Information
Hauptstrasse 1A, 9477 Trübbach, Switzerland
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Overview
- Summary
- Evatec AG is a global supplier of thin film deposition solutions and coating technologies for the semiconductor, optoelectronics, MEMS, photonics, and advanced packaging industries. The company leverages over 70 years of thin film technology expertise to develop and supply critical technologies used in offices, homes, cars, and smart devices. Evatec is at the forefront of thin film technology, enabling the revolution of future smart technologies such as the Internet of Things (IoT), 5G communication, Artificial Intelligence (AI), and autonomous driving. It provides essential deposition equipment and process solutions for the production of high-performance power devices, MEMS sensors and actuators, and precision optical components.Evatec AG is a global supplier of thin film deposition solutions and coating technologies for the semiconductor, optoelectronics, MEMS, photonics, and advanced packaging industries. The company leverages over 70 years of thin film technology expertise to develop and supply critical technologies used in offices, homes, cars, and smart devices. Evatec is at the forefront of thin film technology, enabling the revolution of future smart technologies such as the Internet of Things (IoT), 5G communication, Artificial Intelligence (AI), and autonomous driving. It provides essential deposition equipment and process solutions for the production of high-performance power devices, MEMS sensors and actuators, and precision optical components.
- Key Products/Technologies
- CLUSTERLINE® Product Family: Fully automated cluster platforms for 200mm and 300mm wafers, offering single-wafer processing solutions for front and backside metal deposition. These versatile platforms are utilized across various core markets including MEMS, power devices, wireless communication, and optoelectronics. Specifically, the CLUSTERLINE® 300 is a CMOS-compatible system for 300mm wafer processing, supporting Ti-Al process solutions for advanced logic and memory applications, as well as Ta/TaN barrier and Cu seed processes.CLUSTERLINE® Product Family: Fully automated cluster platforms for 200mm and 300mm wafers, offering single-wafer processing solutions for front and backside metal deposition. These versatile platforms are utilized across various core markets including MEMS, power devices, wireless communication, and optoelectronics. Specifically, the CLUSTERLINE® 300 is a CMOS-compatible system for 300mm wafer processing, supporting Ti-Al process solutions for advanced logic and memory applications, as well as Ta/TaN barrier and Cu seed processes.
- BAK Product Family: Flexible evaporators ranging from 0.5m to 1.4m in size, suitable for a wide range of applications from R&D to mass production. The BAK 911 and MULTI BAK are clustered evaporation solutions that contribute to improved process repeatability and lower cost of ownership in wireless applications. The BAK 1401 is specifically used for manufacturing CsI/TlI-based scintillators for high-performance digital X-ray detectors in medical settings.BAK Product Family: Flexible evaporators ranging from 0.5m to 1.4m in size, suitable for a wide range of applications from R&D to mass production. The BAK 911 and MULTI BAK are clustered evaporation solutions that contribute to improved process repeatability and lower cost of ownership in wireless applications. The BAK 1401 is specifically used for manufacturing CsI/TlI-based scintillators for high-performance digital X-ray detectors in medical settings.
- SOLARIS® Product Family: Inline production solutions for cost-sensitive applications, supporting thick frontside metal, double-sided, or backside metal processes. These platforms offer high-speed manufacturing solutions for rigid and flexible substrates in diverse areas such as touch panels, EMI shielding, thermoelectric generators, power devices, and photovoltaics.SOLARIS® Product Family: Inline production solutions for cost-sensitive applications, supporting thick frontside metal, double-sided, or backside metal processes. These platforms offer high-speed manufacturing solutions for rigid and flexible substrates in diverse areas such as touch panels, EMI shielding, thermoelectric generators, power devices, and photovoltaics.
- HEXAGON: A dedicated platform for wafer-level packaging (WLP) applications, delivering high throughput and low Rc (resistance) values at the lowest cost of ownership. It supports atmospheric pressure degas, etch, and metal deposition processes essential for Fan-out Wafer Level Packaging (FOWLP) technology.HEXAGON: A dedicated platform for wafer-level packaging (WLP) applications, delivering high throughput and low Rc (resistance) values at the lowest cost of ownership. It supports atmospheric pressure degas, etch, and metal deposition processes essential for Fan-out Wafer Level Packaging (FOWLP) technology.
- Core Technologies: Evatec possesses a wide array of thin film deposition technologies including Sputtering, Evaporation, Plasma Enhanced Chemical Vapor Deposition (PECVD), and Plasma Enhanced Atomic Layer Deposition (PEALD). Its Advanced Process Control (APC) technologies integrate 'in situ' control of mechanical, optical, and electrical properties during the deposition cycle, enhancing precision and yield. The GSM 1102 Broadband Optical Monitoring System, in particular, accelerates thin film monitoring and process development in UV, VIS, and IR spectral ranges.Core Technologies: Evatec possesses a wide array of thin film deposition technologies including Sputtering, Evaporation, Plasma Enhanced Chemical Vapor Deposition (PECVD), and Plasma Enhanced Atomic Layer Deposition (PEALD). Its Advanced Process Control (APC) technologies integrate 'in situ' control of mechanical, optical, and electrical properties during the deposition cycle, enhancing precision and yield. The GSM 1102 Broadband Optical Monitoring System, in particular, accelerates thin film monitoring and process development in UV, VIS, and IR spectral ranges.
- Core Advantages
- Extensive Technology Portfolio: Offering a diverse range of deposition technologies (sputtering, evaporation, PECVD, PEALD) and etch capabilities on flexible system architectures (batch, cluster, inline) to meet varied customer requirements.Extensive Technology Portfolio: Offering a diverse range of deposition technologies (sputtering, evaporation, PECVD, PEALD) and etch capabilities on flexible system architectures (batch, cluster, inline) to meet varied customer requirements.
- Advanced Process Control (APC) Capabilities: Integration of sophisticated control technologies such as broadband optical monitoring, plasma emission monitoring, and optical pyrometry for real-time, precise control of film properties during deposition, maximizing yield.Advanced Process Control (APC) Capabilities: Integration of sophisticated control technologies such as broadband optical monitoring, plasma emission monitoring, and optical pyrometry for real-time, precise control of film properties during deposition, maximizing yield.
- Innovative R&D and Patent Portfolio: A team of highly skilled scientists and engineers holding over 400 patents, driving continuous technological innovation, including patents for piezoelectric coating and deposition processes and measuring devices for thin-film deposition systems.Innovative R&D and Patent Portfolio: A team of highly skilled scientists and engineers holding over 400 patents, driving continuous technological innovation, including patents for piezoelectric coating and deposition processes and measuring devices for thin-film deposition systems.
- Broad Market and Application Expertise: Providing tailored production solutions across a wide range of core markets including semiconductor, optoelectronics, MEMS, photonics, advanced packaging, power devices, wireless communication, precision optics, and functional coatings.Broad Market and Application Expertise: Providing tailored production solutions across a wide range of core markets including semiconductor, optoelectronics, MEMS, photonics, advanced packaging, power devices, wireless communication, precision optics, and functional coatings.
- Customer-Centric Global Support Network: Headquartered in Switzerland with over 150 sales and service professionals across 15 countries in Asia, Europe, and North America, ensuring comprehensive support and optimal manufacturing solutions for global customers.Customer-Centric Global Support Network: Headquartered in Switzerland with over 150 sales and service professionals across 15 countries in Asia, Europe, and North America, ensuring comprehensive support and optimal manufacturing solutions for global customers.
- High Throughput and Low Cost of Ownership: Platforms like CLUSTERLINE® and SOLARIS® are optimized for high-speed production and automated fab environments, achieving high throughput and low unit costs, providing economical mass production capabilities.High Throughput and Low Cost of Ownership: Platforms like CLUSTERLINE® and SOLARIS® are optimized for high-speed production and automated fab environments, achieving high throughput and low unit costs, providing economical mass production capabilities.
- Target Industries
- Semiconductor: Frontend and backside processes for advanced logic, RFCMOS, mixed-signal, and high-voltage applications, including 300mm wafer processing solutions.Semiconductor: Frontend and backside processes for advanced logic, RFCMOS, mixed-signal, and high-voltage applications, including 300mm wafer processing solutions.
- Advanced Packaging: 3D heterogeneous integration (3DHI), Fan-out Wafer Level Packaging (FOWLP), small panel packaging, and high-density substrate technologies.Advanced Packaging: 3D heterogeneous integration (3DHI), Fan-out Wafer Level Packaging (FOWLP), small panel packaging, and high-density substrate technologies.
- MEMS (Micro-Electro-Mechanical Systems): Deposition of metals, dielectrics, piezoelectric, and magnetic materials for sensors, actuators, TFH, and quantum computing.MEMS (Micro-Electro-Mechanical Systems): Deposition of metals, dielectrics, piezoelectric, and magnetic materials for sensors, actuators, TFH, and quantum computing.
- Optoelectronics: Deposition of ITO, mirrors, contacts, and passivation layers for LED, VCSEL, micro-displays, optical switches, and face recognition technology.Optoelectronics: Deposition of ITO, mirrors, contacts, and passivation layers for LED, VCSEL, micro-displays, optical switches, and face recognition technology.
- Photonics: Silicon photonics, photonic computing devices, laser coatings, and fiber optic communication components.Photonics: Silicon photonics, photonic computing devices, laser coatings, and fiber optic communication components.
- Power Devices: Thin film deposition for high-voltage and high-current applications such as IGBTs, MOSFETs, diodes, rectifiers, and thyristors.Power Devices: Thin film deposition for high-voltage and high-current applications such as IGBTs, MOSFETs, diodes, rectifiers, and thyristors.
- Wireless Communication: 5G, RF filters (AlScN piezoelectric materials), amplifiers, and GaN HEMTs.Wireless Communication: 5G, RF filters (AlScN piezoelectric materials), amplifiers, and GaN HEMTs.
- Precision Optics: Filters, anti-reflection coatings, high-reflective mirrors, and beam splitters for laser optics, infrared optics, and UV-VIS applications.Precision Optics: Filters, anti-reflection coatings, high-reflective mirrors, and beam splitters for laser optics, infrared optics, and UV-VIS applications.
- Functional Coatings: Scintillators for medical X-ray detectors, decorative finishes, and coatings for enhanced hardness and conductivity.Functional Coatings: Scintillators for medical X-ray detectors, decorative finishes, and coatings for enhanced hardness and conductivity.
- Automotive: Power chips for electric vehicles, autonomous driving sensor technologies, and HB LED lighting.Automotive: Power chips for electric vehicles, autonomous driving sensor technologies, and HB LED lighting.
- Consumer Electronics: Smartphones (face recognition, fingerprint scanners), wearable devices, and displays.Consumer Electronics: Smartphones (face recognition, fingerprint scanners), wearable devices, and displays.
- Major Markets
- South Korea, Taiwan (PlayNitride), China (Shenzhen office), India, Southeast AsiaSouth Korea, Taiwan (PlayNitride), China (Shenzhen office), India, Southeast Asia
- Switzerland (Headquarters), Germany (Optatec trade fair participation)Switzerland (Headquarters), Germany (Optatec trade fair participation)
- United States (SkyWater), Canada (C2MI)United States (SkyWater), Canada (C2MI)
- Certifications/Patents
- ISO 9001: Quality Management System certification, reaccredited until 2026.ISO 9001: Quality Management System certification, reaccredited until 2026.
- ISO 14001: Environmental Management System certification, reaccredited until 2026.ISO 14001: Environmental Management System certification, reaccredited until 2026.
- ISO 45001: Occupational Health and Safety Management System accreditation, gained on March 13, 2023.ISO 45001: Occupational Health and Safety Management System accreditation, gained on March 13, 2023.
- Portfolio of over 400 patents: Demonstrating extensive patent holdings in thin film deposition technology and continuous innovation capabilities.Portfolio of over 400 patents: Demonstrating extensive patent holdings in thin film deposition technology and continuous innovation capabilities.
- Patent No. 12426506: A patent for a measuring device and method for measuring parameters of a piezoelectric crystal onto which a thin film material is deposited.Patent No. 12426506: A patent for a measuring device and method for measuring parameters of a piezoelectric crystal onto which a thin film material is deposited.
- Patent No. 12389797: A patent for a piezoelectric coating (A-xMexN) and deposition process, including a transition layer where the atomic percentage ratio of metallic elements changes steadily with thickness.Patent No. 12389797: A patent for a piezoelectric coating (A-xMexN) and deposition process, including a transition layer where the atomic percentage ratio of metallic elements changes steadily with thickness.
Introduction
Location
Hauptstrasse 1A, 9477 Trübbach, Switzerland
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