Grooving & Dicing

- LMC3200G with DPSS laser removes the low-k and metal layer which lower the yield rate on the saw blade process.
  It improves the quality and productivity of the singulation process.

- LMC3200D is a system for thin wafer dicing.
  It is better than mechanical blade type; It doesn’t need to replace blade and reduces wafer chipping in the processing.