Information
66 Muryong 1-ro, Buk-gu, Ulsan, South Korea
+82 52-289-3500
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Overview
- Summary
- A specialized advanced materials company successfully localizing key bonding materials like solder balls, solder powder, and solder paste for semiconductor packaging, leading the global market. A company with unparalleled supply chain capabilities in micro solder balls, an ultra-precision material connecting semiconductor chips and substrates. Contributing to the development of the materials industry through continuous technological advancement and business diversification.A specialized advanced materials company successfully localizing key bonding materials like solder balls, solder powder, and solder paste for semiconductor packaging, leading the global market. A company with unparalleled supply chain capabilities in micro solder balls, an ultra-precision material connecting semiconductor chips and substrates. Contributing to the development of the materials industry through continuous technological advancement and business diversification.
- Key Products/Technologies
- Solder Ball: A core component in semiconductor packaging technologies such as BGA (Ball Grid Array), CSP (Chip Scale Package), and WLP (Wafer Level Package). Its role involves transmitting electrical signals by connecting chips and substrates. A product line with a diverse size range from 30㎛ to 760㎛.Solder Ball: A core component in semiconductor packaging technologies such as BGA (Ball Grid Array), CSP (Chip Scale Package), and WLP (Wafer Level Package). Its role involves transmitting electrical signals by connecting chips and substrates. A product line with a diverse size range from 30㎛ to 760㎛.
- Micro Solder Ball (MSB): An ultra-small, ultra-precision solder ball less than 130 micrometers (㎛) in size. A technology-intensive product essential for high-performance semiconductor packaging like FC-BGA (Flip-Chip Ball Grid Array) and HBM (High Bandwidth Memory) packaging.Micro Solder Ball (MSB): An ultra-small, ultra-precision solder ball less than 130 micrometers (㎛) in size. A technology-intensive product essential for high-performance semiconductor packaging like FC-BGA (Flip-Chip Ball Grid Array) and HBM (High Bandwidth Memory) packaging.
- Solder Paste: A cream-form bonding material made by mixing solder powder and flux. Product categories include surface mount paste for bonding substrates and devices and preventing oxidation, and bumping paste for forming solder bumps and pre-soldering as an alternative to solder balls. Currently developing fine-pitch paste for AI and mobile applications, and high-reliability paste for automotive use.Solder Paste: A cream-form bonding material made by mixing solder powder and flux. Product categories include surface mount paste for bonding substrates and devices and preventing oxidation, and bumping paste for forming solder bumps and pre-soldering as an alternative to solder balls. Currently developing fine-pitch paste for AI and mobile applications, and high-reliability paste for automotive use.
- Solder Powder: A primary component of solder paste, with mass production initiated in 2008.Solder Powder: A primary component of solder paste, with mass production initiated in 2008.
- Conductive Particle: One of the semiconductor and display materials produced, in addition to solder balls and solder paste.Conductive Particle: One of the semiconductor and display materials produced, in addition to solder balls and solder paste.
- Advanced Packaging Material Technology: Capabilities in developing future materials for 2.5D/3D advanced packaging and continuous R&D investment in this area.Advanced Packaging Material Technology: Capabilities in developing future materials for 2.5D/3D advanced packaging and continuous R&D investment in this area.
- Core Advantages
- Solder Ball Localization and Proprietary Technology: A technology-leading company that successfully localized solder balls, which were entirely reliant on imports, through its own patented technology for the first time in Korea. Core technology in solder ball manufacturing for semiconductor packaging, maintaining a fine and perfectly spherical shape.Solder Ball Localization and Proprietary Technology: A technology-leading company that successfully localized solder balls, which were entirely reliant on imports, through its own patented technology for the first time in Korea. Core technology in solder ball manufacturing for semiconductor packaging, maintaining a fine and perfectly spherical shape.
- Global Market Dominance: Securing a dominant global market share of approximately 70% in the micro solder ball market, ranking first worldwide. Also holding a competitive edge in the overall solder ball market, ranking second globally with a 25-30% share.Global Market Dominance: Securing a dominant global market share of approximately 70% in the micro solder ball market, ranking first worldwide. Also holding a competitive edge in the overall solder ball market, ranking second globally with a 25-30% share.
- Continuous R&D and Technological Innovation: Consistent R&D investment for next-generation material development since the establishment of its technology research institute in 2002. A technology-driven company investing an average of 10% of its revenue in R&D and holding over 400 patents.Continuous R&D and Technological Innovation: Consistent R&D investment for next-generation material development since the establishment of its technology research institute in 2002. A technology-driven company investing an average of 10% of its revenue in R&D and holding over 400 patents.
- Diversified Business Portfolio Expansion: Beyond its core business of solder balls and solder paste, expanding into navigation solutions through the acquisition of Duksan Nepcoas, a defense industry specialist. Securing capabilities in hydrogen storage containers through the acquisition of Duksan Ethercity, a large high-pressure container manufacturer.Diversified Business Portfolio Expansion: Beyond its core business of solder balls and solder paste, expanding into navigation solutions through the acquisition of Duksan Nepcoas, a defense industry specialist. Securing capabilities in hydrogen storage containers through the acquisition of Duksan Ethercity, a large high-pressure container manufacturer.
- Global Major Client Network: A stable supply chain secured by major global semiconductor and IT companies such as Samsung Electronics, SK Hynix, Samsung Display, Apple, Qualcomm, NVIDIA, Intel, Micron, and Broadcom as key clients.Global Major Client Network: A stable supply chain secured by major global semiconductor and IT companies such as Samsung Electronics, SK Hynix, Samsung Display, Apple, Qualcomm, NVIDIA, Intel, Micron, and Broadcom as key clients.
- Ultra-Precision Production Capacity and Quality Competitiveness: Ultra-precision production technology for micro solder balls less than 130 micrometers. Capability to actively respond to market demand through a twofold expansion of micro solder ball production capacity with the new factory in Ulsan headquarters.Ultra-Precision Production Capacity and Quality Competitiveness: Ultra-precision production technology for micro solder balls less than 130 micrometers. Capability to actively respond to market demand through a twofold expansion of micro solder ball production capacity with the new factory in Ulsan headquarters.
- Target Industrie
- Semiconductor packaging industry (BGA, CSP, WLP, Flip-Chip Bumping)Semiconductor packaging industry (BGA, CSP, WLP, Flip-Chip Bumping)
- Mobile devices and smartphonesMobile devices and smartphones
- AI servers and data centersAI servers and data centers
- Autonomous driving semiconductors (including HBM, DDR5 memory packaging)Autonomous driving semiconductors (including HBM, DDR5 memory packaging)
- Electric vehicles (development of high-reliability paste for automotive use)Electric vehicles (development of high-reliability paste for automotive use)
- Defense industry (navigation solutions through subsidiary Duksan Nepcoas)Defense industry (navigation solutions through subsidiary Duksan Nepcoas)
- Aerospace industry (satellite navigation system market pioneering through subsidiary Duksan Nepcoas)Aerospace industry (satellite navigation system market pioneering through subsidiary Duksan Nepcoas)
- Hydrogen energy industry (hydrogen storage containers through subsidiary Duksan Ethercity)Hydrogen energy industry (hydrogen storage containers through subsidiary Duksan Ethercity)
- HDD (Hard Disk Drive) recording head materialsHDD (Hard Disk Drive) recording head materials
- Major Markets
- South Korea (headquarters and main market), China (supplier to Samsung Electronics' Suzhou factory in China, establishment of China office), Japan (one of the leading countries in the global solder ball market, presence of competitor Senju Metal), Myanmar (tin raw material procurement through subsidiary DS MYANMAR)South Korea (headquarters and main market), China (supplier to Samsung Electronics' Suzhou factory in China, establishment of China office), Japan (one of the leading countries in the global solder ball market, presence of competitor Senju Metal), Myanmar (tin raw material procurement through subsidiary DS MYANMAR)
- Poland (supply of Chunmoo missile products through subsidiary Duksan Nepcoas)Poland (supply of Chunmoo missile products through subsidiary Duksan Nepcoas)
- United States (location of major clients such as Apple, Qualcomm, NVIDIA, Broadcom, Micron, Intel)United States (location of major clients such as Apple, Qualcomm, NVIDIA, Broadcom, Micron, Intel)
- Certifications/Patents
- Patents: Over 5 patents related to solder ball manufacturing equipment. Patent for 'Conductive particles coated with graphene and conductive materials including the same' (Registration No. 1017130150000). Patent for 'Method for manufacturing a transparent substrate including a graphene layer and transparent substrate manufactured thereby' (Registration No. 1018233670000). Acquisition of patent for lead-free solder alloy and manufacturing method. Technological competitiveness with over 400 patents.Patents: Over 5 patents related to solder ball manufacturing equipment. Patent for 'Conductive particles coated with graphene and conductive materials including the same' (Registration No. 1017130150000). Patent for 'Method for manufacturing a transparent substrate including a graphene layer and transparent substrate manufactured thereby' (Registration No. 1018233670000). Acquisition of patent for lead-free solder alloy and manufacturing method. Technological competitiveness with over 400 patents.
- Certifications and Awards: Venture company certification in 2000. Selected as an excellent venture company by the Federation of Korean Industries in 2002. ISO 14001:2004 Environmental Management System certification in 2005. Selected as a World-Class Product by the Ministry of Trade, Industry and Energy in 2005. Awarded the '50 Million Dollar Export Tower' on Trade Day in 2011. Selected as a World Class 300 company in 2012. IATF 16949 certification in 2018. ISO/TS 16949:2002 certification in 2009. OHSAS 18001:2007 certification in 2010. ISO 50001 Energy Management System certification in 2022. Awarded the 'Mid-sized Enterprise Growth Tower' by the Korea Federation of Mid-sized Enterprises in 2025. Certified as a 'Family-Friendly Company' by the Ministry of Gender Equality and Family in 2025.Certifications and Awards: Venture company certification in 2000. Selected as an excellent venture company by the Federation of Korean Industries in 2002. ISO 14001:2004 Environmental Management System certification in 2005. Selected as a World-Class Product by the Ministry of Trade, Industry and Energy in 2005. Awarded the '50 Million Dollar Export Tower' on Trade Day in 2011. Selected as a World Class 300 company in 2012. IATF 16949 certification in 2018. ISO/TS 16949:2002 certification in 2009. OHSAS 18001:2007 certification in 2010. ISO 50001 Energy Management System certification in 2022. Awarded the 'Mid-sized Enterprise Growth Tower' by the Korea Federation of Mid-sized Enterprises in 2025. Certified as a 'Family-Friendly Company' by the Ministry of Gender Equality and Family in 2025.
Introduction
Location
66 Muryong 1-ro, Buk-gu, Ulsan, South Korea
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