicsTechnologyInnovationAward(2005)
Ministry of Science and Technology New Technology Certification (2006)MinistryofScienceandTechnologyNewTechnologyCertification(2006)
Selected as KOSDAQ Rising Star (2019, 2020, 2021, 2023, 2024)SelectedasKOSDAQRisingStar(2019,2020,2021,2023,2024)
IR52 Jang Young-shil Award (SSD ultra-high-speed test system TRIO, 2018)IR52JangYoung-shilAward(SSDultra-high-speedtestsystemTRIO,2018)
Selected as World Class 300 Company (2018)SelectedasWorldClass300Company(2018)
Selected as Strong Small and Medium-sized Enterprise 100 for Materials, Parts, and Equipment (2020)SelectedasStrongSmallandMedium-sizedEnterprise100forMaterials,Parts,andEquipment(2020)