Information
2-chōme-13-11 Ōmorikita, Ota City, Tokyo 143-8580, Japan
+81 3-4590-1188
-
-
Overview
- Summary
- DISCO is a global leader in developing, manufacturing, and selling precision processing equipment and tools essential for semiconductor manufacturing, with core competencies in wafer cutting, grinding, and polishing technologies.DISCO is a global leader in developing, manufacturing, and selling precision processing equipment and tools essential for semiconductor manufacturing, with core competencies in wafer cutting, grinding, and polishing technologies.
- Key Products/Technologies
- Key product categories include precision processing equipment such as Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounters, Inspection Systems, Die Separators, Surface Planers, and WaterJet Saws.Key product categories include precision processing equipment such as Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounters, Inspection Systems, Die Separators, Surface Planers, and WaterJet Saws.
- Precision processing tools include consumables like Dicing Blades, Grinding Wheels, and Dry Polishing Wheels.Precision processing tools include consumables like Dicing Blades, Grinding Wheels, and Dry Polishing Wheels.
- Proprietary technologies encompass blade dicing for high-precision cutting of workpieces such as silicon, glass, and ceramics.Proprietary technologies encompass blade dicing for high-precision cutting of workpieces such as silicon, glass, and ceramics.
- Stealth dicing technology (DFL7340, DFL7341, DFL7361 models, etc.) involves focusing a laser inside the wafer to form a modified layer and perform chip separation.Stealth dicing technology (DFL7340, DFL7341, DFL7361 models, etc.) involves focusing a laser inside the wafer to form a modified layer and perform chip separation.
- Grinding technology for thinning and planarization of materials, and polishing technology for stress relief and mirrored surfaces.Grinding technology for thinning and planarization of materials, and polishing technology for stress relief and mirrored surfaces.
- DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) processes minimize backside chipping and wafer damage by performing half-cuts on wafers followed by back grinding for chip separation.DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) processes minimize backside chipping and wafer damage by performing half-cuts on wafers followed by back grinding for chip separation.
- Development and supply of AI-specific semiconductor laser cutting equipment with high-power lasers, crucial for High Bandwidth Memory (HBM) manufacturing.Development and supply of AI-specific semiconductor laser cutting equipment with high-power lasers, crucial for High Bandwidth Memory (HBM) manufacturing.
- Laser full-cut dicing technology for compound semiconductors like GaAs (Gallium Arsenide) and thin silicon wafers, enhancing cutting speed and chip yield.Laser full-cut dicing technology for compound semiconductors like GaAs (Gallium Arsenide) and thin silicon wafers, enhancing cutting speed and chip yield.
- Low-k grooving process to reduce the risk of delamination in mechanically weak materials like Low-k films.Low-k grooving process to reduce the risk of delamination in mechanically weak materials like Low-k films.
- The DFL7161 laser wafer cutting machine is suitable for processing various materials such as Si, GaAs, AlN, and Sapphire, utilizing a short-pulse laser with a 355nm wavelength to achieve street widths of 20µm or less.The DFL7161 laser wafer cutting machine is suitable for processing various materials such as Si, GaAs, AlN, and Sapphire, utilizing a short-pulse laser with a 355nm wavelength to achieve street widths of 20µm or less.
- Core Advantages
- Dominant market position with a 70-80% global market share in precision processing equipment and tools, particularly dicing saws.Dominant market position with a 70-80% global market share in precision processing equipment and tools, particularly dicing saws.
- Possession of unique technical expertise and know-how based on advanced 'Kiru (cutting), Kezuru (grinding), Migaku (polishing)' technologies.Possession of unique technical expertise and know-how based on advanced 'Kiru (cutting), Kezuru (grinding), Migaku (polishing)' technologies.
- Leading role in packaging equipment for AI semiconductors and high-performance memory manufacturing.Leading role in packaging equipment for AI semiconductors and high-performance memory manufacturing.
- Contribution to advanced device manufacturing through precise control technology for processing semiconductor wafers to be 'small, thin, and clean'.Contribution to advanced device manufacturing through precise control technology for processing semiconductor wafers to be 'small, thin, and clean'.
- Comprehensive customer service system, including test cutting support, paid processing services, customer support programs, and training services, to address various customer processing challenges.Comprehensive customer service system, including test cutting support, paid processing services, customer support programs, and training services, to address various customer processing challenges.
- Capability to integrate a wide range of engineering processes—mechanical, electrical, physics, chemical, and information processing—to produce high-value-added semiconductors.Capability to integrate a wide range of engineering processes—mechanical, electrical, physics, chemical, and information processing—to produce high-value-added semiconductors.
- Strong innovation capability, demonstrated by the development of AI-specific semiconductor laser cutting equipment that increases productivity by approximately 50% through continuous R&D investment.Strong innovation capability, demonstrated by the development of AI-specific semiconductor laser cutting equipment that increases productivity by approximately 50% through continuous R&D investment.
- Target Industries
- Semiconductor manufacturing processes (wafer dicing, grinding, polishing, packaging)Semiconductor manufacturing processes (wafer dicing, grinding, polishing, packaging)
- Manufacturing of advanced devices and electronic componentsManufacturing of advanced devices and electronic components
- Manufacturing of High Bandwidth Memory (HBM) and high-performance logic semiconductorsManufacturing of High Bandwidth Memory (HBM) and high-performance logic semiconductors
- Manufacturing of power semiconductors for electric vehicles (EVs)Manufacturing of power semiconductors for electric vehicles (EVs)
- High-brightness LED manufacturing (sapphire processing)High-brightness LED manufacturing (sapphire processing)
- MEMS (Micro-Electro-Mechanical Systems) processingMEMS (Micro-Electro-Mechanical Systems) processing
- Quantum computing research and development (R&D for circular hole processing and free-form high-precision processing)Quantum computing research and development (R&D for circular hole processing and free-form high-precision processing)
- Major Markets
- South Korea, Japan, India, China, TaiwanSouth Korea, Japan, India, China, Taiwan
- EuropeEurope
- North America (global market presence and customers like Intel)North America (global market presence and customers like Intel)
- Certifications/Patents
- Holds a portfolio of numerous patents related to precision processing equipment and servicesHolds a portfolio of numerous patents related to precision processing equipment and services
- Patent for 'Dividing method of wafer' (US Patent No. 12581889)Patent for 'Dividing method of wafer' (US Patent No. 12581889)
- Patent for 'Method of processing plate-shaped workpiece' (US Patent No. 12576462)Patent for 'Method of processing plate-shaped workpiece' (US Patent No. 12576462)
- Patents related to dressing boards for cutting bladesPatents related to dressing boards for cutting blades
- Alliance partner for Hamamatsu Photonics' stealth dicing technology patent portfolioAlliance partner for Hamamatsu Photonics' stealth dicing technology patent portfolio
- ISO9001 and ISO14001 certifications obtainedISO9001 and ISO14001 certifications obtained
- Ranked 9th in 'Best Workplaces in Asia 2025'Ranked 9th in 'Best Workplaces in Asia 2025'
Introduction
Location
2-chōme-13-11 Ōmorikita, Ota City, Tokyo 143-8580, Japan
클릭하여 위치 살펴보기
